Sun Microsystems 6.0005E+11 manual Memory Modules, Power Supplies

C

4.The order of filling CPU slots is not critical. However, to optimize heat dissipation in the system:

•Fill all “PROC 0” locations on all CPU/Memory boards before filling any “PROC 1” locations. To receive the maximum quantity of diagnostic information, fill “PROC 0” on board 0.

•After all “PROC 0” locations are filled, you can begin filling the “PROC 1” locations, again starting from the lowest slot number to the highest.

Table C-1 shows slot locations for an example of five CPUs on three

CPU/Memory boards.

Table C-1Example of CPU Placement

Slot Number	“PROC 0”	“PROC 1”
0	in	in
2	in	in
4	in	—

C.4 Memory Modules

1.The SIMMs are 168-pin, JEDEC-standard devices. Do not use other types of memory modules.

2.All SIMMs in a bank (eight SIMMs) must have the same capacity. Do not mix 8, 32, or 128 Mbyte SIMMs in the same bank. (Requirement)

3.All SIMMs in a bank should have the same speed rating. If SIMMs of different speeds are mixed in a bank, the bank will function, but at the lowest speed.

C.5 Power Supplies

Only the peripheral power supply provides precharge current to the system. The peripheral power supply must be fully functional if you replace a hot- pluggable board or PCM. If the peripheral power supply cannot supply precharge current, the hot-pluggable unit will be damaged. (Requirement)

C-4 Ultra Enterprise 6000/5000/4000 Systems Manual—November 1996