Texas Instruments SM320C6455-EP Device Characteristics, Characteristics of the C6455 Processor

SM320C6455-EP

FIXED-POINT DIGITAL SIGNAL PROCESSOR

www.ti.com

SPRS462B – SEPTEMBER 2007 – REVISED JANUARY 2008

2 Device Overview

2.1Device Characteristics

Table 2-1, provides an overview of the C6455 DSP. The tables show significant features of the C6455 device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.

Table 2-1. Characteristics of the C6455 Processor

Peripherals

Not all peripherals pins are available at the same time (For more detail, see the Device Configuration section).

Decoder Coprocessors

On-Chip Memory

C64x+ Megamodule Revision ID

JTAG BSDL_ID

Frequency

Cycle Time

Voltage

PLL1 and PLL1

Controller Options

PLL2

BGA Package

HARDWARE FEATURES

EMIFA (64 bit bus width)

(clock source = AECLKIN or SYSCLK4)

DDR2 Memory Controller (32 bit bus width) [1.8 V I/O] (clock source = CLKIN2)

EDMA3 (64 independent channels) [CPU/3 clock rate]

High-speed 1x/4x Serial Rapid IO Port

I2C

HPI (32- or 16 bit user selectable)

PCI (32 bit), [66-MHz or 33-MHz]

McBSPs (internal CPU/6 or external clock source up to 100 Mbps)

UTOPIA (8 bit mode, 50-MHz, Slave-only)

10/100/1000 Ethernet MAC (EMAC)

Management Data Input/Output (MDIO)

64 Bit Timers (Configurable)

(internal clock source = CPU/6 clock frequency)

General-Purpose Input/Output Port (GPIO)

VCP2 (clock source = CPU/3 clock frequency)

TCP2 (clock source = CPU/3 clock frequency)

Size (Bytes)

Organization

Megamodule Revision ID Register (address location: 0181 2000h)

JTAGID register (address location: 0x02A80008)

MHz

ns

Core (V)

I/O (V)

CLKIN1 frequency multiplier

CLKIN2 frequency multiplier

[DDR2 Memory Controller and EMAC support only]

24 x 24 mm

C6455

1

1

1

1

1

1 (HPI16 or HPI32)

1 (PCI66 or PCI33)

2

1

1

1

2 64 bit or 4 32 bit

16

1

1

2192K

32K-Byte (32KB) L1 Program Memory Controller

[SRAM/Cache]

32KB Data Memory Controller [SRAM/Cache]

2096KB L2 Unified Memory/Cache

32KB L2 ROM

See Section 5.6, Megamodule Revision

See Section 3.6, JTAG ID (JTAGID) Register

Description

720, 850, 1000 (1 GHz), and 1200 (1.2 GHz)

1.39ns (C6455-720), 1.17 ns (C6455-850),

1ns (C6455 A-1000, -1000) [1-GHz CPU](1)

0.83ns (C6455-1200) [1.2-GHz CPU]

1.25V (A-1000/-1000/-1200)

1.2V (-850/-720)

1.25/1.2 [RapidIO],

1.5/1.8 [EMAC RGMII], and

1.8and 3.3 V [I/O Supply Voltage] Bypass (x1), x15, x20, x25, x30, x32

x20

697-Pin Flip-Chip Plastic BGA (ZTZ)

697-Pin Flip-Chip Plastic BGA (GTZ)

(1)The extended temperature device's (A-1000) electrical characteristics and ac timings are the same as those for the corresponding commercial temperature devices (-1000).

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