SM320C6455-EP

FIXED-POINT DIGITAL SIGNAL PROCESSOR

www.ti.com

SPRS462B – SEPTEMBER 2007 – REVISED JANUARY 2008

8 Mechanical Data

8.1Thermal Data

Table 8-1shows the thermal resistance characteristics for the PBGA - ZTZ/GTZ mechanical package.

Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [ZTZ/GTZ]

NO.

 

 

°C/W

AIR FLOW

 

 

(m/s(1))

1

JC

Junction-to-case

1.45

N/A

2

JB

Junction-to-board

8.34

N/A

3

 

 

16.1

0.00

4

JA

Junction-to-free air

13.0

1.0

5

11.9

2.0

 

 

6

 

 

10.7

3.0

 

 

 

0.37

0.00

7

PsiJT

Junction-to-package top

0.89

1.0

1.01

1.5

 

 

 

 

 

 

1.17

3.00

 

 

 

7.6

0.00

8

PsiJB

Junction-to-board

6.7

1.0

6.4

1.5

 

 

 

 

 

 

5.8

3.00

(1)m/s = meters per second

8.2Packaging Information

The following packaging information reflects the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document.

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Mechanical Data

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Texas Instruments SM320C6455-EP manual Thermal Data, Packaging Information, AIR Flow