Freescale Semiconductor MC9S12XDP512 T able A-5. Thermal P ackage Characteristics

Appendix A Electrical Characteristics
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor 925
Table A-5. Thermal Package Characteristics1
1The values for thermal resistance are achieved by package simulations
Num C Rating Symbol Min Typ Max Unit
LQFP144
1 T Thermal resistance LQFP144, single sided PCB2θJA ——41°C/W
2 T Thermal resistance LQFP144, double sided PCB
with 2 internal planes3θJA ——32°C/W
3 Junction to Board LQFP 144 θJB ——22°C/W
4 Junction to Case LQFP 1444θJC — — 7.4 °C/W
5 Junction to Package Top LQFP1445ΨJT —— 3°C/W
LQFP112
6 T Thermal resistance LQFP112, single sided PCB2
2Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-2 in a
horizontal configuration in natural convection.
θJA ——43°C/W
7 T Thermal resistance LQFP112, double sided PCB
with 2 internal planes3
3Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-7 in a
horizontal configuration in natural convection.
θJA ——32°C/W
8 Junction to Board LQFP112 θJB ——22°C/W
9 Junction to Case LQFP1124θJC —— 7°C/W
10 Junction to Package Top LQFP1125ΨJT —— 3°C/W
QFP80
11 T Thermal resistance QFP 80, single sided PCB2θJA ——45°C/W
12 T Thermal resistance QFP 80, double sided PCB
with 2 internal planes3θJA ——33°C/W
13 T Junction to Board QFP 80 θJB ——19°C/W
14 T Junction to Case QFP 804
4Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by
MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package
is being used with a heat sink.
θJC ——11°C/W
15 T Junction to Package Top QFP 805
5Thermal characterization parameter ΨJT is the “resistance” from junction to reference point thermocouple on top center of the
case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction temperature in a steady state customer
enviroment.
ΨJT —— 3°C/W