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| ELECTRICAL DIAGRAMS |
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PC BOARD |
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| ITEM | REQ'D | PART No. | DESCRIPTION | R1,R2,R3,R4,R5,R6 | 6 | RESISTOR,SMD,METAL FILM,1/10W,12.1K,1%,S0805 | |
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| 1 | 1 | SPI REMOTE/UI PC BOARD BLANK | |||||
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| V | R7 | 1 | RESISTOR,SMD,METAL FILM,1/10W,267OHMS,1%,S0805 | |||||
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| 2 | 1 | POTTING TRAY | ||||||
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| R8,R9,R10,R11,R12 | 5 | RESISTOR,SMD,1W,243OHMS,1% | ||||||
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| 3 | 2 | SELF TAPPING SCREW | ||||||
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| R13,R14,R15,R16,R17 | 5 | THERMISTOR,PTC,500OHMS,28mA | |||||
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| 4 | 1 | FLEX CIRCUIT ASSEMBLY | |||||
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| R18,R19 | 2 | RESISTOR,SMD,METAL FILM,1/10W,332OHMS,1%,S0805 | |||||
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| 5 | 4.00 fl oz | E2527 | EPOXY ENCAPSULATING RESIN | ||||
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| R20,R21,R25,R26,R27,R28 | 8 | RESISTOR,SMD,METAL FILM,1/10W,4.75K,1%,S0805 | |||||
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| 6 | .108 fl oz | E3539 | ELECTRICAL INSULATING COMPOUND | ||||
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| R29,R30 |
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| N.B. 7 | 1 | SOFTWARE CPLD (X3) |
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| R22,R23,R24,R36,R37,R45 | 10 | RESISTOR,SMD,METAL FILM,1/10W,10.0K,1%,S0805 | |||||
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| N.C. 8 | 1 | SOFTWARE CPLD (X4) | |||||
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| R46,R47,R48,R49 |
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| N.D. 9 | 1 |
| PROGRAM X2 to 250K Hz |
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| R31,R32 | 2 | RESISTOR,SMD,METAL FILM,1/10W,221OHMS,1%,S0805 | ||||
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| N.K. 10 | 1 | S24671 | KEYING PLUG | ||||
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| R33 | 1 | RESISTOR,SMD,METAL FILM,1/10W,100OHMS,1%,S0805 | |||||
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| FOR ITEMS BELOW, REFER TO ELECTRONIC COMPONENTS DATABASE FOR COMPONENT SPECIFICATIONS | |||||||
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| R34,R35 | 2 | RESISTOR,SMD,PREC,MF,1/10W,10.0K,0.5%,S0805 | |||||
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| C1,C2,C3,C4,C5,C6,C7,C8,C9 | 44 | CAPACITOR,SMD,CERAMIC,0.1MF,50V,10%,X7R,S0805 | |||||
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| R50,R51,R52,R53,R54,R55 | 12 | RESISTOR,SMD,PREC,MF,1/10W,4.75K,0.5%,S0805 | |||||
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| C10,C11,C12,C13,C14,C15 |
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| C16,C17,C18,C19,C20,C21 |
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| R56,R57,R58,R59,R60,R61 |
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| C22,C23,C24,C25,C26,C27 |
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| R62,R63,R64,R65,R66,R67 | 8 | RESISTOR,SMD,1.21K,1/4W,1206,1%,TR | |
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| C28,C29,C30,C31,C32,C33 |
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| R71,R72 |
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| C34,C35,C36,C37,C48,C49 |
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| R68,R69,R70 | 3 | RESISTOR,SMD,METAL FILM,1/10W,2.67K,1%,S0805 | |
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| C50,C54,C55,C56,C57 |
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| R74 | 1 | RESISTOR,SMD,1K,1/4W,1206,1%,TR | |
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| C38,C39 | 2 | CAPACITOR,SMD,CERAMIC,2700pF,50V,5%,X7R,S0805 | R75,R76,R77,R78 | 4 | RESISTOR,SMD,100OHMS,1/4W,1206,1%,TR | ||
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| C40 | 1 | CAPACITOR,ALEL,120MF,50V,20% | R79,R80 | 2 | RESISTOR,SMD,METAL FILM,1/10W,2.21K,1%,S0805 | ||
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| C41 | 1 | CAPACITOR,SMD,CERAMIC,0.27MF,50V,10%,X7R,S1812 | R81,R82 | 2 | RESISTOR,SMD,121K,1/4W,1206,1%,TR | ||
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| C42 | 1 | CAPACITOR,ALEL,1000,35V,20% | R83,R84,R85,R86 | 4 | RESISTOR,SMD,METAL FILM,1/10W,3.32K,1%,S0805 | ||
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| C43 | 1 | CAPACITOR,SMD,TANTALUM,22MF,25V,10%,S7343 | R87,R88,R89,R90 | 4 | RESISTOR,SMD,MF,1W,20.0K,1%,SURGE | ||
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| C44,C45,C46 | 3 | CAPACITOR,SMD,TANTALUM,1.0MF,35V,10%,S3528 | |||||
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| R91,R92 | 2 | RESISTOR,SMD,METAL FILM,1/10W,47.5K,1%,S0805 | |||||
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| C47,C51,C52,C53 | 4 | CAPACITOR,SMD,TANTALUM,2.2MF,20V,10%,S3528 | |||||
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| R93,R94 | 2 | RESISTOR,SMD,METAL FILM,1/10W,2.00K,1%,S0805 | |||||
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| N.F. |
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| C58,C59,C60,C61,C62 | 5 | CAPACITOR,SMD,CERAMIC,0.022MF,50V,10%,X7R,S0805 | |||||
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| R95 | 1 | RESISTOR,SMD,METAL FILM,1/10W,3.74K,1%,S0805 | ||||||
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| D1,D2,D3,D4,D5,D6,D7,D8 | 8 | ||||||
2 | 1 | N.G. | 3 |
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| R96 | 1 | RESISTOR,SMD,METAL FILM,1/10W,3.01K,1%,S0805 | |||||
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| D9,D10,D11 | 3 | DIODE,SMD,1A,400V,FAST | |||||||||
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| D12,D13,D14,D15 | 4 | R97 | 1 | RESISTOR,SMD,METAL FILM,1/10W,26.7K,1%,S0805 | |||
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| N.E. |
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| D16,D17 | 2 | DIODE,SMD,DUAL,0.200A,70V,UFR | R98,R99 | 2 | RESISTOR,SMD,METAL FILM,1/10W,20.0K,1%,S0805 | ||
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| 6.14 |
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| D18,D19 | 2 | DIODE,SMD,DUAL,0.200A,70V,UFR | R100,R101,R102 | 3 | RESISTOR,SMD,METAL FILM,1/10W,1.00K,1%,S0805 | ||
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| D20 | 1 | DIODE,SMD,1A,30V,SMA,SCHOTTKY | R103,R104,R105,R106,R107 | 6 | RESISTOR,SMD,METAL FILM,1/10W,56.2K,1%,S0805 | ||
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| DZ1,DZ2 | 2 | ZENER DIODE,SMD,3W,5.1V,5%, SMB | R108 |
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| DZ3,DZ4,DZ5,DZ6,DZ7,DZ8 | 6 | ZENER DIODE,SMD,3W,12V,5%, SMB | N.A. X1 | 1 | IC,SMD,CMOS,INVERTER,SCHMITT,HEX,HC14A(SS) | ||
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| DZ9,DZ10 | 2 | N.A. X2 | 1 | IC,SMD,CMOS,OSCILLATOR,DIVIDER,60MHZ,SOIC8,(SS) | |||
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| FTP1,FTP2,FTP3,FTP4,FTP5 | 6 | TESTPT_FUNTION FUNCTIONAL TEST POINT | N.A. X3 | 1 | |||
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| REMOTE |
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| FTP6 |
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| N.A. X4 | 1 | IC,SMD,CMOS,CPLD,XC9572,PLCC44(SS) | |
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| J33 | 1 | N.A. X5 | 1 | ||||
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| J331 | 1 | |||||||
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| X6,X7,X8 | 3 | ||||||
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| J332,J333 | 2 | ||||||
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| N.A. X9 | 1 | IC,SMD,CMOS,SWITCH,ANALOG,QUAD,201(SS) | |||||
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| L1 | 1 | CHOKE,SMD,POWER,47UH,10%,1.25A, | |||||
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| X10 | 1 | IC,SMD,VOLTAGE REF,ADJ, | |||||
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| Q1,Q2,Q3,Q4 | 4 | ||||||
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| N.A. X11 | 1 | IC,SMD,CMOS,DRIVER,MOSFET,4451, | |||||
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| N.A. Q5,Q6 | 2 | ||||||
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| X12 | 1 | IC,SMD,VOLTAGE | |||||
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| 3.64 |
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| Q7,Q8 | 2 | TRANSISTOR,SMS,PNP,SOT23,0.5A, 40V,MMBT4403LT1 | |||||
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| N.A. Q9 | 1 | X13 | 1 | IC,ARRAY,DRIVER,PERIPHERAL,NPN,DARLINGTON | |||
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| P.C. BOARD BLANK REFERENCE INFORMATION |
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| BUY COMPLETE AS |
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| UNLESS OTHERWISE SPECIFIED: |
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| CAPACITANCE = MFD/VOLTS |
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N.E. |
| N.H. |
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| INDUCTANCE | = HENRIES |
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| RESISTANCE | = OHMS |
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| N.E. |
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| 4 |
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| NOTES: |
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| N.A. CAUTION: THIS DEVICE IS SUBJECT TO DAMAGE BY STATIC ELECTRICITY. SEE E2454 |
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| BEFORE HANDLING. |
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| N.B. PROGRAM X3 WITH ITEM 7. |
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| N.C. PROGRAM X4 WITH ITEM 8. |
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| N.D. PROGRAM X2 WITH ITEM 9. |
| SCHEM ATIC REFERENCE: |
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| N.E. ALL CONNECTORS MUST BE GREASED WITH ITEM 6 PRIOR TO ENCAPSULATION. |
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| N.F. ATTACH ITEM 1 TO ITEM 2 WITH ITEM 3. TIGHTEN ITEM 3 TO .60 .05 Nm (5.3 .5 | BUY AS: |
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| N.G. PLACE BARCODED ASSEMBLY NUMBER IDENTIFICATION AND BARCODED SERIAL |
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| IDENTIFICATION IN AREA SHOWN. |
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| N.H. THESE COMPONENTS MUST BE COMPLETELY COVERED WITH ITEM 5. | G 4 0 1 8 - | 1 C | 0 |
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| N.K PLACE ITEM 10 ON PIN 8 OF J332 AS SHOWN. | PART NUMBER | IDENTIFICATION CODE |
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| N.L. BOARD TO BE POTTED WITH ITEM 4 LAYING ACROSS BOARD AS SHOWN. |
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| ONLY 0.4" OR LESS OF ITEM 4 TO BE COVERED WITH ITEM 5. |
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| BUY PER E3867 |
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| TEST PER |
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| THIS SHEET CONTAINS PROPRIETARY INFORMATION OWNED BY THE LINCOLN ELECTRIC COMPANY AND IS NOT TO BE REPRODUCED, DISCLOSED OR USED WITHOUT THE EXPRESS WRITTEN PERMISSION OF THE LINCOLN ELECTRIC COMPANY, CLEVELAND, OHIO U.S.A. |
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| UNLESS OTHERWISE SPECIFIED TOLERANCE | "X" INFO. | Chg. Sheet No. |
| DESIGN INFORMATION | REFERENCE: | EQUIPMENT TYPE: | MISCELLANEOUS |
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| MANUFACTURING TOLERANCE PER E2056 |
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| SOLIDEDGE |
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| ON 2 PLACE DECIMALS IS ± .02 |
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| DRAWN BY: | F.V. |
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| ON 3 PLACE DECIMALS IS ± .002 |
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| SUBJECT: | SPI REMOTE/UI P.C. BOARD ASSEMBLY | ||||
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| ON ALL ANGLES IS ± .5 OF A DEGREE |
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| ENGINEER: | Ed Furman |
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| MATERIAL TOLERANCE ("t") TO AGREE |
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| SUPERSEDING: |
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| DO NOT SCALE THIS DRAWING |
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| APPROVED: |
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| SCALE:FULL | |||
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| WITH PUBLISHED STANDARDS. |
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NOTE: Lincoln Electric assumes no responsibility for liablilities resulting from board level troubleshooting. PC Board repairs will invalidate your factory warranty. Individual Printed Circuit Board Components are not available from Lincoln Electric. This information is pro- vided for reference only. Lincoln Electric discourages board level troubleshooting and repair since it may compromise the quality of the design and may result in danger to the Machine Operator or Technician. Improper PC board repairs could result in damage to the machine.