Intel 8XC196MH, 8XC196MD, 8XC196MC manual Applying and Removing Power, Noise Protection Tips

8XC196MC, MD, MH USER’S MANUAL

13.2 APPLYING AND REMOVING POWER

When power is first applied to the device, RESET# must remain continuously low for at least one state time after the power supply is within tolerance and the oscillator/clock has stabilized; oth- erwise, operation might be unpredictable. Similarly, when powering down a system, RESET# should be brought low before VCC is removed; otherwise, an inadvertent write to an external lo- cation might occur. Carefully evaluate the possible effect of power-up and power-down sequenc- es on a system.

13.3 NOISE PROTECTION TIPS

The fast rise and fall times of high-speed CMOS logic often produce noise spikes on the power supply lines and outputs. To minimize noise, it is important to follow good design and board lay- out techniques. We recommend liberal use of decoupling capacitors and transient absorbers. Add

0.01µF bypass capacitors between V CC and each VSS pin and a 1.0 µF capacitor between V REF and ANGND to reduce noise (Figure 13-2). Place the capacitors as close to the device as possible. Use the shortest possible path to connect VSS lines to ground and each other.

				VREF	+
				+	VREF
		8XC196 Device			–
				1.0 µF
CC	SS	SS	SS	ANGND
V	V	V	V
	†				Analog
		†		Digital	Ground
					Plane
		†		Ground
				Plane
+5 V			5 V
			Return
Power Source

†Use 0.01 µF bypass capacitors for maximum decoupling.

A0272-02

Figure 13-2. Power and Return Connections

13-4