Intel E5-4600, CM8062101038606, E5-2600, E5-1600 manual Package Thermal Specifications

Thermal Management Specifications

5Thermal Management Specifications

5.1Package Thermal Specifications

The processor requires a thermal solution to maintain temperatures within operating limits. Any attempt to operate the processor outside these limits may result in permanent damage to the processor and potentially other components within the system, see Section 7.7.1, “Storage Conditions Specifications”. Maintaining the proper thermal environment is key to reliable, long-term system operation.

A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For more information on designing a component level thermal solution, refer to the Intel®

Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide.

5.1.1Thermal Specifications

To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the minimum and maximum case temperature (TCASE) specifications as defined by the applicable thermal profile. Thermal solutions not designed to provide sufficient thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, please refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/ Mechanical Design Guide.

The processors implement a methodology for managing processor temperatures which is intended to support acoustic noise reduction through fan speed control and to assure processor reliability. Selection of the appropriate fan speed is based on the relative temperature data reported by the processor’s Platform Environment Control Interface (PECI) as described in Section 2.5, “Platform Environment Control Interface (PECI)”.

If the DTS value is less than TCONTROL, then the case temperature is permitted to exceed the Thermal Profile, but the DTS value must remain at or below TCONTROL.

For TCASE implementations, if DTS is greater than TCONTROL, then the case temperature must meet the TCASE based Thermal Profiles.

For DTS implementations:

•TCASE thermal profile can be ignored during processor run time.

•If DTS is greater than Tcontrol then follow DTS thermal profile specifications for fan speed optimization.

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families	101
Datasheet Volume One