Intel E5-2600 manual Processor Current Specifications, Parameter Symbol Processor TDP / Core Count

Electrical Specifications

16.VCCD tolerance at processor pins. Tolerance for VR at remote sense is ±3.3%*VCCD.

17.The VCCPLL, VCCD01, VCCD23 voltage specification requirements are measured across vias on the platform. Choose VCCPLL,

VCCD01, or VCCD23 vias close to the socket and measure with a DC to 100 MHz bandwidth oscilloscope limit (or DC to 20 MHz for older model oscilloscopes), using 1.5 pF maximum probe capacitance, and 1MΩ minimum impedance. The maximum length of the ground wire on the probe should be less than 5 mm to ensure external noise from the system is not coupled in the scope probe.

18.VCC has a Vboot setting of 0.0 V and is not included in the PWRGOOD indication. Refer to the VR12/IMVP7 Pulse Width Modulation Specification.

19.VSA has a Vboot setting of 0.9 V. Refer to the VR12/IMVP7 Pulse Width Modulation Specification.

Table 7-12. Processor Current Specifications

Parameter Symbol and	Processor TDP / Core Count	TDC (A)	Max (A)	Notes1
Definition
ITT		20	24	2, 3, 5, 6
I/O Termination Supply,
Processor Current on VTTA/VTTD
ISA		20	24
System Agent Supply, Processor
Current on VSA
ICCD_01		3	4
DDR3 Supply, Processor Current
VCCD_01
ICCD_23	All Intel® Xeon® processor E5-1600/E5-	3	4
DDR3 Supply, Processor Current	2600/E5-4600 product families
VCCD_23
ICCPLL		2	2
PLL Supply, Processor Current on
VCCPLL
ICCD_01_S3		--	1	4
ICCD_23_S3
DDR3 Supply, Processor Current
on VCCD_01/VCCD_23
in System S3 Standby State
	8-core/6-core
	150 W 8-core	155	185	2, 5, 6
	135 W 8-core
	130 W 6-core, 6-core 1S WS and 8-core	135	165
	115 W 8-core
ICC
	95 W 6-core, 8-core and LV95W-8C	115	135
Core Supply, Processor
	70 W 8-core and LV70W-8C	80	100
Current on VCC
	60 W 6-core	70	85
	4-core/2-core
	130 W 4-core and 4-core 1S WS	115	150	2, 5, 6
	95 W 4-core	115	135
	80 W 2-core and 4-core	80	100

Notes:

1.Unless otherwise noted, all specifications in this table apply to all processors. These specifications are based on final silicon characterization.

2.Launch to FMB, this is the flexible motherboard guidelines. See Section 7.6 for FMB details.

3.ICC_TDC (Thermal Design Current) is the sustained (DC equivalent) current that the processor is capable of drawing indefinitely and should be used for the voltage regulator thermal assessment. The voltage regulator is responsible for monitoring its temperature and asserting the necessary signal to inform the processor of a thermal excursion. Please refer to the VR12/IMVP7 Pulse Width Modulation Specification for further details.

4.Specification is at TCASE = 50°C. Characterized by design (not tested).

5.ICCD_01_MAX and ICCD_23_MAX refers only to the processor’s current draw and does not account for the current consumption by the memory devices.

6.Minimum VCC and maximum ICC are specified at the maximum processor case temperature (TCASE) shown in Section 5, “Thermal Management Specifications”. ICC_MAX is specified at the relative VCC_MAX point on the VCC load line. The processor is

170	Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
	Datasheet Volume One