Intel CM8062101038606, E5-1600, E5-2600, E5-4600 manual 10

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families 243
Datasheet Volume One
Boxed Processor Specifications
10 Boxed Processor Specifications
10.1 Introduction
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Intel® Xeon® processor E5-
2600 product family (LGA2011-0 land FCLGA10) processors will be offered as Intel
boxed processors, however the thermal solutions will be sold separately.
Boxed processors will not include a thermal solution in the box. Intel will offer boxed
thermal solutions separately through the same distribution channels. Please reference
Section 10.1.1 - Section 10.1.3 for a description of Boxed Processor thermal solutions.
10.1.1 Available Boxed Thermal Solution Configurations
Intel will offer three different Boxed Heat Sink solutions to support LGA2011-0 land
FCLGA10 Boxed Processors
• Boxed Intel® Thermal Solution STS200C (Order Code BXSTS200C): A Passive /
Active Combination Heat Sink Solution that is intended for processors with a TDP
up to 150W in a pedestal or 130W in 2U+ chassis with appropriate ducting.
• Boxed Intel® Thermal Solution STS200P (Order Code BXSTS200P): A 25.5 mm Tall
Passive Heat Sink Solution that is intended for processors with a TDP of 130W or
lower in 1U, or 2U chassis with appropriate ducting. Check with Blade manufacturer
for compatibility.
• Boxed Intel® Thermal Solution STS200PNRW (Order Code BXSTS200PNRW): A
25.5 mm Tall Passive Heat Sink Solution that is intended for processors with a TDP
of 130W or lower in 1U, or 2U chassis with appropriate ducting. Compatible with
the narrow processor integrated load mechanism. Check with Blade manufacturer
for compatibility.
10.1.2 Intel Thermal Solution STS200C
(Passive/Active Combination Heat Sink Solution)
The STS200C, based on a 2U passive heat sink with a removable fan, is intended for
use with processors with TDP’s up to 150W in active configuration and 130W in passive
configuration. This heat pipe-based solution is intended to be used as either a passive
heat sink in a 2U or larger chassis, or as an active heat sink for pedestal chassis.
Figure 10-1 and Figure 10-2 are representations of the heat sink solution. Although the
active combination solution with the removable fan installed mechanically fits into a 2U
keepout, its use has not been validated in that configuration.
The STS200C in the active fan configuration is primarily designed to be used in a
pedestal chassis where sufficient air inlet space is present. The STS200C with the fan
removed, as with any passive thermal solution, will require the use of chassis ducting
and are targeted for use in rack mount or ducted pedestal servers. The retention
solution used for these products is called ILM Retention System (ILM-RS).