Intel E5-1600 Boxed Processor Specifications, Available Boxed Thermal Solution Configurations

Boxed Processor Specifications

10Boxed Processor Specifications

10.1Introduction

Intel boxed processors are intended for system integrators who build systems from components available through distribution channels. The Intel® Xeon® processor E5- 2600 product family (LGA2011-0 land FCLGA10) processors will be offered as Intel boxed processors, however the thermal solutions will be sold separately.

Boxed processors will not include a thermal solution in the box. Intel will offer boxed thermal solutions separately through the same distribution channels. Please reference Section 10.1.1 - Section 10.1.3 for a description of Boxed Processor thermal solutions.

10.1.1Available Boxed Thermal Solution Configurations

Intel will offer three different Boxed Heat Sink solutions to support LGA2011-0 land FCLGA10 Boxed Processors

•Boxed Intel® Thermal Solution STS200C (Order Code BXSTS200C): A Passive / Active Combination Heat Sink Solution that is intended for processors with a TDP up to 150W in a pedestal or 130W in 2U+ chassis with appropriate ducting.

•Boxed Intel® Thermal Solution STS200P (Order Code BXSTS200P): A 25.5 mm Tall Passive Heat Sink Solution that is intended for processors with a TDP of 130W or lower in 1U, or 2U chassis with appropriate ducting. Check with Blade manufacturer for compatibility.

•Boxed Intel® Thermal Solution STS200PNRW (Order Code BXSTS200PNRW): A 25.5 mm Tall Passive Heat Sink Solution that is intended for processors with a TDP of 130W or lower in 1U, or 2U chassis with appropriate ducting. Compatible with the narrow processor integrated load mechanism. Check with Blade manufacturer for compatibility.

10.1.2Intel Thermal Solution STS200C

(Passive/Active Combination Heat Sink Solution)

The STS200C, based on a 2U passive heat sink with a removable fan, is intended for use with processors with TDP’s up to 150W in active configuration and 130W in passive configuration. This heat pipe-based solution is intended to be used as either a passive heat sink in a 2U or larger chassis, or as an active heat sink for pedestal chassis. Figure 10-1and Figure 10-2are representations of the heat sink solution. Although the active combination solution with the removable fan installed mechanically fits into a 2U keepout, its use has not been validated in that configuration.

The STS200C in the active fan configuration is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present. The STS200C with the fan removed, as with any passive thermal solution, will require the use of chassis ducting and are targeted for use in rack mount or ducted pedestal servers. The retention solution used for these products is called ILM Retention System (ILM-RS).

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families	243
Datasheet Volume One