Intel E5-4600, CM8062101038606, E5-2600, E5-1600 manual Mechanical Specifications 245 10.2.1

7	Electrical Specifications			151
	7.1	Processor Signaling		151
		7.1.1	System Memory Interface Signal Groups	151
		7.1.2	PCI Express* Signals	151
		7.1.3	DMI2/PCI Express* Signals	151
		7.1.4	Intel QuickPath Interconnect (Intel QPI)	151
		7.1.5	Platform Environmental Control Interface (PECI)	152
		7.1.6	System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)	152
		7.1.7	JTAG and Test Access Port (TAP) Signals	153
		7.1.8	Processor Sideband Signals	153
		7.1.9	Power, Ground and Sense Signals	153
		7.1.10	Reserved or Unused Signals	158
	7.2	Signal Group Summary		158
	7.3	Power-On Configuration (POC) Options		162
	7.4	Fault Resilient Booting (FRB)		163
	7.5	Mixing Processors		163
	7.6	Flexible Motherboard Guidelines (FMB)		164
	7.7	Absolute Maximum and Minimum Ratings		164
		7.7.1	Storage Conditions Specifications	165
	7.8	DC Specifications		166
		7.8.1	Voltage and Current Specifications	167
		7.8.2	Die Voltage Validation	173
		7.8.3	Signal DC Specifications	174
	7.9	Waveforms		180
	7.10	Signal Quality		181
		7.10.1	DDR3 Signal Quality Specifications	182
		7.10.2	I/O Signal Quality Specifications	182
		7.10.3	Intel QuickPath Interconnect Signal Quality Specifications	182
		7.10.4	Input Reference Clock Signal Quality Specifications	182
		7.10.5	Overshoot/Undershoot Tolerance	182
8	Processor Land Listing			187
	8.1	Listing by Land Name		187
	8.2	Listing by Land Number		212
9	Package Mechanical Specifications			237
	9.1	Package Mechanical Drawing		237
	9.2	Processor Component Keep-Out Zones		241
	9.3	Package Loading Specifications		241
	9.4	Package Handling Guidelines		241
	9.5	Package Insertion Specifications		241
	9.6	Processor Mass Specification		242
	9.7	Processor Materials		242
	9.8	Processor Markings		242
10	Boxed Processor Specifications			243
	10.1	Introduction		243
		10.1.1	Available Boxed Thermal Solution Configurations	243
		10.1.2	Intel Thermal Solution STS200C
			(Passive/Active Combination Heat Sink Solution)	243
		10.1.3	Intel Thermal Solution STS200P and STS200PNRW
			(Boxed 25.5 mm Tall Passive Heat Sink Solutions)	244
	10.2	Mechanical Specifications		245
		10.2.1	Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones	245
		10.2.2	Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS)	254
	10.3	Fan Power Supply [STS200C]		254
		10.3.1	Boxed Processor Cooling Requirements	255
	10.4	Boxed Processor Contents		257

Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families	5
Datasheet Volume One