Intel E5-4600, CM8062101038606 manual Package Mechanical Drawing, Processor Package Assembly Sketch

Package Mechanical Specifications

9Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that interfaces with the baseboard via an LGA2011-0 land FCLGA10 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 9-1shows a sketch of the processor package components and how they are assembled together. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for complete details on the LGA2011-0 land FCLGA10 socket.

The package components shown in Figure 9-1include the following:

1.Integrated Heat Spreader (IHS)

2.Thermal Interface Material (TIM)

3.Processor core (die)

4.Package substrate

5.Capacitors

Figure 9-1. Processor Package Assembly Sketch

IHS

Substrate

System Board

DieTIM

Capacitors

LGA2011-0 Socket

Note:

1. Socket and baseboard are included for reference and are not part of processor package.

9.1Package Mechanical Drawing

The package mechanical drawings are shown in Figure 9-2and Figure 9-3. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1.Package reference with tolerances (total height, length, width, and so forth)

2.IHS parallelism and tilt

3.Land dimensions

4.Top-side and back-side component keep-out dimensions

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families	237
Datasheet Volume One