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Intel E5-1600, CM8062101038606, E5-4600 Land Name Sheet 33, Land Name Sheet 34, VCCD01, VCCD23

Models: E5-2600 E5-4600 E5-1600 CM8062101038606

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Processor Land Listing

Table 8-1. Land Name (Sheet 33 of 49)

Land Name	Land No.	Buffer Type	Direction

VCC	BU9	PWR

VCC	BV10	PWR

VCC	BV12	PWR

VCC	BV14	PWR

VCC	BV16	PWR

VCC	BV2	PWR

VCC	BV4	PWR

VCC	BV6	PWR

VCC	BV8	PWR

VCC	BY18	PWR

VCC	BY26	PWR

VCC	BY28	PWR

VCC	BY30	PWR

VCC	BY32	PWR

VCC	BY34	PWR

VCC	BY36	PWR

VCC	BY38	PWR

VCC	BY40	PWR

VCC	CA25	PWR

VCC	CA29	PWR

VCC_SENSE	BW3		O

VCCD_01	CD20	PWR

VCCD_01	CD22	PWR

VCCD_01	CD24	PWR

VCCD_01	CD26	PWR

VCCD_01	CD28	PWR

VCCD_01	CJ19	PWR

VCCD_01	CJ21	PWR

VCCD_01	CJ23	PWR

VCCD_01	CJ25	PWR

VCCD_01	CJ27	PWR

VCCD_01	CP20	PWR

VCCD_01	CP22	PWR

VCCD_01	CP24	PWR

VCCD_01	CP26	PWR

VCCD_01	CP28	PWR

VCCD_01	CW19	PWR

VCCD_01	CW21	PWR

VCCD_01	CW23	PWR

VCCD_01	CW25	PWR

VCCD_01	CW27	PWR

VCCD_01	DD18	PWR

Table 8-1. Land Name (Sheet 34 of 49)

Land Name	Land No.	Buffer Type	Direction

VCCD_01	DD20	PWR

VCCD_01	DD22	PWR

VCCD_01	DD24	PWR

VCCD_01	DD26	PWR

VCCD_23	AC17	PWR

VCCD_23	AC19	PWR

VCCD_23	AC21	PWR

VCCD_23	AC23	PWR

VCCD_23	AC25	PWR

VCCD_23	C15	PWR

VCCD_23	C17	PWR

VCCD_23	C19	PWR

VCCD_23	C21	PWR

VCCD_23	C23	PWR

VCCD_23	G13	PWR

VCCD_23	H16	PWR

VCCD_23	H18	PWR

VCCD_23	H20	PWR

VCCD_23	H22	PWR

VCCD_23	H24	PWR

VCCD_23	N15	PWR

VCCD_23	N17	PWR

VCCD_23	N19	PWR

VCCD_23	N21	PWR

VCCD_23	N23	PWR

VCCD_23	V16	PWR

VCCD_23	V18	PWR

VCCD_23	V20	PWR

VCCD_23	V22	PWR

VCCD_23	V24	PWR

VCCPLL	BY14	PWR

VCCPLL	CA13	PWR

VCCPLL	CA15	PWR

VSA	AE15	PWR

VSA	AE17	PWR

VSA	AF18	PWR

VSA	AG15	PWR

VSA	AG17	PWR

VSA	AH10	PWR

VSA	AH12	PWR

VSA	AH14	PWR

VSA	AH16	PWR

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families	203
Datasheet Volume One

Image 203

Intel E5-1600, CM8062101038606, E5-4600, E5-2600 manual Land Name Sheet 33, Land Name Sheet 34, VCCD01, VCCD23

Contents

May Datasheet Volume OnePage Contents Package Thermal Specifications Mechanical Specifications 245 10.2.1 Figures Tcase 8-Core 135W Thermal Profile 2U Tables Core 150W Thermal Profile, Workstation Platform SKU Only Fault Resilient Booting Output Tri-State Signals Initial Release March Revision Description Revision Date NumberDatasheet Volume One Introduction OverviewProcessor Feature Details System Memory Support InterfacesSupported Technologies PCI Express NTB Link Direct Media Interface Gen 2 DMI2Intel QuickPath Interconnect Intel QPI System States Support Power Management SupportPlatform Environment Control Interface Peci Processor Package and Core StatesIntel QuickPath Interconnect Thermal Management SupportPackage Summary TerminologyIOV IMCIIO IHSNebs LLCLrdimm NctfUdimm Related DocumentsTDP TsodReferenced Documents Sheet 2 State of DataSystem Memory Timing Support System Memory InterfaceSystem Memory Technology Support PCI Express* Architecture PCI Express* InterfacePhysical Layer PCI Express* Configuration MechanismTransaction Layer Data Link LayerProcessor/PCH Compatibility Assumptions 1 DMI2 Error FlowDMI2/PCI Express* Interface Intel QuickPath InterconnectInterfaces Peci Client Capabilities Summary of Processor-specific Peci CommandsCommand Supported on the Processor Platform Environment Control Interface PeciPlatform Manageability Client Command SuiteProcessor Interface Tuning and Diagnostics Thermal ManagementGetDIB Minor Revision Number Meaning Minor Revision Supported Command SuiteDevice Info Revision NumberTemp70 Temp158 GetTempClient Address Write Length Read Length Response Meaning RdPkgConfigSupported Responses GetTemp Response DefinitionRdPkgConfig Response Definition WrPkgConfigElectrical error or AW FCS failure WrPkgConfig Response Definition Sheet 1Dram Thermal and Power Optimization Capabilities Package Configuration CapabilitiesWrPkgConfig Response Definition Sheet 2 Dram Rank TemperatureDram Power By powerPerformance Dram Thermal Estimation Configuration Data Read/WriteLimit Data LimitIndex Encoding Physical Channel# Physical DIMM# Dram Rank Temperature WriteDimm Temperature Read Channel & Dimm Index DecodingDIMM# Dimm Ambient Temperature Write / ReadDram Channel Temperature Read Accumulated Dram Energy Data Dram Power Info ReadAccumulated Dram Energy Read Typical Value Dram Power Limit Data Write / ReadMaximum Time Reserved Dram Power Limit Performance Status ReadDram Powerlimit CSR Mcaerrsrclog CPU Thermal and Power Optimization CapabilitiesCpuid CSR didRead status Read Mode bit AccumulatedPower Limit for VCC PowerLimits For Read Package PowerModes Package Power Indicator ReadFlag Package Identifier ReadProcessor TypeMax Thread Package Power SKU Unit ReadUnit Field Value Calculation Default Value Power Control Register Unit CalculationsPackage Power SKU Read Peci Temperature Wake on Peci Mode Bit Write / ReadPackage Temperature Read Maximum Package Power WindowPackage Thermal Status Read / Clear Per Core DTS Temperature ReadTemperature Target Read 4 3 2 1 Thermal Averaging Constant Write / ReadThermally Constrained Time Read Current Limit ReadAccumulated Energy Status Read Power Limit for the VCC Power Plane Write / ReadMode Enable Package Power Limits For Multiple Turbo ModesControl Time Clamp Power Limit Window #2 Mode #2 Enable #2 Package Power Limit Performance Status ReadAcpi P-T Notify Write & Read Efficient Performance Indicator ReadThermal Margin Read Read Mode bit 11 = ‘0’Core ID Bit Read Mode bit 11 = ‘1’ Caching Agent TOR ReadProcessor ID Enumeration RdIAMSR42. Processor ID Construction Example RdIAMSR Capabilities 11. RdIAMSR Services Summary Sheet 110. RdIAMSR Response Definition Or ID Address Meaning Sor ID Byte Dword 11. RdIAMSR Services Summary Sheet 244. PCI Configuration Address RdPCIConfigAppropriate RdPCIConfigLocal12. RdPCIConfig Response Definition Timely fashion. Retry is appropriate0x05 0x02,0x03,0x05 0xe1 Definition 13. RdPCIConfigLocal Response Definition Sheet 1PCI Configuration Address 13. RdPCIConfigLocal Response Definition Sheet 2 WrPCIConfigLocalCompletion 14. WrPCIConfigLocal Response DefinitionCmd Code 0xe5Client Management Power-up SequencingWrPCIConfigLocal Capabilities 16. Peci Client Response During Power-Up Sheet 1Client Addressing 16. Peci Client Response During Power-Up Sheet 2Device Discovery 17. Socket ID Strapping 18. Power Impact of Peci Commands vs. C-statesCommand Power Impact StatesBMC Init Mode Processor ResetSystem Service Processor SSP Mode Support Link Init Mode Processor Error HandlingOriginator Retry and Timeout Policy 19. Domain ID Definition Multi-Domain Commands20. Multi-Domain Command Code Reference Enumerating Peci Client Capabilities21. Completion Code Pass/Fail Mask Client ResponsesAbort FCS Completion CodesInterpretation DTS Temperature DataOriginator Responses FormatReserved Values Temperature Filtering24. Error Codes and Descriptions Error Code DescriptionDatasheet Volume One Intel VT-x Objectives Intel Virtualization Technology Intel VTIntel VT-d Objectives Intel VT-x FeaturesIntel VT-d Features Supported Intel Trusted Execution Technology Security TechnologiesIntel Virtualization Technology Processor Extensions Intel Advanced Encryption Standard Instructions Intel AES-NI Intel Trusted Execution Technology Server ExtensionsIntel Turbo Boost Operating Frequency Execute Disable BitIntel Advanced Vector Extensions Intel AVX Intel Intelligent Power TechnologyEnhanced Intel SpeedStep Technology Intel Dynamic Power Technology Intel DPT Technologies Package C-State Support Sheet 1 Acpi States SupportedSystem States System StatesCore C-State Support System Memory Power States Sheet 1Integrated Memory Controller States Package C-State Support Sheet 26 G, S, and C State Combinations 4 DMI2/PCI Express Link StatesIntel QuickPath Interconnect States Enhanced Intel SpeedStep Technology Processor Core/Package Power ManagementLow-Power Idle States Idle Power Management Breakdown of the Processor Cores Requesting Low-Power Idle StatesPLVLx to Mwait Conversion Core C-statesCore C0 State Core C1/C1E StateState Auto-Demotion Core C3 StateCore C6 State Core C7 StatePackage C-States Package C-State Core Coordination of Core Power States at the Package LevelPackage C0 Package C1/C1EPackage C6 State Package C2 StatePackage C3 State TDP SKUs C1E W C3 W C6 W Core / 6-Core System Memory Power ManagementPackage C-State Power Specifications 10. Package C-State Power SpecificationsSelf Refresh Exit CKE Power-DownSelf Refresh Self Refresh EntryDLL and PLL Shutdown DMI2/PCI Express* Power ManagementDram I/O Power Management 100 Thermal Specifications Package Thermal SpecificationsTcase and DTS Based Thermal Specifications Temperaturetarget MSR Processor SKU Summary Table 3.1 8-Core 150W Thermal SpecificationsProcessor Thermal Profiles Thermal Management Specifications Core 150W Thermal Profile, Workstation Platform SKU Only Power W Maximum T Case C Maximum Dtsc3, 4 3.2 8-Core 135W Thermal SpecificationsTcase 8-Core 135W Thermal Specifications 2U Core 135W Thermal Profile U Sheet 1 Power W Maximum Tcase C Maximum DTS CCore 135W Thermal Profile U Sheet 2 3.3 8/6-Core 130W Thermal SpecificationsPower W Maximum T Case C Maximum DTS C Tcase 8/6-Core 130W Thermal Profile 1U 6-Core 130W Thermal Profile U Sheet 1 Power W Maximum Tcase C Maximum DTS C Core6-Core 130W Thermal Profile U Sheet 2 3.4 6-Core 130W 1S WS Thermal SpecificationsTcase 6-Core 130W 1S WS Thermal Specifications Power W Maximum T Case C Maximum DTS C CoreCore 130W 1S WS Thermal Profile Table Sheet 1 DTS 6-Core 130W 1S WS Thermal ProfileCore 130W 1S WS Thermal Profile Table Sheet 2 3.5 8-Core 115W Thermal Specifications10. Tcase 8-Core 115W Thermal Specifications 1U 10. Tcase 8-Core 115W Thermal Profile 1U 11 -Core 115W Thermal Profile U 3.6 8/6-Core 95W Thermal Specifications12. Tcase 8/6-Core 95W Thermal Profile 1U 13 /6-Core 95W Thermal Profile U Sheet 1 14. DTS 6-Core 95W Thermal Profile 1U13 /6-Core 95W Thermal Profile U Sheet 2 3.7 8-Core 70W Thermal Specifications14. Tcase 8-Core 70W Thermal Specifications 1U 15 -Core 70W Thermal Profile U 16. DTS 8-Core 70W Thermal Profile 1U16. Tcase 6-Core 60W Thermal Specifications 1U 3.8 6-Core 60W Thermal Specifications17 -Core 60W Thermal Profile U 18. DTS 6-Core 60W Thermal Profile 1U18. Tcase 4-Core 130W Thermal Specifications 2U 3.9 4-Core 130W Thermal Specifications19 -Core 130W Thermal Profile U Sheet 1 20. DTS 4-Core 130W Thermal Profile 2U19 -Core 130W Thermal Profile U Sheet 2 3.10 4-Core 130W 1S WS Thermal Specifications21. Tcase 4-Core 130W 1S WS Thermal Profile 21 -Core 130W 1S WS Thermal Profile Table 3.11 4-Core 95W Thermal Specifications22. Tcase 4-Core 95W Thermal Specifications 1U 23. Tcase 4-Core 95W Thermal Profile 1U 23 -Core 95W Thermal Profile U 3.12 4/2-Core 80W Thermal Specifications24. Tcase 4/2-Core 80W Thermal Specifications 1U 25. Tcase 4/2-Core 80W Thermal Profile 1U 25 /2-Core 80W Thermal Profile U Sheet 1 Maximum Tcase Maximum DTS C Power W Core25 /2-Core 80W Thermal Profile U Sheet 2 4.1 8-Core LV95W Thermal SpecificationsMaximum T Case Maximum DTS C Power W Core Embedded Server Processor Thermal Profiles28. Tcase 8-Core LV95W Thermal Profile, Embedded Server SKU 29. DTS 8-Core LV95W Thermal Profile, Embedded Server SKU 30. Tcase 8-Core LV70W Thermal Profile, Embedded Server SKU 4.2 8-Core LV70W Thermal Specifications31. DTS 8-Core LV70W Thermal Profile, Embedded Server SKU Thermal Metrology 32. Case Temperature Tcase Measurement LocationAdaptive Thermal Monitor Processor Core Thermal FeaturesProcessor Temperature 33. Frequency and Voltage Ordering Frequency/SVID ControlClock Modulation On-Demand ModeProchotn Signal Dram Throttling Options Thermtripn SignalIntegrated Memory Controller IMC Thermal Features Integrated Dual SMBus Master Controllers for SMI MEMHOTC01N and MEMHOTC23N SignalHybrid Closed Loop Thermal Throttling CLTTHybrid Memory Channel DDR0, DDR1, DDR2, DDR3 System Memory Interface SignalsSignal Name Description Memory Channel Miscellaneous PCI Express* Based Interface SignalsPCI Express* Port 1 Signals PCI Express* Port 2 Signals Sheet 1PCI Express* Miscellaneous Signals Sheet 1 PCI Express* Port 2 Signals Sheet 2PCI Express* Port 3 Signals Intel QuickPath Interconnect Signals DMI2/PCI Express* Port 0 SignalsJtag and TAP Signals Peci SignalSystem Reference Clock Signals 14. Processor Asynchronous Sideband Signals Sheet 1 Serial VID Interface Svid SignalsProcessor Asynchronous Sideband and Miscellaneous Signals 13. Svid Signals14. Processor Asynchronous Sideband Signals Sheet 2 16. Power and Ground Signals Sheet 1 Processor Power and Ground Supplies14. Processor Asynchronous Sideband Signals Sheet 3 15. Miscellaneous Signals16. Power and Ground Signals Sheet 2 152 3 DMI2/PCI Express* Signals Processor SignalingSystem Memory Interface Signal Groups PCI Express* SignalsInput Device Hysteresis Platform Environmental Control Interface PeciSystem Reference Clocks BCLK0/1DP, BCLK0/ 1DN PLL Power Supply Jtag and Test Access Port TAP SignalsProcessor Sideband Signals Power, Ground and Sense SignalsVoltage Identification VID Power and Ground LandsPower Number Comments Ground Lands Decoupling GuidelinesSetVID-Decay Command Svid CommandsSetVID Fast Command SetVID Slow CommandVR Power-State Transitions Svid Power State Functions SetPS159 Svid Voltage Rail AddressingSvid Address Usage PWM Address HEX ProcessorSignal Description Signal Group SummaryReserved or Unused Signals Signal Description Buffer Types Sheet 1Signal Groups Sheet 1 Signal Description Buffer Types Sheet 2Signal Groups Sheet 2 Miscellaneous Signals Signal Groups Sheet 3Serial VID Interface Svid Signals Processor Asynchronous Sideband SignalsSignal Name Pull Up /Pull Rail Value Units Down Power-On Configuration POC OptionsSignals with On-Die Termination Power-On Configuration Option LandsMixing Processors Fault Resilient Booting FRBFault Resilient Booting Output Tri-State Signals Output Tri-State Signal Groups SignalsProcessor Absolute Minimum and Maximum Ratings Symbol Parameter Min Max UnitFlexible Motherboard Guidelines FMB Absolute Maximum and Minimum Ratings10. Storage Condition Ratings Storage Conditions SpecificationsDC Specifications VCC VID Voltage and Current Specifications11. Voltage Specification Symbol Parameter Voltage Min Typ Max Unit PlaneCore/6-core 12. Processor Current SpecificationsParameter Symbol Processor TDP / Core Count Max a DefinitionCC a 13 /6 Core Processor VCC Static and Transient ToleranceICC a VID 3,4,5,6 100 105 110 115 120 125 130 135 140 145 150 174 Die Voltage Validation VCC Overshoot Specifications15. VCC Overshoot Specifications Sheet 1 Symbol Parameter Min Max Units16. DDR3 and DDR3L Signal DC Specifications Sheet 1 Signal DC Specifications15. VCC Overshoot Specifications Sheet 2 Control Signals 16. DDR3 and DDR3L Signal DC Specifications Sheet 2Reference Clock Signal Command SignalsSymbol Definition and Conditions Min Max Units 17. Peci DC Specifications18. System Reference Clock BCLK0/1 DC Specifications 19. SMBus DC Specifications Sheet 1Symbol Parameter Min Typ Max Units 19. SMBus DC Specifications Sheet 220. Jtag and TAP Signals DC Specifications 21. Serial VID Interface Svid DC Specifications Sheet 1Open Drain Cmos Odcmos Signals 21. Serial VID Interface Svid DC Specifications Sheet 222. Processor Asynchronous Sideband DC Specifications CMOS1.05v SignalsReset and Miscellaneous Signal DC Specifications PCI Express* DC Specifications3.2 DMI2/PCI Express* DC Specifications Intel QuickPath Interconnect DC SpecificationsVcross MIN = 250mV StableVRB-Differential Vcross MAX = 550mV2 I/O Signal Quality Specifications Signal Quality1 DDR3 Signal Quality Specifications Overshoot/Undershoot Tolerance Intel QuickPath Interconnect Signal Quality SpecificationsInput Reference Clock Signal Quality Specifications 24. Processor I/O Overshoot/Undershoot SpecificationsActivity Factor Reading Overshoot/Undershoot Specification TablesOvershoot/Undershoot Pulse Duration 11. Maximum Acceptable Overshoot/Undershoot Waveform Land Name Land No Buffer Type Direction Listing by Land NameLand Name Sheet 1 Land Name Sheet 2Land Name Sheet 4 Land Name Sheet 3Land Name Sheet 6 Land Name Sheet 5Land Name Sheet 8 Land Name Sheet 7Land Name Sheet 10 Land Name Sheet 9Land Name Sheet 12 Land Name Sheet 11Land Name Sheet 14 Land Name Sheet 13Land Name Sheet 16 Land Name Sheet 15Land Name Sheet 18 Land Name Sheet 17Land Name Sheet 20 Land Name Sheet 19Land Name Sheet 22 Land Name Sheet 21Land Name Sheet 24 Land Name Sheet 23Land Name Sheet 26 Land Name Sheet 25Land Name Sheet 28 Land Name Sheet 27Land Name Sheet 30 Land Name Sheet 29Land Name Sheet 32 Land Name Sheet 31VCCD23 Land Name Sheet 33Land Name Sheet 34 VCCD01Land Name Sheet 36 Land Name Sheet 35Land Name Sheet 38 Land Name Sheet 37Land Name Sheet 40 Land Name Sheet 39Land Name Sheet 42 Land Name Sheet 41Land Name Sheet 44 Land Name Sheet 43Land Name Sheet 46 Land Name Sheet 45Vttd Land Name Sheet 47Land Name Sheet 48 VttaLand Name Sheet 49 Land No Land Name Buffer Type Direction Listing by Land NumberLand Number Sheet 1 Land Number Sheet 2Land Number Sheet 4 Land Number Sheet 3Land Number Sheet 6 Land Number Sheet 5Land Number Sheet 8 Land Number Sheet 7Land Number Sheet 10 Land Number Sheet 9Land Number Sheet 12 Land Number Sheet 11Land Number Sheet 14 Land Number Sheet 13Land Number Sheet 16 Land Number Sheet 15Land Number Sheet 18 Land Number Sheet 17Land Number Sheet 20 Land Number Sheet 19Land Number Sheet 22 Land Number Sheet 21Land Number Sheet 24 Land Number Sheet 23Land Number Sheet 26 Land Number Sheet 25Land Number Sheet 28 Land Number Sheet 27Land Number Sheet 30 Land Number Sheet 29Land Number Sheet 32 Land Number Sheet 31Land Number Sheet 34 Land Number Sheet 33Land Number Sheet 36 Land Number Sheet 35Land Number Sheet 38 Land Number Sheet 37Land Number Sheet 40 Land Number Sheet 39Land Number Sheet 42 Land Number Sheet 41Land Number Sheet 44 Land Number Sheet 43Land Number Sheet 46 Land Number Sheet 45Land Number Sheet 48 Land Number Sheet 47236 Package Mechanical Drawing Processor Package Assembly Sketch238 Processor Package Drawing Sheet 1 Processor Package Drawing Sheet 2 Package Handling Guidelines Package Loading SpecificationsPackage Insertion Specifications Processor Component Keep-Out ZonesProcessor Materials Processor Mass SpecificationProcessor Materials Processor MarkingsAvailable Boxed Thermal Solution Configurations Boxed Processor Specifications244 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks Mechanical Specifications246 Motherboard Keepout Zones 1Motherboard Keepout Zones 2 Boxed Processor Specifications248 Boxed Processor Motherboard Keepout Zones 3TOP Surface of Motherboard Motherboard Keepout Zones 4250 Boxed Processor Heat Sink Volumetric 1Boxed Processor Heat Sink Volumetric 2Specifications Processor10.4-Pin Fan Cable Connector For Active Heat Sink 11 -Pin Base Baseboard Fan Header For Active Heat Sink 21,000 25,000 28,000 Fan Power Supply STS200CBoxed Processor Cooling Requirements Boxed Processor Contents Boxed Processor 258