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Intel E5-2600, CM8062101038606, E5-4600, E5-1600 manual Land Number Sheet 13, Land Number Sheet 14

Models: E5-2600 E5-4600 E5-1600 CM8062101038606

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Processor Land Listing

Table 8-2.		Land Number (Sheet 13 of 48)

Land No.		Land Name	Buffer Type	Direction

BC47		RSVD

BC49		SOCKET_ID[1]	CMOS	I

BC5		VSS	GND

BC51		ERROR_N[2]	ODCMOS	O

BC53		VSS	GND

BC55		VSS	GND

BC57		VSS	GND

BC7		VSS	GND

BC9		VSS	GND

BD10		VSS	GND

BD12		VSS	GND

BD14		VSS	GND

BD16		VSS	GND

BD2		VSS	GND

BD4		VSS	GND

BD42		VTTD	PWR

BD44		RSVD

BD46		RSVD

BD48		RSVD

BD50		ERROR_N[0]	ODCMOS	O

BD52		PROCHOT_N	ODCMOS	I/O

BD54		VSS	GND

BD56		VSS	GND

BD58		QPI0_DRX_DP[07]	QPI	I

BD6		VSS	GND

BD8		VSS	GND

BE1		VCC	PWR

BE11		VCC	PWR

BE13		VCC	PWR

BE15		VCC	PWR

BE17		VCC	PWR

BE3		VCC	PWR

BE43		RSVD

BE45		RSVD

BE47		RSVD

BE49		VSS	GND

BE5		VCC	PWR

BE51		VSS	GND

BE53		QPI0_DRX_DP[02]	QPI	I

BE55		QPI0_DRX_DP[03]	QPI	I

BE57		QPI0_DRX_DP[08]	QPI	I

BE7		VCC	PWR

Table 8-2.		Land Number (Sheet 14 of 48)

Land No.		Land Name	Buffer Type	Direction

BE9		VCC	PWR

BF10		VCC	PWR

BF12		VCC	PWR

BF14		VCC	PWR

BF16		VCC	PWR

BF2		VCC	PWR

BF4		VCC	PWR

BF42		VSS	GND

BF44		VSS	GND

BF46		RSVD

BF48		PEHPSDA	ODCMOS	I/O

BF50		QPI0_DRX_DP[06]	QPI	I

BF52		QPI0_DRX_DP[01]	QPI	I

BF54		QPI0_DRX_DP[05]	QPI	I

BF56		QPI0_DRX_DP[04]	QPI	I

BF58		QPI0_DRX_DN[07]	QPI	I

BF6		VCC	PWR

BF8		VCC	PWR

BG1		VCC	PWR

BG11		VCC	PWR

BG13		VCC	PWR

BG15		VCC	PWR

BG17		VCC	PWR

BG3		VCC	PWR

BG43		RSVD

BG45		RSVD

BG47		VSS	GND

BG49		QPI0_DRX_DP[17]	QPI	I

BG5		VCC	PWR

BG51		QPI0_DRX_DP[00]	QPI	I

BG53		QPI0_DRX_DN[02]	QPI	I

BG55		QPI0_DRX_DN[03]	QPI	I

BG57		QPI0_DRX_DN[08]	QPI	I

BG7		VCC	PWR

BG9		VCC	PWR

BH10		VCC	PWR

BH12		VCC	PWR

BH14		VCC	PWR

BH16		VCC	PWR

BH2		VCC	PWR

BH4		VCC	PWR

BH42		VTTD	PWR

218	Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
	Datasheet Volume One

Image 218

Intel E5-2600, CM8062101038606, E5-4600, E5-1600 manual Land Number Sheet 13, Land Number Sheet 14

Contents

Datasheet Volume One MayPage Contents Package Thermal Specifications Mechanical Specifications 245 10.2.1 Figures Tcase 8-Core 135W Thermal Profile 2U Tables Core 150W Thermal Profile, Workstation Platform SKU Only Fault Resilient Booting Output Tri-State Signals Revision Description Revision Date Number Initial Release MarchDatasheet Volume One Overview IntroductionProcessor Feature Details System Memory Support InterfacesSupported Technologies PCI Express NTB Link Direct Media Interface Gen 2 DMI2Intel QuickPath Interconnect Intel QPI Processor Package and Core States Power Management SupportPlatform Environment Control Interface Peci System States SupportTerminology Thermal Management SupportPackage Summary Intel QuickPath InterconnectIHS IMCIIO IOVNctf LLCLrdimm NebsTsod Related DocumentsTDP UdimmState of Data Referenced Documents Sheet 2System Memory Timing Support System Memory InterfaceSystem Memory Technology Support PCI Express* Interface PCI Express* ArchitectureData Link Layer PCI Express* Configuration MechanismTransaction Layer Physical LayerIntel QuickPath Interconnect 1 DMI2 Error FlowDMI2/PCI Express* Interface Processor/PCH Compatibility AssumptionsInterfaces Platform Environment Control Interface Peci Summary of Processor-specific Peci CommandsCommand Supported on the Processor Peci Client CapabilitiesThermal Management Client Command SuiteProcessor Interface Tuning and Diagnostics Platform ManageabilityGetDIB Revision Number Minor Revision Supported Command SuiteDevice Info Minor Revision Number MeaningTemp70 Temp158 GetTempClient Address Write Length Read Length GetTemp Response Definition RdPkgConfigSupported Responses Response MeaningWrPkgConfig RdPkgConfig Response DefinitionWrPkgConfig Response Definition Sheet 1 Electrical error or AW FCS failureDram Thermal and Power Optimization Capabilities Package Configuration CapabilitiesWrPkgConfig Response Definition Sheet 2 By power TemperatureDram Power Dram RankLimit Dram Thermal Estimation Configuration Data Read/WriteLimit Data PerformanceChannel & Dimm Index Decoding Dram Rank Temperature WriteDimm Temperature Read Index Encoding Physical Channel# Physical DIMM#DIMM# Dimm Ambient Temperature Write / ReadDram Channel Temperature Read Accumulated Dram Energy Data Dram Power Info ReadAccumulated Dram Energy Read Typical Value Dram Power Limit Data Write / ReadMaximum Time Reserved Dram Power Limit Performance Status ReadDram Powerlimit CSR did CPU Thermal and Power Optimization CapabilitiesCpuid CSR McaerrsrclogVCC Power Read Mode bit AccumulatedPower Limit for Read statusIndicator Read Read Package PowerModes Package Power Limits ForType Package Identifier ReadProcessor FlagPackage Power SKU Unit Read Max ThreadUnit Field Value Calculation Default Value Power Control Register Unit CalculationsPackage Power SKU Read Maximum Package Power Window Wake on Peci Mode Bit Write / ReadPackage Temperature Read Peci TemperaturePackage Thermal Status Read / Clear Per Core DTS Temperature ReadTemperature Target Read Current Limit Read Thermal Averaging Constant Write / ReadThermally Constrained Time Read 4 3 2 1Power Limit for the VCC Power Plane Write / Read Accumulated Energy Status ReadMode Enable Package Power Limits For Multiple Turbo ModesControl Time Clamp Power Limit Package Power Limit Performance Status Read Window #2 Mode #2 Enable #2Efficient Performance Indicator Read Acpi P-T Notify Write & ReadCaching Agent TOR Read Read Mode bit 11 = ‘0’Core ID Bit Read Mode bit 11 = ‘1’ Thermal Margin ReadRdIAMSR Processor ID Enumeration42. Processor ID Construction Example RdIAMSR Capabilities 11. RdIAMSR Services Summary Sheet 110. RdIAMSR Response Definition 11. RdIAMSR Services Summary Sheet 2 Or ID Address Meaning Sor ID Byte DwordRdPCIConfig 44. PCI Configuration AddressTimely fashion. Retry is appropriate RdPCIConfigLocal12. RdPCIConfig Response Definition Appropriate0x05 0x02,0x03,0x05 0xe1 Definition 13. RdPCIConfigLocal Response Definition Sheet 1PCI Configuration Address WrPCIConfigLocal 13. RdPCIConfigLocal Response Definition Sheet 20xe5 14. WrPCIConfigLocal Response DefinitionCmd Code Completion16. Peci Client Response During Power-Up Sheet 1 Power-up SequencingWrPCIConfigLocal Capabilities Client ManagementClient Addressing 16. Peci Client Response During Power-Up Sheet 2Device Discovery States 18. Power Impact of Peci Commands vs. C-statesCommand Power Impact 17. Socket ID StrappingBMC Init Mode Processor ResetSystem Service Processor SSP Mode Support Link Init Mode Processor Error HandlingOriginator Retry and Timeout Policy Enumerating Peci Client Capabilities Multi-Domain Commands20. Multi-Domain Command Code Reference 19. Domain ID DefinitionCompletion Codes Client ResponsesAbort FCS 21. Completion Code Pass/Fail MaskFormat DTS Temperature DataOriginator Responses InterpretationError Code Description Temperature Filtering24. Error Codes and Descriptions Reserved ValuesDatasheet Volume One Intel Virtualization Technology Intel VT Intel VT-x ObjectivesIntel VT-d Objectives Intel VT-x FeaturesIntel VT-d Features Supported Intel Trusted Execution Technology Security TechnologiesIntel Virtualization Technology Processor Extensions Intel Trusted Execution Technology Server Extensions Intel Advanced Encryption Standard Instructions Intel AES-NIExecute Disable Bit Intel Turbo Boost Operating FrequencyIntel Advanced Vector Extensions Intel AVX Intel Intelligent Power TechnologyEnhanced Intel SpeedStep Technology Intel Dynamic Power Technology Intel DPT Technologies System States Acpi States SupportedSystem States Package C-State Support Sheet 1Package C-State Support Sheet 2 System Memory Power States Sheet 1Integrated Memory Controller States Core C-State Support6 G, S, and C State Combinations 4 DMI2/PCI Express Link StatesIntel QuickPath Interconnect States Enhanced Intel SpeedStep Technology Processor Core/Package Power ManagementLow-Power Idle States Requesting Low-Power Idle States Idle Power Management Breakdown of the Processor CoresCore C1/C1E State Core C-statesCore C0 State PLVLx to Mwait ConversionCore C7 State Core C3 StateCore C6 State State Auto-DemotionPackage C-States Package C1/C1E Coordination of Core Power States at the Package LevelPackage C0 Package C-State CorePackage C6 State Package C2 StatePackage C3 State 10. Package C-State Power Specifications System Memory Power ManagementPackage C-State Power Specifications TDP SKUs C1E W C3 W C6 W Core / 6-CoreSelf Refresh Entry CKE Power-DownSelf Refresh Self Refresh ExitDLL and PLL Shutdown DMI2/PCI Express* Power ManagementDram I/O Power Management 100 Package Thermal Specifications Thermal SpecificationsTcase and DTS Based Thermal Specifications Temperaturetarget MSR Processor SKU Summary Table 3.1 8-Core 150W Thermal SpecificationsProcessor Thermal Profiles Thermal Management Specifications Power W Maximum T Case C Maximum Dtsc Core 150W Thermal Profile, Workstation Platform SKU Only3, 4 3.2 8-Core 135W Thermal SpecificationsTcase 8-Core 135W Thermal Specifications 2U Power W Maximum Tcase C Maximum DTS C Core 135W Thermal Profile U Sheet 1Core 135W Thermal Profile U Sheet 2 3.3 8/6-Core 130W Thermal SpecificationsPower W Maximum T Case C Maximum DTS C Tcase 8/6-Core 130W Thermal Profile 1U Power W Maximum Tcase C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 1Power W Maximum T Case C Maximum DTS C Core 3.4 6-Core 130W 1S WS Thermal SpecificationsTcase 6-Core 130W 1S WS Thermal Specifications 6-Core 130W Thermal Profile U Sheet 2DTS 6-Core 130W 1S WS Thermal Profile Core 130W 1S WS Thermal Profile Table Sheet 1Core 130W 1S WS Thermal Profile Table Sheet 2 3.5 8-Core 115W Thermal Specifications10. Tcase 8-Core 115W Thermal Specifications 1U 10. Tcase 8-Core 115W Thermal Profile 1U 3.6 8/6-Core 95W Thermal Specifications 11 -Core 115W Thermal Profile U12. Tcase 8/6-Core 95W Thermal Profile 1U 14. DTS 6-Core 95W Thermal Profile 1U 13 /6-Core 95W Thermal Profile U Sheet 113 /6-Core 95W Thermal Profile U Sheet 2 3.7 8-Core 70W Thermal Specifications14. Tcase 8-Core 70W Thermal Specifications 1U 16. DTS 8-Core 70W Thermal Profile 1U 15 -Core 70W Thermal Profile U3.8 6-Core 60W Thermal Specifications 16. Tcase 6-Core 60W Thermal Specifications 1U18. DTS 6-Core 60W Thermal Profile 1U 17 -Core 60W Thermal Profile U3.9 4-Core 130W Thermal Specifications 18. Tcase 4-Core 130W Thermal Specifications 2U20. DTS 4-Core 130W Thermal Profile 2U 19 -Core 130W Thermal Profile U Sheet 13.10 4-Core 130W 1S WS Thermal Specifications 19 -Core 130W Thermal Profile U Sheet 221. Tcase 4-Core 130W 1S WS Thermal Profile 21 -Core 130W 1S WS Thermal Profile Table 3.11 4-Core 95W Thermal Specifications22. Tcase 4-Core 95W Thermal Specifications 1U 23. Tcase 4-Core 95W Thermal Profile 1U 23 -Core 95W Thermal Profile U 3.12 4/2-Core 80W Thermal Specifications24. Tcase 4/2-Core 80W Thermal Specifications 1U 25. Tcase 4/2-Core 80W Thermal Profile 1U Maximum Tcase Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 1Embedded Server Processor Thermal Profiles 4.1 8-Core LV95W Thermal SpecificationsMaximum T Case Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 228. Tcase 8-Core LV95W Thermal Profile, Embedded Server SKU 29. DTS 8-Core LV95W Thermal Profile, Embedded Server SKU 4.2 8-Core LV70W Thermal Specifications 30. Tcase 8-Core LV70W Thermal Profile, Embedded Server SKU31. DTS 8-Core LV70W Thermal Profile, Embedded Server SKU 32. Case Temperature Tcase Measurement Location Thermal MetrologyAdaptive Thermal Monitor Processor Core Thermal FeaturesProcessor Temperature Frequency/SVID Control 33. Frequency and Voltage OrderingClock Modulation On-Demand ModeProchotn Signal Dram Throttling Options Thermtripn SignalIntegrated Memory Controller IMC Thermal Features Integrated Dual SMBus Master Controllers for SMI MEMHOTC01N and MEMHOTC23N SignalHybrid Closed Loop Thermal Throttling CLTTHybrid Memory Channel DDR0, DDR1, DDR2, DDR3 System Memory Interface SignalsSignal Name Description PCI Express* Port 2 Signals Sheet 1 PCI Express* Based Interface SignalsPCI Express* Port 1 Signals Memory Channel MiscellaneousPCI Express* Miscellaneous Signals Sheet 1 PCI Express* Port 2 Signals Sheet 2PCI Express* Port 3 Signals DMI2/PCI Express* Port 0 Signals Intel QuickPath Interconnect SignalsJtag and TAP Signals Peci SignalSystem Reference Clock Signals 13. Svid Signals Serial VID Interface Svid SignalsProcessor Asynchronous Sideband and Miscellaneous Signals 14. Processor Asynchronous Sideband Signals Sheet 114. Processor Asynchronous Sideband Signals Sheet 2 15. Miscellaneous Signals Processor Power and Ground Supplies14. Processor Asynchronous Sideband Signals Sheet 3 16. Power and Ground Signals Sheet 116. Power and Ground Signals Sheet 2 152 PCI Express* Signals Processor SignalingSystem Memory Interface Signal Groups 3 DMI2/PCI Express* SignalsInput Device Hysteresis Platform Environmental Control Interface PeciSystem Reference Clocks BCLK0/1DP, BCLK0/ 1DN Power, Ground and Sense Signals Jtag and Test Access Port TAP SignalsProcessor Sideband Signals PLL Power SupplyDecoupling Guidelines Power and Ground LandsPower Number Comments Ground Lands Voltage Identification VIDSetVID Slow Command Svid CommandsSetVID Fast Command SetVID-Decay CommandSvid Power State Functions SetPS VR Power-State TransitionsPWM Address HEX Processor Svid Voltage Rail AddressingSvid Address Usage 159Signal Description Buffer Types Sheet 1 Signal Group SummaryReserved or Unused Signals Signal DescriptionSignal Description Buffer Types Sheet 2 Signal Groups Sheet 1Signal Groups Sheet 2 Processor Asynchronous Sideband Signals Signal Groups Sheet 3Serial VID Interface Svid Signals Miscellaneous SignalsPower-On Configuration Option Lands Power-On Configuration POC OptionsSignals with On-Die Termination Signal Name Pull Up /Pull Rail Value Units DownOutput Tri-State Signal Groups Signals Fault Resilient Booting FRBFault Resilient Booting Output Tri-State Signals Mixing ProcessorsAbsolute Maximum and Minimum Ratings Symbol Parameter Min Max UnitFlexible Motherboard Guidelines FMB Processor Absolute Minimum and Maximum RatingsStorage Conditions Specifications 10. Storage Condition RatingsDC Specifications Symbol Parameter Voltage Min Typ Max Unit Plane Voltage and Current Specifications11. Voltage Specification VCC VIDMax a Definition 12. Processor Current SpecificationsParameter Symbol Processor TDP / Core Count Core/6-core13 /6 Core Processor VCC Static and Transient Tolerance CC aICC a VID 3,4,5,6 100 105 110 115 120 125 130 135 140 145 150 174 Symbol Parameter Min Max Units VCC Overshoot Specifications15. VCC Overshoot Specifications Sheet 1 Die Voltage Validation16. DDR3 and DDR3L Signal DC Specifications Sheet 1 Signal DC Specifications15. VCC Overshoot Specifications Sheet 2 Command Signals 16. DDR3 and DDR3L Signal DC Specifications Sheet 2Reference Clock Signal Control Signals19. SMBus DC Specifications Sheet 1 17. Peci DC Specifications18. System Reference Clock BCLK0/1 DC Specifications Symbol Definition and Conditions Min Max Units21. Serial VID Interface Svid DC Specifications Sheet 1 19. SMBus DC Specifications Sheet 220. Jtag and TAP Signals DC Specifications Symbol Parameter Min Typ Max UnitsCMOS1.05v Signals 21. Serial VID Interface Svid DC Specifications Sheet 222. Processor Asynchronous Sideband DC Specifications Open Drain Cmos Odcmos SignalsIntel QuickPath Interconnect DC Specifications PCI Express* DC Specifications3.2 DMI2/PCI Express* DC Specifications Reset and Miscellaneous Signal DC SpecificationsVcross MAX = 550mV StableVRB-Differential Vcross MIN = 250mV2 I/O Signal Quality Specifications Signal Quality1 DDR3 Signal Quality Specifications 24. Processor I/O Overshoot/Undershoot Specifications Intel QuickPath Interconnect Signal Quality SpecificationsInput Reference Clock Signal Quality Specifications Overshoot/Undershoot ToleranceActivity Factor Reading Overshoot/Undershoot Specification TablesOvershoot/Undershoot Pulse Duration 11. Maximum Acceptable Overshoot/Undershoot Waveform Land Name Sheet 2 Listing by Land NameLand Name Sheet 1 Land Name Land No Buffer Type DirectionLand Name Sheet 3 Land Name Sheet 4Land Name Sheet 5 Land Name Sheet 6Land Name Sheet 7 Land Name Sheet 8Land Name Sheet 9 Land Name Sheet 10Land Name Sheet 11 Land Name Sheet 12Land Name Sheet 13 Land Name Sheet 14Land Name Sheet 15 Land Name Sheet 16Land Name Sheet 17 Land Name Sheet 18Land Name Sheet 19 Land Name Sheet 20Land Name Sheet 21 Land Name Sheet 22Land Name Sheet 23 Land Name Sheet 24Land Name Sheet 25 Land Name Sheet 26Land Name Sheet 27 Land Name Sheet 28Land Name Sheet 29 Land Name Sheet 30Land Name Sheet 31 Land Name Sheet 32VCCD01 Land Name Sheet 33Land Name Sheet 34 VCCD23Land Name Sheet 35 Land Name Sheet 36Land Name Sheet 37 Land Name Sheet 38Land Name Sheet 39 Land Name Sheet 40Land Name Sheet 41 Land Name Sheet 42Land Name Sheet 43 Land Name Sheet 44Land Name Sheet 45 Land Name Sheet 46Vtta Land Name Sheet 47Land Name Sheet 48 VttdLand Name Sheet 49 Land Number Sheet 2 Listing by Land NumberLand Number Sheet 1 Land No Land Name Buffer Type DirectionLand Number Sheet 3 Land Number Sheet 4Land Number Sheet 5 Land Number Sheet 6Land Number Sheet 7 Land Number Sheet 8Land Number Sheet 9 Land Number Sheet 10Land Number Sheet 11 Land Number Sheet 12Land Number Sheet 13 Land Number Sheet 14Land Number Sheet 15 Land Number Sheet 16Land Number Sheet 17 Land Number Sheet 18Land Number Sheet 19 Land Number Sheet 20Land Number Sheet 21 Land Number Sheet 22Land Number Sheet 23 Land Number Sheet 24Land Number Sheet 25 Land Number Sheet 26Land Number Sheet 27 Land Number Sheet 28Land Number Sheet 29 Land Number Sheet 30Land Number Sheet 31 Land Number Sheet 32Land Number Sheet 33 Land Number Sheet 34Land Number Sheet 35 Land Number Sheet 36Land Number Sheet 37 Land Number Sheet 38Land Number Sheet 39 Land Number Sheet 40Land Number Sheet 41 Land Number Sheet 42Land Number Sheet 43 Land Number Sheet 44Land Number Sheet 45 Land Number Sheet 46Land Number Sheet 47 Land Number Sheet 48236 Processor Package Assembly Sketch Package Mechanical Drawing238 Processor Package Drawing Sheet 1 Processor Package Drawing Sheet 2 Processor Component Keep-Out Zones Package Loading SpecificationsPackage Insertion Specifications Package Handling GuidelinesProcessor Markings Processor Mass SpecificationProcessor Materials Processor MaterialsBoxed Processor Specifications Available Boxed Thermal Solution Configurations244 Mechanical Specifications STS200P and STS200PNRW 25.5 mm Tall Passive Heat SinksMotherboard Keepout Zones 1 246Boxed Processor Specifications Motherboard Keepout Zones 2Boxed Processor Motherboard Keepout Zones 3 248Motherboard Keepout Zones 4 TOP Surface of MotherboardBoxed Processor Heat Sink Volumetric 1 250Processor Heat Sink Volumetric 2Specifications Boxed Processor10.4-Pin Fan Cable Connector For Active Heat Sink 11 -Pin Base Baseboard Fan Header For Active Heat Sink Fan Power Supply STS200C 21,000 25,000 28,000Boxed Processor Cooling Requirements Boxed Processor Contents Boxed Processor 258