3.5 8-Core 115W Thermal Specifications | Intel E5-2600, E5-4600

		Thermal Management Specifications
Table 5-9. 6-Core 130W 1S WS Thermal Profile Table (Sheet 2 of 2)

	Power (W)	Maximum TCASE (°C)		Maximum DTS (°C)
	85	56.2		68.9

	90	57.1		70.5

	95	57.9		72.1

	100	58.8		73.7

	105	59.7		75.3

	110	60.5		76.9

	115	61.4		78.5

	120	62.3		80.1

	125	63.1		81.8

	130	64.0		83.4

5.1.3.58-Core 115W Thermal Specifications

Table 5-10. Tcase: 8-Core 115W Thermal Specifications 1U

	Core	Thermal Design	Minimum	Maximum	Notes
	Frequency	Power (W)	TCASE (°C)	TCASE (°C)	Notes
	Frequency	Power (W)	TCASE (°C)	TCASE (°C)
	Launch to FMB	115	5	See Figure 5-10and Table 5-11	1, 2, 3, 4, 5

Notes:

1.These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.

2.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

3.These specifications are based on final silicon characterization.

4.Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency.

5.FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements.

114	Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
	Datasheet Volume One

Image 114

Contents

Datasheet Volume One MayPage Contents Package Thermal Specifications Mechanical Specifications 245 10.2.1 Figures Tcase 8-Core 135W Thermal Profile 2U Tables Core 150W Thermal Profile, Workstation Platform SKU Only Fault Resilient Booting Output Tri-State Signals Revision Description Revision Date Number Initial Release March Datasheet Volume One Overview Introduction Processor Feature Details Interfaces Supported TechnologiesSystem Memory Support PCI Express NTB Direct Media Interface Gen 2 DMI2 Intel QuickPath Interconnect Intel QPILink Processor Package and Core States Power Management SupportPlatform Environment Control Interface Peci System States Support Terminology Thermal Management SupportPackage Summary Intel QuickPath Interconnect IHS IMCIIO IOV Nctf LLCLrdimm Nebs Tsod Related DocumentsTDP Udimm State of Data Referenced Documents Sheet 2 System Memory Interface System Memory Technology SupportSystem Memory Timing Support PCI Express* Interface PCI Express* Architecture Data Link Layer PCI Express* Configuration MechanismTransaction Layer Physical Layer Intel QuickPath Interconnect 1 DMI2 Error FlowDMI2/PCI Express* Interface Processor/PCH Compatibility Assumptions Interfaces Platform Environment Control Interface Peci Summary of Processor-specific Peci CommandsCommand Supported on the Processor Peci Client Capabilities Thermal Management Client Command SuiteProcessor Interface Tuning and Diagnostics Platform Manageability GetDIB Revision Number Minor Revision Supported Command SuiteDevice Info Minor Revision Number Meaning GetTemp Client Address Write Length Read LengthTemp70 Temp158 GetTemp Response Definition RdPkgConfigSupported Responses Response Meaning WrPkgConfig RdPkgConfig Response Definition WrPkgConfig Response Definition Sheet 1 Electrical error or AW FCS failure Package Configuration Capabilities WrPkgConfig Response Definition Sheet 2Dram Thermal and Power Optimization Capabilities By power TemperatureDram Power Dram Rank Limit Dram Thermal Estimation Configuration Data Read/WriteLimit Data Performance Channel & Dimm Index Decoding Dram Rank Temperature WriteDimm Temperature Read Index Encoding Physical Channel# Physical DIMM# Dimm Ambient Temperature Write / Read Dram Channel Temperature ReadDIMM# Dram Power Info Read Accumulated Dram Energy ReadAccumulated Dram Energy Data Dram Power Limit Data Write / Read Maximum TimeTypical Value Dram Power Limit Performance Status Read Dram PowerlimitReserved CSR did CPU Thermal and Power Optimization CapabilitiesCpuid CSR Mcaerrsrclog VCC Power Read Mode bit AccumulatedPower Limit for Read status Indicator Read Read Package PowerModes Package Power Limits For Type Package Identifier ReadProcessor Flag Package Power SKU Unit Read Max Thread Power Control Register Unit Calculations Package Power SKU ReadUnit Field Value Calculation Default Value Maximum Package Power Window Wake on Peci Mode Bit Write / ReadPackage Temperature Read Peci Temperature Per Core DTS Temperature Read Temperature Target ReadPackage Thermal Status Read / Clear Current Limit Read Thermal Averaging Constant Write / ReadThermally Constrained Time Read 4 3 2 1 Power Limit for the VCC Power Plane Write / Read Accumulated Energy Status Read Package Power Limits For Multiple Turbo Modes Control Time Clamp Power LimitMode Enable Package Power Limit Performance Status Read Window #2 Mode #2 Enable #2 Efficient Performance Indicator Read Acpi P-T Notify Write & Read Caching Agent TOR Read Read Mode bit 11 = ‘0’Core ID Bit Read Mode bit 11 = ‘1’ Thermal Margin Read RdIAMSR Processor ID Enumeration 42. Processor ID Construction Example 11. RdIAMSR Services Summary Sheet 1 10. RdIAMSR Response DefinitionRdIAMSR Capabilities 11. RdIAMSR Services Summary Sheet 2 Or ID Address Meaning Sor ID Byte Dword RdPCIConfig 44. PCI Configuration Address Timely fashion. Retry is appropriate RdPCIConfigLocal12. RdPCIConfig Response Definition Appropriate 13. RdPCIConfigLocal Response Definition Sheet 1 PCI Configuration Address0x05 0x02,0x03,0x05 0xe1 Definition WrPCIConfigLocal 13. RdPCIConfigLocal Response Definition Sheet 2 0xe5 14. WrPCIConfigLocal Response DefinitionCmd Code Completion 16. Peci Client Response During Power-Up Sheet 1 Power-up SequencingWrPCIConfigLocal Capabilities Client Management 16. Peci Client Response During Power-Up Sheet 2 Device DiscoveryClient Addressing States 18. Power Impact of Peci Commands vs. C-statesCommand Power Impact 17. Socket ID Strapping Processor Reset System Service Processor SSP Mode SupportBMC Init Mode Processor Error Handling Originator Retry and Timeout PolicyLink Init Mode Enumerating Peci Client Capabilities Multi-Domain Commands20. Multi-Domain Command Code Reference 19. Domain ID Definition Completion Codes Client ResponsesAbort FCS 21. Completion Code Pass/Fail Mask Format DTS Temperature DataOriginator Responses Interpretation Error Code Description Temperature Filtering24. Error Codes and Descriptions Reserved Values Datasheet Volume One Intel Virtualization Technology Intel VT Intel VT-x Objectives Intel VT-x Features Intel VT-d Features SupportedIntel VT-d Objectives Security Technologies Intel Virtualization Technology Processor ExtensionsIntel Trusted Execution Technology Intel Trusted Execution Technology Server Extensions Intel Advanced Encryption Standard Instructions Intel AES-NI Execute Disable Bit Intel Turbo Boost Operating Frequency Intel Intelligent Power Technology Enhanced Intel SpeedStep TechnologyIntel Advanced Vector Extensions Intel AVX Intel Dynamic Power Technology Intel DPT Technologies System States Acpi States SupportedSystem States Package C-State Support Sheet 1 Package C-State Support Sheet 2 System Memory Power States Sheet 1Integrated Memory Controller States Core C-State Support 4 DMI2/PCI Express Link States Intel QuickPath Interconnect States6 G, S, and C State Combinations Processor Core/Package Power Management Low-Power Idle StatesEnhanced Intel SpeedStep Technology Requesting Low-Power Idle States Idle Power Management Breakdown of the Processor Cores Core C1/C1E State Core C-statesCore C0 State PLVLx to Mwait Conversion Core C7 State Core C3 StateCore C6 State State Auto-Demotion Package C-States Package C1/C1E Coordination of Core Power States at the Package LevelPackage C0 Package C-State Core Package C2 State Package C3 StatePackage C6 State 10. Package C-State Power Specifications System Memory Power ManagementPackage C-State Power Specifications TDP SKUs C1E W C3 W C6 W Core / 6-Core Self Refresh Entry CKE Power-DownSelf Refresh Self Refresh Exit DMI2/PCI Express* Power Management Dram I/O Power ManagementDLL and PLL Shutdown 100 Package Thermal Specifications Thermal Specifications Tcase and DTS Based Thermal Specifications Temperaturetarget MSR 3.1 8-Core 150W Thermal Specifications Processor Thermal ProfilesProcessor SKU Summary Table Thermal Management Specifications Power W Maximum T Case C Maximum Dtsc Core 150W Thermal Profile, Workstation Platform SKU Only 3.2 8-Core 135W Thermal Specifications Tcase 8-Core 135W Thermal Specifications 2U3, 4 Power W Maximum Tcase C Maximum DTS C Core 135W Thermal Profile U Sheet 1 3.3 8/6-Core 130W Thermal Specifications Power W Maximum T Case C Maximum DTS CCore 135W Thermal Profile U Sheet 2 Tcase 8/6-Core 130W Thermal Profile 1U Power W Maximum Tcase C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 1 Power W Maximum T Case C Maximum DTS C Core 3.4 6-Core 130W 1S WS Thermal SpecificationsTcase 6-Core 130W 1S WS Thermal Specifications 6-Core 130W Thermal Profile U Sheet 2 DTS 6-Core 130W 1S WS Thermal Profile Core 130W 1S WS Thermal Profile Table Sheet 1 3.5 8-Core 115W Thermal Specifications 10. Tcase 8-Core 115W Thermal Specifications 1UCore 130W 1S WS Thermal Profile Table Sheet 2 10. Tcase 8-Core 115W Thermal Profile 1U 3.6 8/6-Core 95W Thermal Specifications 11 -Core 115W Thermal Profile U 12. Tcase 8/6-Core 95W Thermal Profile 1U 14. DTS 6-Core 95W Thermal Profile 1U 13 /6-Core 95W Thermal Profile U Sheet 1 3.7 8-Core 70W Thermal Specifications 14. Tcase 8-Core 70W Thermal Specifications 1U13 /6-Core 95W Thermal Profile U Sheet 2 16. DTS 8-Core 70W Thermal Profile 1U 15 -Core 70W Thermal Profile U 3.8 6-Core 60W Thermal Specifications 16. Tcase 6-Core 60W Thermal Specifications 1U 18. DTS 6-Core 60W Thermal Profile 1U 17 -Core 60W Thermal Profile U 3.9 4-Core 130W Thermal Specifications 18. Tcase 4-Core 130W Thermal Specifications 2U 20. DTS 4-Core 130W Thermal Profile 2U 19 -Core 130W Thermal Profile U Sheet 1 3.10 4-Core 130W 1S WS Thermal Specifications 19 -Core 130W Thermal Profile U Sheet 2 21. Tcase 4-Core 130W 1S WS Thermal Profile 3.11 4-Core 95W Thermal Specifications 22. Tcase 4-Core 95W Thermal Specifications 1U21 -Core 130W 1S WS Thermal Profile Table 23. Tcase 4-Core 95W Thermal Profile 1U 3.12 4/2-Core 80W Thermal Specifications 24. Tcase 4/2-Core 80W Thermal Specifications 1U23 -Core 95W Thermal Profile U 25. Tcase 4/2-Core 80W Thermal Profile 1U Maximum Tcase Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 1 Embedded Server Processor Thermal Profiles 4.1 8-Core LV95W Thermal SpecificationsMaximum T Case Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 2 28. Tcase 8-Core LV95W Thermal Profile, Embedded Server SKU 29. DTS 8-Core LV95W Thermal Profile, Embedded Server SKU 4.2 8-Core LV70W Thermal Specifications 30. Tcase 8-Core LV70W Thermal Profile, Embedded Server SKU 31. DTS 8-Core LV70W Thermal Profile, Embedded Server SKU 32. Case Temperature Tcase Measurement Location Thermal Metrology Processor Core Thermal Features Processor TemperatureAdaptive Thermal Monitor Frequency/SVID Control 33. Frequency and Voltage Ordering On-Demand Mode Prochotn SignalClock Modulation Thermtripn Signal Integrated Memory Controller IMC Thermal FeaturesDram Throttling Options MEMHOTC01N and MEMHOTC23N Signal Hybrid Closed Loop Thermal Throttling CLTTHybridIntegrated Dual SMBus Master Controllers for SMI System Memory Interface Signals Signal Name DescriptionMemory Channel DDR0, DDR1, DDR2, DDR3 PCI Express* Port 2 Signals Sheet 1 PCI Express* Based Interface SignalsPCI Express* Port 1 Signals Memory Channel Miscellaneous PCI Express* Port 2 Signals Sheet 2 PCI Express* Port 3 SignalsPCI Express* Miscellaneous Signals Sheet 1 DMI2/PCI Express* Port 0 Signals Intel QuickPath Interconnect Signals Peci Signal System Reference Clock SignalsJtag and TAP Signals 13. Svid Signals Serial VID Interface Svid SignalsProcessor Asynchronous Sideband and Miscellaneous Signals 14. Processor Asynchronous Sideband Signals Sheet 1 14. Processor Asynchronous Sideband Signals Sheet 2 15. Miscellaneous Signals Processor Power and Ground Supplies14. Processor Asynchronous Sideband Signals Sheet 3 16. Power and Ground Signals Sheet 1 16. Power and Ground Signals Sheet 2 152 PCI Express* Signals Processor SignalingSystem Memory Interface Signal Groups 3 DMI2/PCI Express* Signals Platform Environmental Control Interface Peci System Reference Clocks BCLK0/1DP, BCLK0/ 1DNInput Device Hysteresis Power, Ground and Sense Signals Jtag and Test Access Port TAP SignalsProcessor Sideband Signals PLL Power Supply Decoupling Guidelines Power and Ground LandsPower Number Comments Ground Lands Voltage Identification VID SetVID Slow Command Svid CommandsSetVID Fast Command SetVID-Decay Command Svid Power State Functions SetPS VR Power-State Transitions PWM Address HEX Processor Svid Voltage Rail AddressingSvid Address Usage 159 Signal Description Buffer Types Sheet 1 Signal Group SummaryReserved or Unused Signals Signal Description Signal Description Buffer Types Sheet 2 Signal Groups Sheet 1 Signal Groups Sheet 2 Processor Asynchronous Sideband Signals Signal Groups Sheet 3Serial VID Interface Svid Signals Miscellaneous Signals Power-On Configuration Option Lands Power-On Configuration POC OptionsSignals with On-Die Termination Signal Name Pull Up /Pull Rail Value Units Down Output Tri-State Signal Groups Signals Fault Resilient Booting FRBFault Resilient Booting Output Tri-State Signals Mixing Processors Absolute Maximum and Minimum Ratings Symbol Parameter Min Max UnitFlexible Motherboard Guidelines FMB Processor Absolute Minimum and Maximum Ratings Storage Conditions Specifications 10. Storage Condition Ratings DC Specifications Symbol Parameter Voltage Min Typ Max Unit Plane Voltage and Current Specifications11. Voltage Specification VCC VID Max a Definition 12. Processor Current SpecificationsParameter Symbol Processor TDP / Core Count Core/6-core 13 /6 Core Processor VCC Static and Transient Tolerance CC a ICC a VID 3,4,5,6 100 105 110 115 120 125 130 135 140 145 150 174 Symbol Parameter Min Max Units VCC Overshoot Specifications15. VCC Overshoot Specifications Sheet 1 Die Voltage Validation Signal DC Specifications 15. VCC Overshoot Specifications Sheet 216. DDR3 and DDR3L Signal DC Specifications Sheet 1 Command Signals 16. DDR3 and DDR3L Signal DC Specifications Sheet 2Reference Clock Signal Control Signals 19. SMBus DC Specifications Sheet 1 17. Peci DC Specifications18. System Reference Clock BCLK0/1 DC Specifications Symbol Definition and Conditions Min Max Units 21. Serial VID Interface Svid DC Specifications Sheet 1 19. SMBus DC Specifications Sheet 220. Jtag and TAP Signals DC Specifications Symbol Parameter Min Typ Max Units CMOS1.05v Signals 21. Serial VID Interface Svid DC Specifications Sheet 222. Processor Asynchronous Sideband DC Specifications Open Drain Cmos Odcmos Signals Intel QuickPath Interconnect DC Specifications PCI Express* DC Specifications3.2 DMI2/PCI Express* DC Specifications Reset and Miscellaneous Signal DC Specifications Vcross MAX = 550mV StableVRB-Differential Vcross MIN = 250mV Signal Quality 1 DDR3 Signal Quality Specifications2 I/O Signal Quality Specifications 24. Processor I/O Overshoot/Undershoot Specifications Intel QuickPath Interconnect Signal Quality SpecificationsInput Reference Clock Signal Quality Specifications Overshoot/Undershoot Tolerance Reading Overshoot/Undershoot Specification Tables Overshoot/Undershoot Pulse DurationActivity Factor 11. Maximum Acceptable Overshoot/Undershoot Waveform Land Name Sheet 2 Listing by Land NameLand Name Sheet 1 Land Name Land No Buffer Type Direction Land Name Sheet 3 Land Name Sheet 4 Land Name Sheet 5 Land Name Sheet 6 Land Name Sheet 7 Land Name Sheet 8 Land Name Sheet 9 Land Name Sheet 10 Land Name Sheet 11 Land Name Sheet 12 Land Name Sheet 13 Land Name Sheet 14 Land Name Sheet 15 Land Name Sheet 16 Land Name Sheet 17 Land Name Sheet 18 Land Name Sheet 19 Land Name Sheet 20 Land Name Sheet 21 Land Name Sheet 22 Land Name Sheet 23 Land Name Sheet 24 Land Name Sheet 25 Land Name Sheet 26 Land Name Sheet 27 Land Name Sheet 28 Land Name Sheet 29 Land Name Sheet 30 Land Name Sheet 31 Land Name Sheet 32 VCCD01 Land Name Sheet 33Land Name Sheet 34 VCCD23 Land Name Sheet 35 Land Name Sheet 36 Land Name Sheet 37 Land Name Sheet 38 Land Name Sheet 39 Land Name Sheet 40 Land Name Sheet 41 Land Name Sheet 42 Land Name Sheet 43 Land Name Sheet 44 Land Name Sheet 45 Land Name Sheet 46 Vtta Land Name Sheet 47Land Name Sheet 48 Vttd Land Name Sheet 49 Land Number Sheet 2 Listing by Land NumberLand Number Sheet 1 Land No Land Name Buffer Type Direction Land Number Sheet 3 Land Number Sheet 4 Land Number Sheet 5 Land Number Sheet 6 Land Number Sheet 7 Land Number Sheet 8 Land Number Sheet 9 Land Number Sheet 10 Land Number Sheet 11 Land Number Sheet 12 Land Number Sheet 13 Land Number Sheet 14 Land Number Sheet 15 Land Number Sheet 16 Land Number Sheet 17 Land Number Sheet 18 Land Number Sheet 19 Land Number Sheet 20 Land Number Sheet 21 Land Number Sheet 22 Land Number Sheet 23 Land Number Sheet 24 Land Number Sheet 25 Land Number Sheet 26 Land Number Sheet 27 Land Number Sheet 28 Land Number Sheet 29 Land Number Sheet 30 Land Number Sheet 31 Land Number Sheet 32 Land Number Sheet 33 Land Number Sheet 34 Land Number Sheet 35 Land Number Sheet 36 Land Number Sheet 37 Land Number Sheet 38 Land Number Sheet 39 Land Number Sheet 40 Land Number Sheet 41 Land Number Sheet 42 Land Number Sheet 43 Land Number Sheet 44 Land Number Sheet 45 Land Number Sheet 46 Land Number Sheet 47 Land Number Sheet 48 236 Processor Package Assembly Sketch Package Mechanical Drawing 238 Processor Package Drawing Sheet 1 Processor Package Drawing Sheet 2 Processor Component Keep-Out Zones Package Loading SpecificationsPackage Insertion Specifications Package Handling Guidelines Processor Markings Processor Mass SpecificationProcessor Materials Processor Materials Boxed Processor Specifications Available Boxed Thermal Solution Configurations 244 Mechanical Specifications STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks Motherboard Keepout Zones 1 246 Boxed Processor Specifications Motherboard Keepout Zones 2 Boxed Processor Motherboard Keepout Zones 3 248 Motherboard Keepout Zones 4 TOP Surface of Motherboard Boxed Processor Heat Sink Volumetric 1 250 Processor Heat Sink Volumetric 2Specifications Boxed Processor 10.4-Pin Fan Cable Connector For Active Heat Sink 11 -Pin Base Baseboard Fan Header For Active Heat Sink Fan Power Supply STS200C 21,000 25,000 28,000 Boxed Processor Cooling Requirements Boxed Processor Contents Boxed Processor 258