Thermal Management Specifications

5.1.3Processor Thermal Profiles

Table 5-1. Processor SKU Summary Table

 

 

TDP SKUs

 

Thermal Profile

 

 

 

 

 

 

 

 

Tcase

 

DTS

 

 

 

 

8-Core / 6-Core

 

 

 

 

 

 

 

 

150W

(8-core)

Figure 5-1

 

Figure 5-2

 

 

 

 

 

135W

(8-core)

Figure 5-3

 

Figure 5-4

 

 

 

 

 

130W

(8-core)

Figure 5-5

 

Figure 5-6

 

 

 

 

 

130W

(6-core)

Figure 5-5

 

Figure 5-7

 

 

 

 

 

130W

(6-core 1S WS)

Figure 5-8

 

Figure 5-9

 

 

 

 

 

115W

(8-core)

Figure 5-10

 

Figure 5-11

 

 

 

 

 

95W

(8-core)

Figure 5-12

 

Figure 5-13

 

 

 

 

 

95W

(6-core)

Figure 5-12

 

Figure 5-14

 

 

 

 

 

70W

(8-core)

Figure 5-15

 

Figure 5-16

 

 

 

 

 

60W

(6-core)

Figure 5-17

 

Figure 5-18

 

 

 

 

4-Core / 2-Core

 

 

 

 

 

 

 

 

130W

(4-core)

Figure 5-19

 

Figure 5-20

 

 

 

 

 

130W

(4-core 1S WS)

Figure 5-21

 

Figure 5-22

 

 

 

 

 

95W

(4-core)1

Figure 5-23

 

Figure 5-24

80W

(4-core)

Figure 5-25

 

Figure 5-26

 

 

 

 

 

80W

(2-core)

Figure 5-25

 

Figure 5-27

 

 

 

 

 

 

1. Applies only to Intel® Xeon® Processor E5-4600 Product Family.

5.1.3.18-Core 150W Thermal Specifications

Table 5-2. Tcase: 8-Core 150W Thermal Specifications, Workstation Platform SKU Only

Core

Thermal Design

Minimum

Maximum

Notes

Frequency

Power (W)

TCASE (°C)

TCASE (°C)

 

Launch to FMB

150

5

See Figure 5-1and Table 5-3

1, 2, 3, 4, 5, 6

 

 

 

 

 

Notes:

1.These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.

2.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

3.These specifications are based on final silicon characterization.

4.Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency.

5.FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements.

6.The 150W TDP SKU is intended for the dual processor workstations only and uses workstation specific use conditions for reliability assumptions.

104

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

 

Datasheet Volume One

Page 103 Page 105
Page 104
Image 104
Intel CM8062101038606 Processor Thermal Profiles, 3.1 8-Core 150W Thermal Specifications, Processor SKU Summary Table
Page 103 Page 105
Top Page Image Contents