Thermal Management Specifications

1.Some processor units may be tested to lower TDP and the TEMPERATURE_TARGET MSR will be aligned to that lower TDP.

2.Please refer to Table 5-23for discrete points that constitute the thermal profile.

3.Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.

Table 5-23. 4-Core 95W Thermal Profile Table 1U

Power (W)

Maximum TCASE (°C)

Maximum DTS (°C)

 

4-core

4-core

 

 

 

0

52.7

52.7

 

 

 

5

53.9

54.7

 

 

 

10

55.1

56.7

 

 

 

15

56.2

58.8

 

 

 

20

57.4

60.8

 

 

 

25

58.6

62.8

 

 

 

30

59.8

64.8

 

 

 

35

60.9

66.8

 

 

 

40

62.1

68.9

 

 

 

45

63.3

70.1

 

 

 

50

64.5

72.9

 

 

 

55

65.6

74.9

 

 

 

60

66.8

76.9

 

 

 

65

68.0

79.0

 

 

 

70

69.2

81.0

 

 

 

75

70.3

83.0

 

 

 

80

71.5

85.0

 

 

 

85

72.7

87.0

 

 

 

90

73.9

89.1

 

 

 

95

75.0

91.1

 

 

 

5.1.3.124/2-Core 80W Thermal Specifications

Table 5-24. Tcase: 4/2-Core 80W Thermal Specifications 1U

Core

Thermal Design

Minimum

Maximum

Notes

Frequency

Power (W)

TCASE (°C)

TCASE (°C)

 

Launch to FMB

80

5

See Figure 5-25and Table 5-25

1, 2, 3, 4, 5

 

 

 

 

 

Notes:

1.These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.

2.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

3.These specifications are based on final silicon characterization.

4.Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency.

5.FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements.

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

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Datasheet Volume One

 

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Intel E5-4600, CM8062101038606, E5-2600, E5-1600 manual 3.12 4/2-Core 80W Thermal Specifications, Core 95W Thermal Profile U