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Intel CM8062101038606, E5-4600, E5-2600, E5-1600 manual Land Number Sheet 17, Land Number Sheet 18

Models: E5-2600 E5-4600 E5-1600 CM8062101038606

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Processor Land Listing

Table 8-2.		Land Number (Sheet 17 of 48)

Land No.		Land Name	Buffer Type	Direction

BN43		VSS	GND

BN45		VSS	GND

BN47		RSVD

BN49		QPI0_DRX_DN[18]	QPI	I

BN5		VCC	PWR

BN51		QPI0_DRX_DP[15]	QPI	I

BN53		QPI0_DRX_DN[13]	QPI	I

BN55		QPI0_DRX_DN[11]	QPI	I

BN57		QPI0_DRX_DN[09]	QPI	I

BN7		VCC	PWR

BN9		VCC	PWR

BP10		VCC	PWR

BP12		VCC	PWR

BP14		VCC	PWR

BP16		VCC	PWR

BP2		VCC	PWR

BP4		VCC	PWR

BP42		VTTD_SENSE		O

BP44		RSVD

BP46		RSVD

BP48		QPI0_DRX_DP[19]	QPI	I

BP50		QPI0_DRX_DN[16]	QPI	I

BP52		QPI0_DRX_DN[14]	QPI	I

BP54		QPI0_DRX_DN[12]	QPI	I

BP56		QPI0_DRX_DN[10]	QPI	I

BP58		VSS	GND

BP6		VCC	PWR

BP8		VCC	PWR

BR1		VCC	PWR

BR11		VCC	PWR

BR13		VCC	PWR

BR15		VCC	PWR

BR17		VCC	PWR

BR3		VCC	PWR

BR43		RSVD

BR45		SVIDDATA	ODCMOS	I/O

BR47		RSVD

BR49		QPI0_DRX_DP[18]	QPI	I

BR5		VCC	PWR

BR51		QPI0_DRX_DN[15]	QPI	I

BR53		VSS	GND

BR55		VTTD	PWR

Table 8-2.		Land Number (Sheet 18 of 48)

Land No.		Land Name	Buffer Type	Direction

BR57		VSS	GND

BR7		VCC	PWR

BR9		VCC	PWR

BT10		VCC	PWR

BT12		VCC	PWR

BT14		VCC	PWR

BT16		VCC	PWR

BT2		VCC	PWR

BT4		VCC	PWR

BT42		VSS_VTTD_SENSE		O

BT44		RSVD

BT46		VSS	GND

BT48		VSS	GND

BT50		VSS	GND

BT52		VSS	GND

BT54		VSS	GND

BT56		VSS	GND

BT58		QPI0_DTX_DP[05]	QPI	O

BT6		VCC	PWR

BT8		VCC	PWR

BU1		VCC	PWR

BU11		VCC	PWR

BU13		VCC	PWR

BU15		VCC	PWR

BU17		VCC	PWR

BU3		VCC	PWR

BU43		RSVD

BU45		VSS	GND

BU47		VTTD	PWR

BU49		SKTOCC_N		O

BU5		VCC	PWR

BU51		VSS	GND

BU53		QPI0_DTX_DP[02]	QPI	O

BU55		QPI0_DTX_DP[04]	QPI	O

BU57		QPI0_DTX_DP[07]	QPI	O

BU7		VCC	PWR

BU9		VCC	PWR

BV10		VCC	PWR

BV12		VCC	PWR

BV14		VCC	PWR

BV16		VCC	PWR

BV2		VCC	PWR

220	Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
	Datasheet Volume One

Image 220

Intel CM8062101038606, E5-4600, E5-2600, E5-1600 manual Land Number Sheet 17, Land Number Sheet 18

Contents

Datasheet Volume One MayPage Contents Package Thermal Specifications Mechanical Specifications 245 10.2.1 Figures Tcase 8-Core 135W Thermal Profile 2U Tables Core 150W Thermal Profile, Workstation Platform SKU Only Fault Resilient Booting Output Tri-State Signals Revision Description Revision Date Number Initial Release MarchDatasheet Volume One Overview IntroductionProcessor Feature Details Supported Technologies InterfacesSystem Memory Support PCI Express NTB Intel QuickPath Interconnect Intel QPI Direct Media Interface Gen 2 DMI2Link Power Management Support Platform Environment Control Interface PeciProcessor Package and Core States System States SupportThermal Management Support Package SummaryTerminology Intel QuickPath InterconnectIMC IIOIHS IOVLLC LrdimmNctf NebsRelated Documents TDPTsod UdimmState of Data Referenced Documents Sheet 2System Memory Technology Support System Memory InterfaceSystem Memory Timing Support PCI Express* Interface PCI Express* ArchitecturePCI Express* Configuration Mechanism Transaction LayerData Link Layer Physical Layer1 DMI2 Error Flow DMI2/PCI Express* InterfaceIntel QuickPath Interconnect Processor/PCH Compatibility AssumptionsInterfaces Summary of Processor-specific Peci Commands Command Supported on the ProcessorPlatform Environment Control Interface Peci Peci Client CapabilitiesClient Command Suite Processor Interface Tuning and DiagnosticsThermal Management Platform ManageabilityGetDIB Minor Revision Supported Command Suite Device InfoRevision Number Minor Revision Number MeaningClient Address Write Length Read Length GetTempTemp70 Temp158 RdPkgConfig Supported ResponsesGetTemp Response Definition Response MeaningWrPkgConfig RdPkgConfig Response DefinitionWrPkgConfig Response Definition Sheet 1 Electrical error or AW FCS failureWrPkgConfig Response Definition Sheet 2 Package Configuration CapabilitiesDram Thermal and Power Optimization Capabilities Temperature Dram PowerBy power Dram RankDram Thermal Estimation Configuration Data Read/Write Limit DataLimit PerformanceDram Rank Temperature Write Dimm Temperature ReadChannel & Dimm Index Decoding Index Encoding Physical Channel# Physical DIMM#Dram Channel Temperature Read Dimm Ambient Temperature Write / ReadDIMM# Accumulated Dram Energy Read Dram Power Info ReadAccumulated Dram Energy Data Maximum Time Dram Power Limit Data Write / ReadTypical Value Dram Powerlimit Dram Power Limit Performance Status ReadReserved CPU Thermal and Power Optimization Capabilities CpuidCSR did CSR McaerrsrclogRead Mode bit Accumulated Power Limit forVCC Power Read statusRead Package Power Modes Package PowerIndicator Read Limits ForPackage Identifier Read ProcessorType FlagPackage Power SKU Unit Read Max ThreadPackage Power SKU Read Power Control Register Unit CalculationsUnit Field Value Calculation Default Value Wake on Peci Mode Bit Write / Read Package Temperature ReadMaximum Package Power Window Peci TemperatureTemperature Target Read Per Core DTS Temperature ReadPackage Thermal Status Read / Clear Thermal Averaging Constant Write / Read Thermally Constrained Time ReadCurrent Limit Read 4 3 2 1Power Limit for the VCC Power Plane Write / Read Accumulated Energy Status ReadControl Time Clamp Power Limit Package Power Limits For Multiple Turbo ModesMode Enable Package Power Limit Performance Status Read Window #2 Mode #2 Enable #2Efficient Performance Indicator Read Acpi P-T Notify Write & ReadRead Mode bit 11 = ‘0’ Core ID Bit Read Mode bit 11 = ‘1’Caching Agent TOR Read Thermal Margin ReadRdIAMSR Processor ID Enumeration42. Processor ID Construction Example 10. RdIAMSR Response Definition 11. RdIAMSR Services Summary Sheet 1RdIAMSR Capabilities 11. RdIAMSR Services Summary Sheet 2 Or ID Address Meaning Sor ID Byte DwordRdPCIConfig 44. PCI Configuration AddressRdPCIConfigLocal 12. RdPCIConfig Response DefinitionTimely fashion. Retry is appropriate AppropriatePCI Configuration Address 13. RdPCIConfigLocal Response Definition Sheet 10x05 0x02,0x03,0x05 0xe1 Definition WrPCIConfigLocal 13. RdPCIConfigLocal Response Definition Sheet 214. WrPCIConfigLocal Response Definition Cmd Code0xe5 CompletionPower-up Sequencing WrPCIConfigLocal Capabilities16. Peci Client Response During Power-Up Sheet 1 Client ManagementDevice Discovery 16. Peci Client Response During Power-Up Sheet 2Client Addressing 18. Power Impact of Peci Commands vs. C-states Command Power ImpactStates 17. Socket ID StrappingSystem Service Processor SSP Mode Support Processor ResetBMC Init Mode Originator Retry and Timeout Policy Processor Error HandlingLink Init Mode Multi-Domain Commands 20. Multi-Domain Command Code ReferenceEnumerating Peci Client Capabilities 19. Domain ID DefinitionClient Responses Abort FCSCompletion Codes 21. Completion Code Pass/Fail MaskDTS Temperature Data Originator ResponsesFormat InterpretationTemperature Filtering 24. Error Codes and DescriptionsError Code Description Reserved ValuesDatasheet Volume One Intel Virtualization Technology Intel VT Intel VT-x ObjectivesIntel VT-d Features Supported Intel VT-x FeaturesIntel VT-d Objectives Intel Virtualization Technology Processor Extensions Security TechnologiesIntel Trusted Execution Technology Intel Trusted Execution Technology Server Extensions Intel Advanced Encryption Standard Instructions Intel AES-NIExecute Disable Bit Intel Turbo Boost Operating FrequencyEnhanced Intel SpeedStep Technology Intel Intelligent Power TechnologyIntel Advanced Vector Extensions Intel AVX Intel Dynamic Power Technology Intel DPT Technologies Acpi States Supported System StatesSystem States Package C-State Support Sheet 1System Memory Power States Sheet 1 Integrated Memory Controller StatesPackage C-State Support Sheet 2 Core C-State SupportIntel QuickPath Interconnect States 4 DMI2/PCI Express Link States6 G, S, and C State Combinations Low-Power Idle States Processor Core/Package Power ManagementEnhanced Intel SpeedStep Technology Requesting Low-Power Idle States Idle Power Management Breakdown of the Processor CoresCore C-states Core C0 StateCore C1/C1E State PLVLx to Mwait ConversionCore C3 State Core C6 StateCore C7 State State Auto-DemotionPackage C-States Coordination of Core Power States at the Package Level Package C0Package C1/C1E Package C-State CorePackage C3 State Package C2 StatePackage C6 State System Memory Power Management Package C-State Power Specifications10. Package C-State Power Specifications TDP SKUs C1E W C3 W C6 W Core / 6-CoreCKE Power-Down Self RefreshSelf Refresh Entry Self Refresh ExitDram I/O Power Management DMI2/PCI Express* Power ManagementDLL and PLL Shutdown 100 Package Thermal Specifications Thermal SpecificationsTcase and DTS Based Thermal Specifications Temperaturetarget MSR Processor Thermal Profiles 3.1 8-Core 150W Thermal SpecificationsProcessor SKU Summary Table Thermal Management Specifications Power W Maximum T Case C Maximum Dtsc Core 150W Thermal Profile, Workstation Platform SKU OnlyTcase 8-Core 135W Thermal Specifications 2U 3.2 8-Core 135W Thermal Specifications3, 4 Power W Maximum Tcase C Maximum DTS C Core 135W Thermal Profile U Sheet 1Power W Maximum T Case C Maximum DTS C 3.3 8/6-Core 130W Thermal SpecificationsCore 135W Thermal Profile U Sheet 2 Tcase 8/6-Core 130W Thermal Profile 1U Power W Maximum Tcase C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 13.4 6-Core 130W 1S WS Thermal Specifications Tcase 6-Core 130W 1S WS Thermal SpecificationsPower W Maximum T Case C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 2DTS 6-Core 130W 1S WS Thermal Profile Core 130W 1S WS Thermal Profile Table Sheet 110. Tcase 8-Core 115W Thermal Specifications 1U 3.5 8-Core 115W Thermal SpecificationsCore 130W 1S WS Thermal Profile Table Sheet 2 10. Tcase 8-Core 115W Thermal Profile 1U 3.6 8/6-Core 95W Thermal Specifications 11 -Core 115W Thermal Profile U12. Tcase 8/6-Core 95W Thermal Profile 1U 14. DTS 6-Core 95W Thermal Profile 1U 13 /6-Core 95W Thermal Profile U Sheet 114. Tcase 8-Core 70W Thermal Specifications 1U 3.7 8-Core 70W Thermal Specifications13 /6-Core 95W Thermal Profile U Sheet 2 16. DTS 8-Core 70W Thermal Profile 1U 15 -Core 70W Thermal Profile U3.8 6-Core 60W Thermal Specifications 16. Tcase 6-Core 60W Thermal Specifications 1U18. DTS 6-Core 60W Thermal Profile 1U 17 -Core 60W Thermal Profile U3.9 4-Core 130W Thermal Specifications 18. Tcase 4-Core 130W Thermal Specifications 2U20. DTS 4-Core 130W Thermal Profile 2U 19 -Core 130W Thermal Profile U Sheet 13.10 4-Core 130W 1S WS Thermal Specifications 19 -Core 130W Thermal Profile U Sheet 221. Tcase 4-Core 130W 1S WS Thermal Profile 22. Tcase 4-Core 95W Thermal Specifications 1U 3.11 4-Core 95W Thermal Specifications21 -Core 130W 1S WS Thermal Profile Table 23. Tcase 4-Core 95W Thermal Profile 1U 24. Tcase 4/2-Core 80W Thermal Specifications 1U 3.12 4/2-Core 80W Thermal Specifications23 -Core 95W Thermal Profile U 25. Tcase 4/2-Core 80W Thermal Profile 1U Maximum Tcase Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 14.1 8-Core LV95W Thermal Specifications Maximum T Case Maximum DTS C Power W CoreEmbedded Server Processor Thermal Profiles 25 /2-Core 80W Thermal Profile U Sheet 228. Tcase 8-Core LV95W Thermal Profile, Embedded Server SKU 29. DTS 8-Core LV95W Thermal Profile, Embedded Server SKU 4.2 8-Core LV70W Thermal Specifications 30. Tcase 8-Core LV70W Thermal Profile, Embedded Server SKU31. DTS 8-Core LV70W Thermal Profile, Embedded Server SKU 32. Case Temperature Tcase Measurement Location Thermal MetrologyProcessor Temperature Processor Core Thermal FeaturesAdaptive Thermal Monitor Frequency/SVID Control 33. Frequency and Voltage OrderingProchotn Signal On-Demand ModeClock Modulation Integrated Memory Controller IMC Thermal Features Thermtripn SignalDram Throttling Options Hybrid Closed Loop Thermal Throttling CLTTHybrid MEMHOTC01N and MEMHOTC23N SignalIntegrated Dual SMBus Master Controllers for SMI Signal Name Description System Memory Interface SignalsMemory Channel DDR0, DDR1, DDR2, DDR3 PCI Express* Based Interface Signals PCI Express* Port 1 SignalsPCI Express* Port 2 Signals Sheet 1 Memory Channel MiscellaneousPCI Express* Port 3 Signals PCI Express* Port 2 Signals Sheet 2PCI Express* Miscellaneous Signals Sheet 1 DMI2/PCI Express* Port 0 Signals Intel QuickPath Interconnect SignalsSystem Reference Clock Signals Peci SignalJtag and TAP Signals Serial VID Interface Svid Signals Processor Asynchronous Sideband and Miscellaneous Signals13. Svid Signals 14. Processor Asynchronous Sideband Signals Sheet 114. Processor Asynchronous Sideband Signals Sheet 2 Processor Power and Ground Supplies 14. Processor Asynchronous Sideband Signals Sheet 315. Miscellaneous Signals 16. Power and Ground Signals Sheet 116. Power and Ground Signals Sheet 2 152 Processor Signaling System Memory Interface Signal GroupsPCI Express* Signals 3 DMI2/PCI Express* SignalsSystem Reference Clocks BCLK0/1DP, BCLK0/ 1DN Platform Environmental Control Interface PeciInput Device Hysteresis Jtag and Test Access Port TAP Signals Processor Sideband SignalsPower, Ground and Sense Signals PLL Power SupplyPower and Ground Lands Power Number Comments Ground LandsDecoupling Guidelines Voltage Identification VIDSvid Commands SetVID Fast CommandSetVID Slow Command SetVID-Decay CommandSvid Power State Functions SetPS VR Power-State TransitionsSvid Voltage Rail Addressing Svid Address UsagePWM Address HEX Processor 159Signal Group Summary Reserved or Unused SignalsSignal Description Buffer Types Sheet 1 Signal DescriptionSignal Description Buffer Types Sheet 2 Signal Groups Sheet 1Signal Groups Sheet 2 Signal Groups Sheet 3 Serial VID Interface Svid SignalsProcessor Asynchronous Sideband Signals Miscellaneous SignalsPower-On Configuration POC Options Signals with On-Die TerminationPower-On Configuration Option Lands Signal Name Pull Up /Pull Rail Value Units DownFault Resilient Booting FRB Fault Resilient Booting Output Tri-State SignalsOutput Tri-State Signal Groups Signals Mixing ProcessorsSymbol Parameter Min Max Unit Flexible Motherboard Guidelines FMBAbsolute Maximum and Minimum Ratings Processor Absolute Minimum and Maximum RatingsStorage Conditions Specifications 10. Storage Condition RatingsDC Specifications Voltage and Current Specifications 11. Voltage SpecificationSymbol Parameter Voltage Min Typ Max Unit Plane VCC VID12. Processor Current Specifications Parameter Symbol Processor TDP / Core CountMax a Definition Core/6-core13 /6 Core Processor VCC Static and Transient Tolerance CC aICC a VID 3,4,5,6 100 105 110 115 120 125 130 135 140 145 150 174 VCC Overshoot Specifications 15. VCC Overshoot Specifications Sheet 1Symbol Parameter Min Max Units Die Voltage Validation15. VCC Overshoot Specifications Sheet 2 Signal DC Specifications16. DDR3 and DDR3L Signal DC Specifications Sheet 1 16. DDR3 and DDR3L Signal DC Specifications Sheet 2 Reference Clock SignalCommand Signals Control Signals17. Peci DC Specifications 18. System Reference Clock BCLK0/1 DC Specifications19. SMBus DC Specifications Sheet 1 Symbol Definition and Conditions Min Max Units19. SMBus DC Specifications Sheet 2 20. Jtag and TAP Signals DC Specifications21. Serial VID Interface Svid DC Specifications Sheet 1 Symbol Parameter Min Typ Max Units21. Serial VID Interface Svid DC Specifications Sheet 2 22. Processor Asynchronous Sideband DC SpecificationsCMOS1.05v Signals Open Drain Cmos Odcmos SignalsPCI Express* DC Specifications 3.2 DMI2/PCI Express* DC SpecificationsIntel QuickPath Interconnect DC Specifications Reset and Miscellaneous Signal DC SpecificationsStable VRB-DifferentialVcross MAX = 550mV Vcross MIN = 250mV1 DDR3 Signal Quality Specifications Signal Quality2 I/O Signal Quality Specifications Intel QuickPath Interconnect Signal Quality Specifications Input Reference Clock Signal Quality Specifications24. Processor I/O Overshoot/Undershoot Specifications Overshoot/Undershoot ToleranceOvershoot/Undershoot Pulse Duration Reading Overshoot/Undershoot Specification TablesActivity Factor 11. Maximum Acceptable Overshoot/Undershoot Waveform Listing by Land Name Land Name Sheet 1Land Name Sheet 2 Land Name Land No Buffer Type DirectionLand Name Sheet 3 Land Name Sheet 4Land Name Sheet 5 Land Name Sheet 6Land Name Sheet 7 Land Name Sheet 8Land Name Sheet 9 Land Name Sheet 10Land Name Sheet 11 Land Name Sheet 12Land Name Sheet 13 Land Name Sheet 14Land Name Sheet 15 Land Name Sheet 16Land Name Sheet 17 Land Name Sheet 18Land Name Sheet 19 Land Name Sheet 20Land Name Sheet 21 Land Name Sheet 22Land Name Sheet 23 Land Name Sheet 24Land Name Sheet 25 Land Name Sheet 26Land Name Sheet 27 Land Name Sheet 28Land Name Sheet 29 Land Name Sheet 30Land Name Sheet 31 Land Name Sheet 32Land Name Sheet 33 Land Name Sheet 34VCCD01 VCCD23Land Name Sheet 35 Land Name Sheet 36Land Name Sheet 37 Land Name Sheet 38Land Name Sheet 39 Land Name Sheet 40Land Name Sheet 41 Land Name Sheet 42Land Name Sheet 43 Land Name Sheet 44Land Name Sheet 45 Land Name Sheet 46Land Name Sheet 47 Land Name Sheet 48Vtta VttdLand Name Sheet 49 Listing by Land Number Land Number Sheet 1Land Number Sheet 2 Land No Land Name Buffer Type DirectionLand Number Sheet 3 Land Number Sheet 4Land Number Sheet 5 Land Number Sheet 6Land Number Sheet 7 Land Number Sheet 8Land Number Sheet 9 Land Number Sheet 10Land Number Sheet 11 Land Number Sheet 12Land Number Sheet 13 Land Number Sheet 14Land Number Sheet 15 Land Number Sheet 16Land Number Sheet 17 Land Number Sheet 18Land Number Sheet 19 Land Number Sheet 20Land Number Sheet 21 Land Number Sheet 22Land Number Sheet 23 Land Number Sheet 24Land Number Sheet 25 Land Number Sheet 26Land Number Sheet 27 Land Number Sheet 28Land Number Sheet 29 Land Number Sheet 30Land Number Sheet 31 Land Number Sheet 32Land Number Sheet 33 Land Number Sheet 34Land Number Sheet 35 Land Number Sheet 36Land Number Sheet 37 Land Number Sheet 38Land Number Sheet 39 Land Number Sheet 40Land Number Sheet 41 Land Number Sheet 42Land Number Sheet 43 Land Number Sheet 44Land Number Sheet 45 Land Number Sheet 46Land Number Sheet 47 Land Number Sheet 48236 Processor Package Assembly Sketch Package Mechanical Drawing238 Processor Package Drawing Sheet 1 Processor Package Drawing Sheet 2 Package Loading Specifications Package Insertion SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesProcessor Mass Specification Processor MaterialsProcessor Markings Processor MaterialsBoxed Processor Specifications Available Boxed Thermal Solution Configurations244 Mechanical Specifications STS200P and STS200PNRW 25.5 mm Tall Passive Heat SinksMotherboard Keepout Zones 1 246Boxed Processor Specifications Motherboard Keepout Zones 2Boxed Processor Motherboard Keepout Zones 3 248Motherboard Keepout Zones 4 TOP Surface of MotherboardBoxed Processor Heat Sink Volumetric 1 250Heat Sink Volumetric 2 SpecificationsProcessor Boxed Processor10.4-Pin Fan Cable Connector For Active Heat Sink 11 -Pin Base Baseboard Fan Header For Active Heat Sink Fan Power Supply STS200C 21,000 25,000 28,000Boxed Processor Cooling Requirements Boxed Processor Contents Boxed Processor 258