Thermal Management Specifications

5.1.3.94-Core 130W Thermal Specifications

Table 5-18. Tcase: 4-Core 130W Thermal Specifications 2U

Core

Thermal Design

Minimum

Maximum

Notes

Frequency

Power (W)

TCASE (°C)

TCASE (°C)

 

Launch to FMB

130

5

See Figure 5-19and Table 5-19

1, 2, 3, 4, 5

 

 

 

 

 

Notes:

1.These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.

2.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

3.These specifications are based on final silicon characterization.

4.Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency.

5.FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements.

Figure 5-19. Tcase: 4-Core 130W Thermal Profile 2U

Notes:

1.This Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to Table 5-19for discrete points that constitute the thermal profile.

2.Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

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Datasheet Volume One

 

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Intel E5-1600, CM8062101038606, E5-4600 3.9 4-Core 130W Thermal Specifications, Tcase 4-Core 130W Thermal Specifications 2U