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Intel E5-2600, CM8062101038606, E5-4600, E5-1600 Fault Resilient Booting Output Tri-State Signals

Models: E5-2600 E5-4600 E5-1600 CM8062101038606

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7-8	Fault Resilient Booting (Output Tri-State) Signals	163
7-9	Processor Absolute Minimum and Maximum Ratings	164
7-10	Storage Condition Ratings	165
7-11	Voltage Specification	167
7-12	Processor Current Specifications	168
7-13	8/6 Core: Processor VCC Static and Transient Tolerance	169
7-14	4/2-Core: Processor VCC Static and Transient Tolerance	170
7-15	VCC Overshoot Specifications	173
7-16	DDR3 and DDR3L Signal DC Specifications	174
7-17	PECI DC Specifications	176
7-18	System Reference Clock (BCLK{0/1}) DC Specifications	176
7-19	SMBus DC Specifications	176
7-20	JTAG and TAP Signals DC Specifications	177
7-21	Serial VID Interface (SVID) DC Specifications	177
7-22	Processor Asynchronous Sideband DC Specifications	178
7-23	Miscellaneous Signals DC Specifications	179
7-24	Processor I/O Overshoot/Undershoot Specifications	182
7-25	Processor Sideband Signal Group Overshoot/Undershoot Tolerance	184
8-1	Land Name	187
8-2	Land Number	212
9-1	Processor Loading Specifications	241
9-2	Package Handling Guidelines	241
9-3	Processor Materials	242
10-1	PWM Fan Frequency Specifications For 4-Pin Active Thermal Solution	254
10-2	8 Core / 6 Core Server Thermal Solution Boundary Conditions	256
10-3	4 Core Server Thermal Solution Boundary Conditions	256

10	Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
	Datasheet Volume One

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Intel E5-2600, CM8062101038606, E5-4600, E5-1600 manual Fault Resilient Booting Output Tri-State Signals

Contents

Datasheet Volume One MayPage Contents Package Thermal Specifications Mechanical Specifications 245 10.2.1 Figures Tcase 8-Core 135W Thermal Profile 2U Tables Core 150W Thermal Profile, Workstation Platform SKU Only Fault Resilient Booting Output Tri-State Signals Revision Description Revision Date Number Initial Release MarchDatasheet Volume One Overview IntroductionProcessor Feature Details Supported Technologies InterfacesSystem Memory Support PCI Express NTB Intel QuickPath Interconnect Intel QPI Direct Media Interface Gen 2 DMI2Link Processor Package and Core States Power Management SupportPlatform Environment Control Interface Peci System States SupportTerminology Thermal Management SupportPackage Summary Intel QuickPath InterconnectIHS IMCIIO IOVNctf LLCLrdimm NebsTsod Related DocumentsTDP UdimmState of Data Referenced Documents Sheet 2System Memory Technology Support System Memory InterfaceSystem Memory Timing Support PCI Express* Interface PCI Express* ArchitectureData Link Layer PCI Express* Configuration MechanismTransaction Layer Physical LayerIntel QuickPath Interconnect 1 DMI2 Error FlowDMI2/PCI Express* Interface Processor/PCH Compatibility AssumptionsInterfaces Platform Environment Control Interface Peci Summary of Processor-specific Peci CommandsCommand Supported on the Processor Peci Client CapabilitiesThermal Management Client Command SuiteProcessor Interface Tuning and Diagnostics Platform ManageabilityGetDIB Revision Number Minor Revision Supported Command SuiteDevice Info Minor Revision Number MeaningClient Address Write Length Read Length GetTempTemp70 Temp158 GetTemp Response Definition RdPkgConfigSupported Responses Response MeaningWrPkgConfig RdPkgConfig Response DefinitionWrPkgConfig Response Definition Sheet 1 Electrical error or AW FCS failureWrPkgConfig Response Definition Sheet 2 Package Configuration CapabilitiesDram Thermal and Power Optimization Capabilities By power TemperatureDram Power Dram RankLimit Dram Thermal Estimation Configuration Data Read/WriteLimit Data PerformanceChannel & Dimm Index Decoding Dram Rank Temperature WriteDimm Temperature Read Index Encoding Physical Channel# Physical DIMM#Dram Channel Temperature Read Dimm Ambient Temperature Write / ReadDIMM# Accumulated Dram Energy Read Dram Power Info ReadAccumulated Dram Energy Data Maximum Time Dram Power Limit Data Write / ReadTypical Value Dram Powerlimit Dram Power Limit Performance Status ReadReserved CSR did CPU Thermal and Power Optimization CapabilitiesCpuid CSR McaerrsrclogVCC Power Read Mode bit AccumulatedPower Limit for Read statusIndicator Read Read Package PowerModes Package Power Limits ForType Package Identifier ReadProcessor FlagPackage Power SKU Unit Read Max ThreadPackage Power SKU Read Power Control Register Unit CalculationsUnit Field Value Calculation Default Value Maximum Package Power Window Wake on Peci Mode Bit Write / ReadPackage Temperature Read Peci TemperatureTemperature Target Read Per Core DTS Temperature ReadPackage Thermal Status Read / Clear Current Limit Read Thermal Averaging Constant Write / ReadThermally Constrained Time Read 4 3 2 1Power Limit for the VCC Power Plane Write / Read Accumulated Energy Status ReadControl Time Clamp Power Limit Package Power Limits For Multiple Turbo ModesMode Enable Package Power Limit Performance Status Read Window #2 Mode #2 Enable #2Efficient Performance Indicator Read Acpi P-T Notify Write & ReadCaching Agent TOR Read Read Mode bit 11 = ‘0’Core ID Bit Read Mode bit 11 = ‘1’ Thermal Margin ReadRdIAMSR Processor ID Enumeration42. Processor ID Construction Example 10. RdIAMSR Response Definition 11. RdIAMSR Services Summary Sheet 1RdIAMSR Capabilities 11. RdIAMSR Services Summary Sheet 2 Or ID Address Meaning Sor ID Byte DwordRdPCIConfig 44. PCI Configuration AddressTimely fashion. Retry is appropriate RdPCIConfigLocal12. RdPCIConfig Response Definition AppropriatePCI Configuration Address 13. RdPCIConfigLocal Response Definition Sheet 10x05 0x02,0x03,0x05 0xe1 Definition WrPCIConfigLocal 13. RdPCIConfigLocal Response Definition Sheet 20xe5 14. WrPCIConfigLocal Response DefinitionCmd Code Completion16. Peci Client Response During Power-Up Sheet 1 Power-up SequencingWrPCIConfigLocal Capabilities Client ManagementDevice Discovery 16. Peci Client Response During Power-Up Sheet 2Client Addressing States 18. Power Impact of Peci Commands vs. C-statesCommand Power Impact 17. Socket ID StrappingSystem Service Processor SSP Mode Support Processor ResetBMC Init Mode Originator Retry and Timeout Policy Processor Error HandlingLink Init Mode Enumerating Peci Client Capabilities Multi-Domain Commands20. Multi-Domain Command Code Reference 19. Domain ID DefinitionCompletion Codes Client ResponsesAbort FCS 21. Completion Code Pass/Fail MaskFormat DTS Temperature DataOriginator Responses InterpretationError Code Description Temperature Filtering24. Error Codes and Descriptions Reserved ValuesDatasheet Volume One Intel Virtualization Technology Intel VT Intel VT-x ObjectivesIntel VT-d Features Supported Intel VT-x FeaturesIntel VT-d Objectives Intel Virtualization Technology Processor Extensions Security TechnologiesIntel Trusted Execution Technology Intel Trusted Execution Technology Server Extensions Intel Advanced Encryption Standard Instructions Intel AES-NIExecute Disable Bit Intel Turbo Boost Operating FrequencyEnhanced Intel SpeedStep Technology Intel Intelligent Power TechnologyIntel Advanced Vector Extensions Intel AVX Intel Dynamic Power Technology Intel DPT Technologies System States Acpi States SupportedSystem States Package C-State Support Sheet 1Package C-State Support Sheet 2 System Memory Power States Sheet 1Integrated Memory Controller States Core C-State SupportIntel QuickPath Interconnect States 4 DMI2/PCI Express Link States6 G, S, and C State Combinations Low-Power Idle States Processor Core/Package Power ManagementEnhanced Intel SpeedStep Technology Requesting Low-Power Idle States Idle Power Management Breakdown of the Processor CoresCore C1/C1E State Core C-statesCore C0 State PLVLx to Mwait ConversionCore C7 State Core C3 StateCore C6 State State Auto-DemotionPackage C-States Package C1/C1E Coordination of Core Power States at the Package LevelPackage C0 Package C-State CorePackage C3 State Package C2 StatePackage C6 State 10. Package C-State Power Specifications System Memory Power ManagementPackage C-State Power Specifications TDP SKUs C1E W C3 W C6 W Core / 6-CoreSelf Refresh Entry CKE Power-DownSelf Refresh Self Refresh ExitDram I/O Power Management DMI2/PCI Express* Power ManagementDLL and PLL Shutdown 100 Package Thermal Specifications Thermal SpecificationsTcase and DTS Based Thermal Specifications Temperaturetarget MSR Processor Thermal Profiles 3.1 8-Core 150W Thermal SpecificationsProcessor SKU Summary Table Thermal Management Specifications Power W Maximum T Case C Maximum Dtsc Core 150W Thermal Profile, Workstation Platform SKU OnlyTcase 8-Core 135W Thermal Specifications 2U 3.2 8-Core 135W Thermal Specifications3, 4 Power W Maximum Tcase C Maximum DTS C Core 135W Thermal Profile U Sheet 1Power W Maximum T Case C Maximum DTS C 3.3 8/6-Core 130W Thermal SpecificationsCore 135W Thermal Profile U Sheet 2 Tcase 8/6-Core 130W Thermal Profile 1U Power W Maximum Tcase C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 1Power W Maximum T Case C Maximum DTS C Core 3.4 6-Core 130W 1S WS Thermal SpecificationsTcase 6-Core 130W 1S WS Thermal Specifications 6-Core 130W Thermal Profile U Sheet 2DTS 6-Core 130W 1S WS Thermal Profile Core 130W 1S WS Thermal Profile Table Sheet 110. Tcase 8-Core 115W Thermal Specifications 1U 3.5 8-Core 115W Thermal SpecificationsCore 130W 1S WS Thermal Profile Table Sheet 2 10. Tcase 8-Core 115W Thermal Profile 1U 3.6 8/6-Core 95W Thermal Specifications 11 -Core 115W Thermal Profile U12. Tcase 8/6-Core 95W Thermal Profile 1U 14. DTS 6-Core 95W Thermal Profile 1U 13 /6-Core 95W Thermal Profile U Sheet 114. Tcase 8-Core 70W Thermal Specifications 1U 3.7 8-Core 70W Thermal Specifications13 /6-Core 95W Thermal Profile U Sheet 2 16. DTS 8-Core 70W Thermal Profile 1U 15 -Core 70W Thermal Profile U3.8 6-Core 60W Thermal Specifications 16. Tcase 6-Core 60W Thermal Specifications 1U18. DTS 6-Core 60W Thermal Profile 1U 17 -Core 60W Thermal Profile U3.9 4-Core 130W Thermal Specifications 18. Tcase 4-Core 130W Thermal Specifications 2U20. DTS 4-Core 130W Thermal Profile 2U 19 -Core 130W Thermal Profile U Sheet 13.10 4-Core 130W 1S WS Thermal Specifications 19 -Core 130W Thermal Profile U Sheet 221. Tcase 4-Core 130W 1S WS Thermal Profile 22. Tcase 4-Core 95W Thermal Specifications 1U 3.11 4-Core 95W Thermal Specifications21 -Core 130W 1S WS Thermal Profile Table 23. Tcase 4-Core 95W Thermal Profile 1U 24. Tcase 4/2-Core 80W Thermal Specifications 1U 3.12 4/2-Core 80W Thermal Specifications23 -Core 95W Thermal Profile U 25. Tcase 4/2-Core 80W Thermal Profile 1U Maximum Tcase Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 1Embedded Server Processor Thermal Profiles 4.1 8-Core LV95W Thermal SpecificationsMaximum T Case Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 228. Tcase 8-Core LV95W Thermal Profile, Embedded Server SKU 29. DTS 8-Core LV95W Thermal Profile, Embedded Server SKU 4.2 8-Core LV70W Thermal Specifications 30. Tcase 8-Core LV70W Thermal Profile, Embedded Server SKU31. DTS 8-Core LV70W Thermal Profile, Embedded Server SKU 32. Case Temperature Tcase Measurement Location Thermal MetrologyProcessor Temperature Processor Core Thermal FeaturesAdaptive Thermal Monitor Frequency/SVID Control 33. Frequency and Voltage OrderingProchotn Signal On-Demand ModeClock Modulation Integrated Memory Controller IMC Thermal Features Thermtripn SignalDram Throttling Options Hybrid Closed Loop Thermal Throttling CLTTHybrid MEMHOTC01N and MEMHOTC23N SignalIntegrated Dual SMBus Master Controllers for SMI Signal Name Description System Memory Interface SignalsMemory Channel DDR0, DDR1, DDR2, DDR3 PCI Express* Port 2 Signals Sheet 1 PCI Express* Based Interface SignalsPCI Express* Port 1 Signals Memory Channel MiscellaneousPCI Express* Port 3 Signals PCI Express* Port 2 Signals Sheet 2PCI Express* Miscellaneous Signals Sheet 1 DMI2/PCI Express* Port 0 Signals Intel QuickPath Interconnect SignalsSystem Reference Clock Signals Peci SignalJtag and TAP Signals 13. Svid Signals Serial VID Interface Svid SignalsProcessor Asynchronous Sideband and Miscellaneous Signals 14. Processor Asynchronous Sideband Signals Sheet 114. Processor Asynchronous Sideband Signals Sheet 2 15. Miscellaneous Signals Processor Power and Ground Supplies14. Processor Asynchronous Sideband Signals Sheet 3 16. Power and Ground Signals Sheet 116. Power and Ground Signals Sheet 2 152 PCI Express* Signals Processor SignalingSystem Memory Interface Signal Groups 3 DMI2/PCI Express* SignalsSystem Reference Clocks BCLK0/1DP, BCLK0/ 1DN Platform Environmental Control Interface PeciInput Device Hysteresis Power, Ground and Sense Signals Jtag and Test Access Port TAP SignalsProcessor Sideband Signals PLL Power SupplyDecoupling Guidelines Power and Ground LandsPower Number Comments Ground Lands Voltage Identification VIDSetVID Slow Command Svid CommandsSetVID Fast Command SetVID-Decay CommandSvid Power State Functions SetPS VR Power-State TransitionsPWM Address HEX Processor Svid Voltage Rail AddressingSvid Address Usage 159Signal Description Buffer Types Sheet 1 Signal Group SummaryReserved or Unused Signals Signal DescriptionSignal Description Buffer Types Sheet 2 Signal Groups Sheet 1Signal Groups Sheet 2 Processor Asynchronous Sideband Signals Signal Groups Sheet 3Serial VID Interface Svid Signals Miscellaneous SignalsPower-On Configuration Option Lands Power-On Configuration POC OptionsSignals with On-Die Termination Signal Name Pull Up /Pull Rail Value Units DownOutput Tri-State Signal Groups Signals Fault Resilient Booting FRBFault Resilient Booting Output Tri-State Signals Mixing ProcessorsAbsolute Maximum and Minimum Ratings Symbol Parameter Min Max UnitFlexible Motherboard Guidelines FMB Processor Absolute Minimum and Maximum RatingsStorage Conditions Specifications 10. Storage Condition RatingsDC Specifications Symbol Parameter Voltage Min Typ Max Unit Plane Voltage and Current Specifications11. Voltage Specification VCC VIDMax a Definition 12. Processor Current SpecificationsParameter Symbol Processor TDP / Core Count Core/6-core13 /6 Core Processor VCC Static and Transient Tolerance CC aICC a VID 3,4,5,6 100 105 110 115 120 125 130 135 140 145 150 174 Symbol Parameter Min Max Units VCC Overshoot Specifications15. VCC Overshoot Specifications Sheet 1 Die Voltage Validation15. VCC Overshoot Specifications Sheet 2 Signal DC Specifications16. DDR3 and DDR3L Signal DC Specifications Sheet 1 Command Signals 16. DDR3 and DDR3L Signal DC Specifications Sheet 2Reference Clock Signal Control Signals19. SMBus DC Specifications Sheet 1 17. Peci DC Specifications18. System Reference Clock BCLK0/1 DC Specifications Symbol Definition and Conditions Min Max Units21. Serial VID Interface Svid DC Specifications Sheet 1 19. SMBus DC Specifications Sheet 220. Jtag and TAP Signals DC Specifications Symbol Parameter Min Typ Max UnitsCMOS1.05v Signals 21. Serial VID Interface Svid DC Specifications Sheet 222. Processor Asynchronous Sideband DC Specifications Open Drain Cmos Odcmos SignalsIntel QuickPath Interconnect DC Specifications PCI Express* DC Specifications3.2 DMI2/PCI Express* DC Specifications Reset and Miscellaneous Signal DC SpecificationsVcross MAX = 550mV StableVRB-Differential Vcross MIN = 250mV1 DDR3 Signal Quality Specifications Signal Quality2 I/O Signal Quality Specifications 24. Processor I/O Overshoot/Undershoot Specifications Intel QuickPath Interconnect Signal Quality SpecificationsInput Reference Clock Signal Quality Specifications Overshoot/Undershoot ToleranceOvershoot/Undershoot Pulse Duration Reading Overshoot/Undershoot Specification TablesActivity Factor 11. Maximum Acceptable Overshoot/Undershoot Waveform Land Name Sheet 2 Listing by Land NameLand Name Sheet 1 Land Name Land No Buffer Type DirectionLand Name Sheet 3 Land Name Sheet 4Land Name Sheet 5 Land Name Sheet 6Land Name Sheet 7 Land Name Sheet 8Land Name Sheet 9 Land Name Sheet 10Land Name Sheet 11 Land Name Sheet 12Land Name Sheet 13 Land Name Sheet 14Land Name Sheet 15 Land Name Sheet 16Land Name Sheet 17 Land Name Sheet 18Land Name Sheet 19 Land Name Sheet 20Land Name Sheet 21 Land Name Sheet 22Land Name Sheet 23 Land Name Sheet 24Land Name Sheet 25 Land Name Sheet 26Land Name Sheet 27 Land Name Sheet 28Land Name Sheet 29 Land Name Sheet 30Land Name Sheet 31 Land Name Sheet 32VCCD01 Land Name Sheet 33Land Name Sheet 34 VCCD23Land Name Sheet 35 Land Name Sheet 36Land Name Sheet 37 Land Name Sheet 38Land Name Sheet 39 Land Name Sheet 40Land Name Sheet 41 Land Name Sheet 42Land Name Sheet 43 Land Name Sheet 44Land Name Sheet 45 Land Name Sheet 46Vtta Land Name Sheet 47Land Name Sheet 48 VttdLand Name Sheet 49 Land Number Sheet 2 Listing by Land NumberLand Number Sheet 1 Land No Land Name Buffer Type DirectionLand Number Sheet 3 Land Number Sheet 4Land Number Sheet 5 Land Number Sheet 6Land Number Sheet 7 Land Number Sheet 8Land Number Sheet 9 Land Number Sheet 10Land Number Sheet 11 Land Number Sheet 12Land Number Sheet 13 Land Number Sheet 14Land Number Sheet 15 Land Number Sheet 16Land Number Sheet 17 Land Number Sheet 18Land Number Sheet 19 Land Number Sheet 20Land Number Sheet 21 Land Number Sheet 22Land Number Sheet 23 Land Number Sheet 24Land Number Sheet 25 Land Number Sheet 26Land Number Sheet 27 Land Number Sheet 28Land Number Sheet 29 Land Number Sheet 30Land Number Sheet 31 Land Number Sheet 32Land Number Sheet 33 Land Number Sheet 34Land Number Sheet 35 Land Number Sheet 36Land Number Sheet 37 Land Number Sheet 38Land Number Sheet 39 Land Number Sheet 40Land Number Sheet 41 Land Number Sheet 42Land Number Sheet 43 Land Number Sheet 44Land Number Sheet 45 Land Number Sheet 46Land Number Sheet 47 Land Number Sheet 48236 Processor Package Assembly Sketch Package Mechanical Drawing238 Processor Package Drawing Sheet 1 Processor Package Drawing Sheet 2 Processor Component Keep-Out Zones Package Loading SpecificationsPackage Insertion Specifications Package Handling GuidelinesProcessor Markings Processor Mass SpecificationProcessor Materials Processor MaterialsBoxed Processor Specifications Available Boxed Thermal Solution Configurations244 Mechanical Specifications STS200P and STS200PNRW 25.5 mm Tall Passive Heat SinksMotherboard Keepout Zones 1 246Boxed Processor Specifications Motherboard Keepout Zones 2Boxed Processor Motherboard Keepout Zones 3 248Motherboard Keepout Zones 4 TOP Surface of MotherboardBoxed Processor Heat Sink Volumetric 1 250Processor Heat Sink Volumetric 2Specifications Boxed Processor10.4-Pin Fan Cable Connector For Active Heat Sink 11 -Pin Base Baseboard Fan Header For Active Heat Sink Fan Power Supply STS200C 21,000 25,000 28,000Boxed Processor Cooling Requirements Boxed Processor Contents Boxed Processor 258