Intel E5-4600, CM8062101038606 Processor Component Keep-Out Zones, Package Loading Specifications

Package Mechanical Specifications

9.2Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Do not contact the Test Pad Area with conductive material. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 9-2and Figure 9-3for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in.

9.3Package Loading Specifications

Table 9-1provides load specifications for the processor package. These maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The processor substrate should not be used as a mechanical reference or load- bearing surface for thermal solutions.

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Table 9-1. Processor Loading Specifications

Parameter	Maximum	Notes
Static Compressive Load	890 N [200 lbf]	1, 2, 3, 5
Dynamic Load	540 N [121 lbf]	1, 3, 4, 5

Notes:

1.These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2.This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism (ILM).

3.These specifications are based on limited testing for design characterization. Loading limits are for the package constrained by the limits of the processor socket.

4.Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.

5.See Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for minimum socket load to engage processor within socket.

9.4Package Handling Guidelines

Table 9-2includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 9-2. Package Handling Guidelines

Parameter	Maximum Recommended	Notes
Shear	80 lbs (36.287 kg)
Tensile	35 lbs (15.875 kg)
Torque	35 in.lbs (15.875 kg-cm)

9.5Package Insertion Specifications

The processor can be inserted into and removed from an LGA2011-0 land FCLGA10 socket 15 times. The socket should meet the LGA2011-0 land FCLGA10 requirements detailed in the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide.

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families	241
Datasheet Volume One