Intel E5-1600, CM8062101038606, E5-4600, E5-2600 manual Boxed Processor Cooling Requirements

Boxed Processor Specifications

Figure 10-12. Fan Cable Connector Pin Out For 4-Pin Active Thermal Solution

10.3.1Boxed Processor Cooling Requirements

As previously stated the boxed processor will have three thermal solutions available. Each configuration will require unique design considerations. Meeting the processor’s temperature specifications is also the function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specifications are found in Section 5, “Thermal Management Specifications” of this document.

10.3.1.1STS200C (Passive / Active Combination Heat Sink Solution)

The active configuration of the combination solution is designed to help pedestal chassis users to meet the thermal processor requirements without the use of processor chassis ducting. However, it is strongly recommended to implement some form of air duct to meet memory cooling and processor TLA temperature requirements. Use of the active configuration in a 2U rackmount chassis is not recommended.

In the passive configuration it is assumed that a chassis duct will be implemented.

For a list processor and thermal solution boundary conditions, such as Psica, TLA, airflow, flow impedance, etc, see Table 10-2and Table 10-3. It is recommended that the ambient air temperature outside of the chassis be kept at or below 35 °C. Meeting the processor’s temperature specification is the responsibility of the system integrator.This thermal solution is for use with processor SKUs no higher than 150W (8 Core) or 130W (4 and 6 core).

10.3.1.2STS200P and STS200PNRW (25.5mm Tall Passive Heat Sink Solution) (Blade + 1U + 2U Rack)

These passive solutions are intended for use in SSI Blade, 1U or 2U rack configurations. It is assumed that a chassis duct will be implemented in all configurations.

For a list processor and thermal solution boundary conditions, such as Psica, TLA, airflow, flow impedance, etc, see Table 10-2and Table 10-3. It is recommended that the ambient air temperature outside of the chassis be kept at or below 35 °C. Meeting the processor’s temperature specification is the responsibility of the system integrator.

These thermal solutions are for use with processor SKUs no higher than 130W (6 and 8 Core), or 80W (4 Core).

Note: Please refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for detailed mechanical drawings of the

STS200P and STS200PNRW.

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families	255
Datasheet Volume One