Intel CM8062101038606 manual 3.6 8/6-Core 95W Thermal Specifications, Core 115W Thermal Profile U

Thermal Management Specifications

3.Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.

Table 5-11. 8-Core 115W Thermal Profile Table 1U

Power (W)	Maximum TCASE (°C)	Maximum DTS (°C)
0	55.0	55.0
5	56.1	56.7
10	57.2	58.3
15	58.3	60.0
20	59.3	61.7
25	60.4	63.3
30	61.5	65.0
35	62.6	66.7
40	63.7	68.3
45	64.8	69.3
50	65.9	71.7
55	66.9	73.3
60	68.0	75.0
65	69.1	76.6
70	70.2	78.3
75	71.3	80.0
80	72.4	81.6
85	73.4	83.3
90	74.5	85.0
95	75.6	86.6
100	76.7	88.3
105	77.8	90.0
110	78.9	91.6
115	80.0	93.3

5.1.3.68/6-Core 95W Thermal Specifications

Table 5-12. Tcase: 8/6-Core 95W Thermal Specifications, Workstation/Server Platform

Core	Thermal Design	Minimum	Maximum	Notes
Frequency	Power (W)	TCASE (°C)	TCASE (°C)
Launch to FMB	95	5	See Figure 5-12and Table 5-13	1, 2, 3, 4, 5

Notes:

1.These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.

2.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

3.These specifications are based on final silicon characterization.

4.Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency.

5.FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements.

116	Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
	Datasheet Volume One