Intel CM8062101038606, E5-4600 Embedded Server Processor Thermal Profiles, Tcase Spec DTS Spec

Thermal Management Specifications

Table 5-25. 4/2-Core 80W Thermal Profile Table 1U (Sheet 2 of 2)

	Maximum TCASE	Maximum DTS (°C)
Power (W)	(°C)
	4-core	4-core	2-core
75	68.8	81.0	82.4
80	70.0	83.0	84.5

5.1.4Embedded Server Processor Thermal Profiles

Embedded server SKU’s target operation at higher case temperatures and/or NEBS thermal profiles for embedded communications server form factors. The thermal profiles in this section pertain only to those specific SKU’s. Network Equipment Building System (NEBS) is the most common set of environmental design guidelines applied to telecommunications equipment in the United States.

Digital Thermal Sensor (DTS) based thermal profiles are also provided for each Embedded server SKU. The thermal solution is expected to be developed in accordance with the Tcase thermal profile. Operational compliance monitoring of thermal specifications and fan speed modulation may be done via the DTS based thermal profile. The slope of a DTS profile assumes full fan speed which is not required over much of the power range. At most power levels on embedded SKU’s, temperatures of the nominal profile are less than Tcontrol as indicated by the blue shaded region in each DTS profile graph. As a further simplification, operation at DTS temperatures up to Tcontrol is permitted at all power levels. Compliance to the DTS profile is required for any temperatures exceeding Tcontrol.

Table 5-26. Embedded Server Processor Elevated Tcase SKU Summary Table

TDP SKU	Tcase Spec	DTS Spec
LV95W-8C (8-core)	Figure 5-28	Figure 5-29
LV70W-8C (8-core)	Figure 5-30	Figure 5-31

5.1.4.18-Core LV95W Thermal Specifications

Table 5-27. Tcase: 8-Core LV95W Thermal Specifications, Embedded Server SKU

Core	Thermal Design	Minimum	Maximum	Notes
Frequency	Power (W)	TCASE (°C)	TCASE (°C)
Launch to FMB	95	5	See Figure 5-28and Table 5-28	1, 2, 3, 4, 5

Notes:

1.These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.

2.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

3.These specifications are based on final silicon characterization.

4.Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency.

5.FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements.

132	Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
	Datasheet Volume One