Intel E5-2600, CM8062101038606, E5-4600, E5-1600 manual Motherboard Keepout Zones 1, 246

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The drawing contains intel corporation information. Its contents may not be reproduced,

REVISION HISTORY

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DESCRIPTION

DATE

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THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

displayed,MAY NOT BE DISCLOSED,or modifiedREPRODUCED,withoutDISPLAYEDthe priorOR MODIFIED,writtenWITHOUTconsentTHE PRIORof IntelWRITTENCorporationCONSENT OF .INTEL CORPORATION.

INITIAL RELEASE FOR FUTURE BOARD BUILDS DEVIATING FROM E59036.

CHANGED ZONE 4, UPDATED NOTES FOR CLARIFICATION.

ADDED A NEW ZONE 7 ON PRIMARY SIDE.

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CHANGED ZONE 8 FOR UPDATED BACKPLATE.

06/30/10

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REMOVED HEATSINK HOLE MOUNTING LOCATIONS

REMOVED LEVER FINGER ACCESS TABS OUTSIDE 93.5x93.5 SQUARE.

REDUCED MAX THERMAL RETENTION OUTLINE TO 93X93MM.

NOTES:

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ADDED NOTE 8 FOR FURTHER CLARIFICATION

08/26/10

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1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.

2. DIMENSIONS STATED IN MILLIMETERS AND DEFINE ZONES, THEY HAVE NO TOLERANCES ASSOCIATED WITH THEM.

3. SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERNCE ONLY.

4. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN FOR PROPER ILM AND SOCKET FUNCTION.

5 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE

SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT

DEFINED BY THAT ZONE.

ALL ZONES DEFINED WITHIN THE 93.5 X 93.5 MM OUTLINE REPRESENT SPACE THAT RESIDES BENEATH

THE HEATSINK FOOTPRINT.

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Figure 10-4.

BoxedProcessor

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93.0

MAX THERMAL

SOLUTION ENVELOPE

AND MECHANICAL PART CLEARANCE

(FINGER ACCESS NOT INCLUDED)

UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.

A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.

SEE NOTE 6 FOR ADDITIONAL DETAILS.

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Intel® Xeon® Processor E5-1600/E5-2600/E5

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2X FINGER

ACCESS 8

93.0 MAX THERMAL

SOLUTION ENVELOPE AND MECHANICAL PART CLEARANCE

BALL 1 CORNER POSITIONAL MARKING (FOR REFERENCE ONLY)

		(58.5 )
	SOCKET BODY OUTLINE
	(FOR REFERENCE ONLY)
		2X 69.2
		SOCKET ILM
		HOLE PATTERN
2X 46.0
SOCKET ILM	4X	3.8
HOLE PATTERN	SOCKET ILM
	MOUNTING HOLES
(51.0 )
SOCKET BODY OUTLINE
(FOR REFERENCE ONLY)

6ASSUMING A GENERIC A MAXIMUM COMPONENT HEIGHT ZONE. CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:

-COMPONENT NOMINAL HEIGHT

-COMPONENT TOLERANCES

-COMPONENT PLACEMENT TILT

-SOLDER REFLOW THICKNESS

DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THIS MAXIMUM COMPONENT HEIGHT.

7ASSUMES PLACEMENT OF A 0805 CAPACITOR WITH DIMENSIONS:

-CAP NOMINAL HEIGHT = 1.25MM (0.049")

-COMPONENT MAX MATERIAL CONDITION HEIGHT NOT TO EXCEED 1.50MM.

8 SIZE & HEIGHT OF FINGER ACCESS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT. THIS IS ILM MECHANICAL CLEARANCE ONLY AND FINGER AND/OR TOOL ACCESS SHOULD DETERMINED SEPERATELY.

LEGEND, SHEETS 1 & 2 ONLY

ZONE 1:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE

ZONE 2:
7.2 MM MAX COMPONENT HEIGHT.	6

ZONE 3:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, NO ROUTE ZONE

ZONE 4:

1.67 MM MAX COMPONENT HEIGHT AFTER REFLOW 5 6

1.50 MM MAX (MMC) COMPONENT HEIGHT BEFORE REFLOW 5 7

ZONE 5:
1.6 MM MAX COMPONENT HEIGHT.	6
ZONE 6:
1.5 MM MAX COMPONENT HEIGHT.	6
ZONE 7:
1.9 MM MAX COMPONENT HEGHT.	6

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Motherboard Keepout Zones (1 of 4) Boxed

-4600 Product Families Datasheet Volume One

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UNLESS OTHERWISE SPECIFIED			DESIGNED BY	DATE	DEPARTMENT	2200 MISSION COLLEGE BLVD.
INTERPRET DIMENSIONS AND TOLERANCES			D. LLAPITAN	06/30/10		P.O. BOX 58119
IN ACCORDANCE WITH ASME Y14.5M-1994					PTMI
DIMENSIONS ARE IN MM			DRAWN BY	DATE		SANTA CLARA, CA 95052-8119
TOLERANCES:
.X ±	0.0 Angles ±	0.0 °	D. LLAPITAN	06/30/10	TITLE
.XX ±	0.00
.XXX ±	0.000		CHECKED BY	DATE

THIRD ANGLE PROJECTION

NEAL ULEN

07/05/10

LGA 2011 ENABLING KEEPOUT ZONES

APPROVED BY DATE

SIZE

DRAWING NUMBER

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MATERIAL

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SCALE: 1

DO NOT SCALE DRAWING

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Processor Specifications