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Intel E5-4600, CM8062101038606, E5-2600 Motherboard Keepout Zones 4, TOP Surface of Motherboard

Models: E5-2600 E5-4600 E5-1600 CM8062101038606

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Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One

249

D

C

B

A

8	7	6		5	4	3	DWG. NO	SHT.	REV	B	1
8	7	6		5	4	3		G11950	4	B	1
The drawing contains intel corporation information. Its contents may not be reproduced,
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
displayed,MAY NOT BE DISCLOSED,or modifiedREPRODUCED,withoutDISPLAYEDthe priorOR MODIFIED,writtenWITHOUTconsentTHE PRIORof IntelWRITTENCorporationCONSENT OF INTEL.				CORPORATION.		VOLUMETRIC SWEEPS FOR
						LOADPLATE AND LEVERS
						DURING OPENING AND CLOSING
											D
											C
	PRIMARY SIDE				SECONDARY SIDE
	PRIMARY SIDE				3D HEIGHT RESTRICTION ZONES
	3D HEIGHT RESTRICTION ZONES				3D HEIGHT RESTRICTION ZONES
	3D HEIGHT RESTRICTION ZONES
AND VOLUMETRIC SWEEPS OF LOADPLATE
	AND LEVER OPENING/CLOSING
		97.0°	MIN								B
		97.0°	MIN	97.0° MIN
				97.0° MIN
	81.50				76.50
					76.50
	TOP SURFACE OF MOTHERBOARD
					.03
	4.38		93.00			93.0					A
											A
						DEPARTMENT	2200 MISSION COLLEGE BLVD.	SIZE DRAWING NUMBER			REV
							2200 MISSION COLLEGE BLVD.	D		G11950	B
						PTMI	P.O. BOX 58119	D		G11950	B
						PTMI	SANTA CLARA, CA 95052-8119	SCALE: 1.500	DO NOT SCALE DRAWING SHEET 4 OF 4
								SCALE: 1.500	DO NOT SCALE DRAWING SHEET 4 OF 4
8	7	6		5	4	3	2				1

Figure 10-7. Boxed Processor	Boxed Processor Specifications
Motherboard Keepout Zones (4 of 4)

Image 249

Intel E5-4600, CM8062101038606, E5-2600, E5-1600 manual Motherboard Keepout Zones 4, TOP Surface of Motherboard

Contents

May Datasheet Volume OnePage Contents Package Thermal Specifications Mechanical Specifications 245 10.2.1 Figures Tcase 8-Core 135W Thermal Profile 2U Tables Core 150W Thermal Profile, Workstation Platform SKU Only Fault Resilient Booting Output Tri-State Signals Initial Release March Revision Description Revision Date NumberDatasheet Volume One Introduction OverviewProcessor Feature Details Interfaces Supported TechnologiesSystem Memory Support PCI Express NTB Direct Media Interface Gen 2 DMI2 Intel QuickPath Interconnect Intel QPILink Platform Environment Control Interface Peci Power Management SupportProcessor Package and Core States System States SupportPackage Summary Thermal Management SupportTerminology Intel QuickPath InterconnectIIO IMCIHS IOVLrdimm LLCNctf NebsTDP Related DocumentsTsod UdimmReferenced Documents Sheet 2 State of DataSystem Memory Interface System Memory Technology SupportSystem Memory Timing Support PCI Express* Architecture PCI Express* InterfaceTransaction Layer PCI Express* Configuration MechanismData Link Layer Physical LayerDMI2/PCI Express* Interface 1 DMI2 Error FlowIntel QuickPath Interconnect Processor/PCH Compatibility AssumptionsInterfaces Command Supported on the Processor Summary of Processor-specific Peci CommandsPlatform Environment Control Interface Peci Peci Client CapabilitiesProcessor Interface Tuning and Diagnostics Client Command SuiteThermal Management Platform ManageabilityGetDIB Device Info Minor Revision Supported Command SuiteRevision Number Minor Revision Number MeaningGetTemp Client Address Write Length Read LengthTemp70 Temp158 Supported Responses RdPkgConfigGetTemp Response Definition Response MeaningRdPkgConfig Response Definition WrPkgConfigElectrical error or AW FCS failure WrPkgConfig Response Definition Sheet 1Package Configuration Capabilities WrPkgConfig Response Definition Sheet 2Dram Thermal and Power Optimization Capabilities Dram Power TemperatureBy power Dram RankLimit Data Dram Thermal Estimation Configuration Data Read/WriteLimit PerformanceDimm Temperature Read Dram Rank Temperature WriteChannel & Dimm Index Decoding Index Encoding Physical Channel# Physical DIMM#Dimm Ambient Temperature Write / Read Dram Channel Temperature ReadDIMM# Dram Power Info Read Accumulated Dram Energy ReadAccumulated Dram Energy Data Dram Power Limit Data Write / Read Maximum TimeTypical Value Dram Power Limit Performance Status Read Dram PowerlimitReserved Cpuid CPU Thermal and Power Optimization CapabilitiesCSR did CSR McaerrsrclogPower Limit for Read Mode bit AccumulatedVCC Power Read statusModes Package Power Read Package PowerIndicator Read Limits ForProcessor Package Identifier ReadType FlagMax Thread Package Power SKU Unit ReadPower Control Register Unit Calculations Package Power SKU ReadUnit Field Value Calculation Default Value Package Temperature Read Wake on Peci Mode Bit Write / ReadMaximum Package Power Window Peci TemperaturePer Core DTS Temperature Read Temperature Target ReadPackage Thermal Status Read / Clear Thermally Constrained Time Read Thermal Averaging Constant Write / ReadCurrent Limit Read 4 3 2 1Accumulated Energy Status Read Power Limit for the VCC Power Plane Write / ReadPackage Power Limits For Multiple Turbo Modes Control Time Clamp Power LimitMode Enable Window #2 Mode #2 Enable #2 Package Power Limit Performance Status ReadAcpi P-T Notify Write & Read Efficient Performance Indicator ReadCore ID Bit Read Mode bit 11 = ‘1’ Read Mode bit 11 = ‘0’Caching Agent TOR Read Thermal Margin ReadProcessor ID Enumeration RdIAMSR42. Processor ID Construction Example 11. RdIAMSR Services Summary Sheet 1 10. RdIAMSR Response DefinitionRdIAMSR Capabilities Or ID Address Meaning Sor ID Byte Dword 11. RdIAMSR Services Summary Sheet 244. PCI Configuration Address RdPCIConfig12. RdPCIConfig Response Definition RdPCIConfigLocalTimely fashion. Retry is appropriate Appropriate13. RdPCIConfigLocal Response Definition Sheet 1 PCI Configuration Address0x05 0x02,0x03,0x05 0xe1 Definition 13. RdPCIConfigLocal Response Definition Sheet 2 WrPCIConfigLocalCmd Code 14. WrPCIConfigLocal Response Definition0xe5 CompletionWrPCIConfigLocal Capabilities Power-up Sequencing16. Peci Client Response During Power-Up Sheet 1 Client Management16. Peci Client Response During Power-Up Sheet 2 Device DiscoveryClient Addressing Command Power Impact 18. Power Impact of Peci Commands vs. C-statesStates 17. Socket ID StrappingProcessor Reset System Service Processor SSP Mode SupportBMC Init Mode Processor Error Handling Originator Retry and Timeout PolicyLink Init Mode 20. Multi-Domain Command Code Reference Multi-Domain CommandsEnumerating Peci Client Capabilities 19. Domain ID DefinitionAbort FCS Client ResponsesCompletion Codes 21. Completion Code Pass/Fail MaskOriginator Responses DTS Temperature DataFormat Interpretation24. Error Codes and Descriptions Temperature FilteringError Code Description Reserved ValuesDatasheet Volume One Intel VT-x Objectives Intel Virtualization Technology Intel VTIntel VT-x Features Intel VT-d Features SupportedIntel VT-d Objectives Security Technologies Intel Virtualization Technology Processor ExtensionsIntel Trusted Execution Technology Intel Advanced Encryption Standard Instructions Intel AES-NI Intel Trusted Execution Technology Server ExtensionsIntel Turbo Boost Operating Frequency Execute Disable BitIntel Intelligent Power Technology Enhanced Intel SpeedStep TechnologyIntel Advanced Vector Extensions Intel AVX Intel Dynamic Power Technology Intel DPT Technologies System States Acpi States SupportedSystem States Package C-State Support Sheet 1Integrated Memory Controller States System Memory Power States Sheet 1Package C-State Support Sheet 2 Core C-State Support4 DMI2/PCI Express Link States Intel QuickPath Interconnect States6 G, S, and C State Combinations Processor Core/Package Power Management Low-Power Idle StatesEnhanced Intel SpeedStep Technology Idle Power Management Breakdown of the Processor Cores Requesting Low-Power Idle StatesCore C0 State Core C-statesCore C1/C1E State PLVLx to Mwait ConversionCore C6 State Core C3 StateCore C7 State State Auto-DemotionPackage C-States Package C0 Coordination of Core Power States at the Package LevelPackage C1/C1E Package C-State CorePackage C2 State Package C3 StatePackage C6 State Package C-State Power Specifications System Memory Power Management10. Package C-State Power Specifications TDP SKUs C1E W C3 W C6 W Core / 6-CoreSelf Refresh CKE Power-DownSelf Refresh Entry Self Refresh ExitDMI2/PCI Express* Power Management Dram I/O Power ManagementDLL and PLL Shutdown 100 Thermal Specifications Package Thermal SpecificationsTcase and DTS Based Thermal Specifications Temperaturetarget MSR 3.1 8-Core 150W Thermal Specifications Processor Thermal ProfilesProcessor SKU Summary Table Thermal Management Specifications Core 150W Thermal Profile, Workstation Platform SKU Only Power W Maximum T Case C Maximum Dtsc3.2 8-Core 135W Thermal Specifications Tcase 8-Core 135W Thermal Specifications 2U3, 4 Core 135W Thermal Profile U Sheet 1 Power W Maximum Tcase C Maximum DTS C3.3 8/6-Core 130W Thermal Specifications Power W Maximum T Case C Maximum DTS CCore 135W Thermal Profile U Sheet 2 Tcase 8/6-Core 130W Thermal Profile 1U 6-Core 130W Thermal Profile U Sheet 1 Power W Maximum Tcase C Maximum DTS C CoreTcase 6-Core 130W 1S WS Thermal Specifications 3.4 6-Core 130W 1S WS Thermal SpecificationsPower W Maximum T Case C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 2Core 130W 1S WS Thermal Profile Table Sheet 1 DTS 6-Core 130W 1S WS Thermal Profile3.5 8-Core 115W Thermal Specifications 10. Tcase 8-Core 115W Thermal Specifications 1UCore 130W 1S WS Thermal Profile Table Sheet 2 10. Tcase 8-Core 115W Thermal Profile 1U 11 -Core 115W Thermal Profile U 3.6 8/6-Core 95W Thermal Specifications12. Tcase 8/6-Core 95W Thermal Profile 1U 13 /6-Core 95W Thermal Profile U Sheet 1 14. DTS 6-Core 95W Thermal Profile 1U3.7 8-Core 70W Thermal Specifications 14. Tcase 8-Core 70W Thermal Specifications 1U13 /6-Core 95W Thermal Profile U Sheet 2 15 -Core 70W Thermal Profile U 16. DTS 8-Core 70W Thermal Profile 1U16. Tcase 6-Core 60W Thermal Specifications 1U 3.8 6-Core 60W Thermal Specifications17 -Core 60W Thermal Profile U 18. DTS 6-Core 60W Thermal Profile 1U18. Tcase 4-Core 130W Thermal Specifications 2U 3.9 4-Core 130W Thermal Specifications19 -Core 130W Thermal Profile U Sheet 1 20. DTS 4-Core 130W Thermal Profile 2U19 -Core 130W Thermal Profile U Sheet 2 3.10 4-Core 130W 1S WS Thermal Specifications21. Tcase 4-Core 130W 1S WS Thermal Profile 3.11 4-Core 95W Thermal Specifications 22. Tcase 4-Core 95W Thermal Specifications 1U21 -Core 130W 1S WS Thermal Profile Table 23. Tcase 4-Core 95W Thermal Profile 1U 3.12 4/2-Core 80W Thermal Specifications 24. Tcase 4/2-Core 80W Thermal Specifications 1U23 -Core 95W Thermal Profile U 25. Tcase 4/2-Core 80W Thermal Profile 1U 25 /2-Core 80W Thermal Profile U Sheet 1 Maximum Tcase Maximum DTS C Power W CoreMaximum T Case Maximum DTS C Power W Core 4.1 8-Core LV95W Thermal SpecificationsEmbedded Server Processor Thermal Profiles 25 /2-Core 80W Thermal Profile U Sheet 228. Tcase 8-Core LV95W Thermal Profile, Embedded Server SKU 29. DTS 8-Core LV95W Thermal Profile, Embedded Server SKU 30. Tcase 8-Core LV70W Thermal Profile, Embedded Server SKU 4.2 8-Core LV70W Thermal Specifications31. DTS 8-Core LV70W Thermal Profile, Embedded Server SKU Thermal Metrology 32. Case Temperature Tcase Measurement LocationProcessor Core Thermal Features Processor TemperatureAdaptive Thermal Monitor 33. Frequency and Voltage Ordering Frequency/SVID ControlOn-Demand Mode Prochotn SignalClock Modulation Thermtripn Signal Integrated Memory Controller IMC Thermal FeaturesDram Throttling Options MEMHOTC01N and MEMHOTC23N Signal Hybrid Closed Loop Thermal Throttling CLTTHybridIntegrated Dual SMBus Master Controllers for SMI System Memory Interface Signals Signal Name DescriptionMemory Channel DDR0, DDR1, DDR2, DDR3 PCI Express* Port 1 Signals PCI Express* Based Interface SignalsPCI Express* Port 2 Signals Sheet 1 Memory Channel MiscellaneousPCI Express* Port 2 Signals Sheet 2 PCI Express* Port 3 SignalsPCI Express* Miscellaneous Signals Sheet 1 Intel QuickPath Interconnect Signals DMI2/PCI Express* Port 0 SignalsPeci Signal System Reference Clock SignalsJtag and TAP Signals Processor Asynchronous Sideband and Miscellaneous Signals Serial VID Interface Svid Signals13. Svid Signals 14. Processor Asynchronous Sideband Signals Sheet 114. Processor Asynchronous Sideband Signals Sheet 2 14. Processor Asynchronous Sideband Signals Sheet 3 Processor Power and Ground Supplies15. Miscellaneous Signals 16. Power and Ground Signals Sheet 116. Power and Ground Signals Sheet 2 152 System Memory Interface Signal Groups Processor SignalingPCI Express* Signals 3 DMI2/PCI Express* SignalsPlatform Environmental Control Interface Peci System Reference Clocks BCLK0/1DP, BCLK0/ 1DNInput Device Hysteresis Processor Sideband Signals Jtag and Test Access Port TAP SignalsPower, Ground and Sense Signals PLL Power SupplyPower Number Comments Ground Lands Power and Ground LandsDecoupling Guidelines Voltage Identification VIDSetVID Fast Command Svid CommandsSetVID Slow Command SetVID-Decay CommandVR Power-State Transitions Svid Power State Functions SetPSSvid Address Usage Svid Voltage Rail AddressingPWM Address HEX Processor 159Reserved or Unused Signals Signal Group SummarySignal Description Buffer Types Sheet 1 Signal DescriptionSignal Groups Sheet 1 Signal Description Buffer Types Sheet 2Signal Groups Sheet 2 Serial VID Interface Svid Signals Signal Groups Sheet 3Processor Asynchronous Sideband Signals Miscellaneous SignalsSignals with On-Die Termination Power-On Configuration POC OptionsPower-On Configuration Option Lands Signal Name Pull Up /Pull Rail Value Units DownFault Resilient Booting Output Tri-State Signals Fault Resilient Booting FRBOutput Tri-State Signal Groups Signals Mixing ProcessorsFlexible Motherboard Guidelines FMB Symbol Parameter Min Max UnitAbsolute Maximum and Minimum Ratings Processor Absolute Minimum and Maximum Ratings10. Storage Condition Ratings Storage Conditions SpecificationsDC Specifications 11. Voltage Specification Voltage and Current SpecificationsSymbol Parameter Voltage Min Typ Max Unit Plane VCC VIDParameter Symbol Processor TDP / Core Count 12. Processor Current SpecificationsMax a Definition Core/6-coreCC a 13 /6 Core Processor VCC Static and Transient ToleranceICC a VID 3,4,5,6 100 105 110 115 120 125 130 135 140 145 150 174 15. VCC Overshoot Specifications Sheet 1 VCC Overshoot SpecificationsSymbol Parameter Min Max Units Die Voltage ValidationSignal DC Specifications 15. VCC Overshoot Specifications Sheet 216. DDR3 and DDR3L Signal DC Specifications Sheet 1 Reference Clock Signal 16. DDR3 and DDR3L Signal DC Specifications Sheet 2Command Signals Control Signals18. System Reference Clock BCLK0/1 DC Specifications 17. Peci DC Specifications19. SMBus DC Specifications Sheet 1 Symbol Definition and Conditions Min Max Units20. Jtag and TAP Signals DC Specifications 19. SMBus DC Specifications Sheet 221. Serial VID Interface Svid DC Specifications Sheet 1 Symbol Parameter Min Typ Max Units22. Processor Asynchronous Sideband DC Specifications 21. Serial VID Interface Svid DC Specifications Sheet 2CMOS1.05v Signals Open Drain Cmos Odcmos Signals3.2 DMI2/PCI Express* DC Specifications PCI Express* DC SpecificationsIntel QuickPath Interconnect DC Specifications Reset and Miscellaneous Signal DC SpecificationsVRB-Differential StableVcross MAX = 550mV Vcross MIN = 250mVSignal Quality 1 DDR3 Signal Quality Specifications2 I/O Signal Quality Specifications Input Reference Clock Signal Quality Specifications Intel QuickPath Interconnect Signal Quality Specifications24. Processor I/O Overshoot/Undershoot Specifications Overshoot/Undershoot ToleranceReading Overshoot/Undershoot Specification Tables Overshoot/Undershoot Pulse DurationActivity Factor 11. Maximum Acceptable Overshoot/Undershoot Waveform Land Name Sheet 1 Listing by Land NameLand Name Sheet 2 Land Name Land No Buffer Type DirectionLand Name Sheet 4 Land Name Sheet 3Land Name Sheet 6 Land Name Sheet 5Land Name Sheet 8 Land Name Sheet 7Land Name Sheet 10 Land Name Sheet 9Land Name Sheet 12 Land Name Sheet 11Land Name Sheet 14 Land Name Sheet 13Land Name Sheet 16 Land Name Sheet 15Land Name Sheet 18 Land Name Sheet 17Land Name Sheet 20 Land Name Sheet 19Land Name Sheet 22 Land Name Sheet 21Land Name Sheet 24 Land Name Sheet 23Land Name Sheet 26 Land Name Sheet 25Land Name Sheet 28 Land Name Sheet 27Land Name Sheet 30 Land Name Sheet 29Land Name Sheet 32 Land Name Sheet 31Land Name Sheet 34 Land Name Sheet 33VCCD01 VCCD23Land Name Sheet 36 Land Name Sheet 35Land Name Sheet 38 Land Name Sheet 37Land Name Sheet 40 Land Name Sheet 39Land Name Sheet 42 Land Name Sheet 41Land Name Sheet 44 Land Name Sheet 43Land Name Sheet 46 Land Name Sheet 45Land Name Sheet 48 Land Name Sheet 47Vtta VttdLand Name Sheet 49 Land Number Sheet 1 Listing by Land NumberLand Number Sheet 2 Land No Land Name Buffer Type DirectionLand Number Sheet 4 Land Number Sheet 3Land Number Sheet 6 Land Number Sheet 5Land Number Sheet 8 Land Number Sheet 7Land Number Sheet 10 Land Number Sheet 9Land Number Sheet 12 Land Number Sheet 11Land Number Sheet 14 Land Number Sheet 13Land Number Sheet 16 Land Number Sheet 15Land Number Sheet 18 Land Number Sheet 17Land Number Sheet 20 Land Number Sheet 19Land Number Sheet 22 Land Number Sheet 21Land Number Sheet 24 Land Number Sheet 23Land Number Sheet 26 Land Number Sheet 25Land Number Sheet 28 Land Number Sheet 27Land Number Sheet 30 Land Number Sheet 29Land Number Sheet 32 Land Number Sheet 31Land Number Sheet 34 Land Number Sheet 33Land Number Sheet 36 Land Number Sheet 35Land Number Sheet 38 Land Number Sheet 37Land Number Sheet 40 Land Number Sheet 39Land Number Sheet 42 Land Number Sheet 41Land Number Sheet 44 Land Number Sheet 43Land Number Sheet 46 Land Number Sheet 45Land Number Sheet 48 Land Number Sheet 47236 Package Mechanical Drawing Processor Package Assembly Sketch238 Processor Package Drawing Sheet 1 Processor Package Drawing Sheet 2 Package Insertion Specifications Package Loading SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesProcessor Materials Processor Mass SpecificationProcessor Markings Processor MaterialsAvailable Boxed Thermal Solution Configurations Boxed Processor Specifications244 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks Mechanical Specifications246 Motherboard Keepout Zones 1Motherboard Keepout Zones 2 Boxed Processor Specifications248 Boxed Processor Motherboard Keepout Zones 3TOP Surface of Motherboard Motherboard Keepout Zones 4250 Boxed Processor Heat Sink Volumetric 1Specifications Heat Sink Volumetric 2Processor Boxed Processor10.4-Pin Fan Cable Connector For Active Heat Sink 11 -Pin Base Baseboard Fan Header For Active Heat Sink 21,000 25,000 28,000 Fan Power Supply STS200CBoxed Processor Cooling Requirements Boxed Processor Contents Boxed Processor 258