Thermal Management Specifications

Table 5-7. 8/6-Core 130W Thermal Profile Table 1U (Sheet 2 of 2)

Power (W)

Maximum TCASE (°C)

Maximum DTS (°C)

8/6-core

8-core

6-Core

 

 

 

 

 

100

78.5

90.0

93.4

 

 

 

 

105

79.6

91.7

95.2

 

 

 

 

110

80.7

93.3

97.1

 

 

 

 

115

81.8

95.0

98.9

 

 

 

 

120

82.9

96.7

100.7

 

 

 

 

125

84.0

98.3

102.6

 

 

 

 

130

85.0

100.0

104.4

 

 

 

 

5.1.3.46-Core 130W 1S WS Thermal Specifications

Table 5-8. Tcase: 6-Core 130W 1S WS Thermal Specifications

Core

Thermal Design

Minimum

Maximum

Notes

Frequency

Power (W)

TCASE (°C)

TCASE (°C)

 

Launch to FMB

130

5

See Figure 5-8and

1, 2, 3, 4, 5

 

 

 

Table 5-9

 

 

 

 

 

 

Notes:

1.These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.

2.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.

3.These specifications are based on final silicon characterization.

4.Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency.

5.FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements.

Figure 5-8. Tcase: 6-Core 130W 1S WS Thermal Profile

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Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

 

Datasheet Volume One

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Image 112
Intel CM8062101038606, E5-4600, E5-2600 3.4 6-Core 130W 1S WS Thermal Specifications, Core 130W Thermal Profile U Sheet 2