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Intel CM8062101038606, E5-4600, E5-2600, E5-1600 manual GetDIB

Models: E5-2600 E5-4600 E5-1600 CM8062101038606

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Figure 2-3. Ping()

Byte #	0	1	2	3
Byte	Client Address	Write Length	Read Length	FCS
Byte	Client Address	0x00	0x00	FCS
Definition

An example Ping() command to PECI device address 0x30 is shown below.

Figure 2-4. Ping() Example

Byte #

Byte

Definition

0	1	2	3
0x30	0x00	0x00	0xe1

2.5.2.2GetDIB()

The processor PECI client implementation of GetDIB() includes an 8-byte response and provides information regarding client revision number and the number of supported domains. All processor PECI clients support the GetDIB() command.

2.5.2.2.1Command Format

The GetDIB() format is as follows: Write Length: 0x01

Read Length: 0x08

Command: 0xf7

Figure 2-5. GetDIB()

Byte #

0

1

2

3

4

Byte

Client Address

Write Length

Read Length

Cmd Code

FCS

0x01

0x08

0xf7

Definition

5

6

7

8

9

Device Info

Revision

Reserved

Reserved

Reserved

Number

10

11

12

13

Reserved

Reserved

Reserved

FCS

32	Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
	Datasheet Volume One

Image 32

Intel CM8062101038606, E5-4600, E5-2600, E5-1600 manual GetDIB

Contents

Datasheet Volume One MayPage Contents Package Thermal Specifications Mechanical Specifications 245 10.2.1 Figures Tcase 8-Core 135W Thermal Profile 2U Tables Core 150W Thermal Profile, Workstation Platform SKU Only Fault Resilient Booting Output Tri-State Signals Revision Description Revision Date Number Initial Release MarchDatasheet Volume One Overview IntroductionProcessor Feature Details System Memory Support InterfacesSupported Technologies PCI Express NTB Link Direct Media Interface Gen 2 DMI2Intel QuickPath Interconnect Intel QPI Power Management Support Platform Environment Control Interface PeciProcessor Package and Core States System States SupportThermal Management Support Package SummaryTerminology Intel QuickPath InterconnectIMC IIOIHS IOVLLC LrdimmNctf NebsRelated Documents TDPTsod UdimmState of Data Referenced Documents Sheet 2System Memory Timing Support System Memory InterfaceSystem Memory Technology Support PCI Express* Interface PCI Express* ArchitecturePCI Express* Configuration Mechanism Transaction LayerData Link Layer Physical Layer1 DMI2 Error Flow DMI2/PCI Express* InterfaceIntel QuickPath Interconnect Processor/PCH Compatibility AssumptionsInterfaces Summary of Processor-specific Peci Commands Command Supported on the ProcessorPlatform Environment Control Interface Peci Peci Client CapabilitiesClient Command Suite Processor Interface Tuning and DiagnosticsThermal Management Platform ManageabilityGetDIB Minor Revision Supported Command Suite Device InfoRevision Number Minor Revision Number MeaningTemp70 Temp158 GetTempClient Address Write Length Read Length RdPkgConfig Supported ResponsesGetTemp Response Definition Response MeaningWrPkgConfig RdPkgConfig Response DefinitionWrPkgConfig Response Definition Sheet 1 Electrical error or AW FCS failureDram Thermal and Power Optimization Capabilities Package Configuration CapabilitiesWrPkgConfig Response Definition Sheet 2 Temperature Dram PowerBy power Dram RankDram Thermal Estimation Configuration Data Read/Write Limit DataLimit PerformanceDram Rank Temperature Write Dimm Temperature ReadChannel & Dimm Index Decoding Index Encoding Physical Channel# Physical DIMM#DIMM# Dimm Ambient Temperature Write / ReadDram Channel Temperature Read Accumulated Dram Energy Data Dram Power Info ReadAccumulated Dram Energy Read Typical Value Dram Power Limit Data Write / ReadMaximum Time Reserved Dram Power Limit Performance Status ReadDram Powerlimit CPU Thermal and Power Optimization Capabilities CpuidCSR did CSR McaerrsrclogRead Mode bit Accumulated Power Limit forVCC Power Read statusRead Package Power Modes Package PowerIndicator Read Limits ForPackage Identifier Read ProcessorType FlagPackage Power SKU Unit Read Max ThreadUnit Field Value Calculation Default Value Power Control Register Unit CalculationsPackage Power SKU Read Wake on Peci Mode Bit Write / Read Package Temperature ReadMaximum Package Power Window Peci TemperaturePackage Thermal Status Read / Clear Per Core DTS Temperature ReadTemperature Target Read Thermal Averaging Constant Write / Read Thermally Constrained Time ReadCurrent Limit Read 4 3 2 1Power Limit for the VCC Power Plane Write / Read Accumulated Energy Status ReadMode Enable Package Power Limits For Multiple Turbo ModesControl Time Clamp Power Limit Package Power Limit Performance Status Read Window #2 Mode #2 Enable #2Efficient Performance Indicator Read Acpi P-T Notify Write & ReadRead Mode bit 11 = ‘0’ Core ID Bit Read Mode bit 11 = ‘1’Caching Agent TOR Read Thermal Margin ReadRdIAMSR Processor ID Enumeration42. Processor ID Construction Example RdIAMSR Capabilities 11. RdIAMSR Services Summary Sheet 110. RdIAMSR Response Definition 11. RdIAMSR Services Summary Sheet 2 Or ID Address Meaning Sor ID Byte DwordRdPCIConfig 44. PCI Configuration AddressRdPCIConfigLocal 12. RdPCIConfig Response DefinitionTimely fashion. Retry is appropriate Appropriate0x05 0x02,0x03,0x05 0xe1 Definition 13. RdPCIConfigLocal Response Definition Sheet 1PCI Configuration Address WrPCIConfigLocal 13. RdPCIConfigLocal Response Definition Sheet 214. WrPCIConfigLocal Response Definition Cmd Code0xe5 CompletionPower-up Sequencing WrPCIConfigLocal Capabilities16. Peci Client Response During Power-Up Sheet 1 Client ManagementClient Addressing 16. Peci Client Response During Power-Up Sheet 2Device Discovery 18. Power Impact of Peci Commands vs. C-states Command Power ImpactStates 17. Socket ID StrappingBMC Init Mode Processor ResetSystem Service Processor SSP Mode Support Link Init Mode Processor Error HandlingOriginator Retry and Timeout Policy Multi-Domain Commands 20. Multi-Domain Command Code ReferenceEnumerating Peci Client Capabilities 19. Domain ID DefinitionClient Responses Abort FCSCompletion Codes 21. Completion Code Pass/Fail MaskDTS Temperature Data Originator ResponsesFormat InterpretationTemperature Filtering 24. Error Codes and DescriptionsError Code Description Reserved ValuesDatasheet Volume One Intel Virtualization Technology Intel VT Intel VT-x ObjectivesIntel VT-d Objectives Intel VT-x FeaturesIntel VT-d Features Supported Intel Trusted Execution Technology Security TechnologiesIntel Virtualization Technology Processor Extensions Intel Trusted Execution Technology Server Extensions Intel Advanced Encryption Standard Instructions Intel AES-NIExecute Disable Bit Intel Turbo Boost Operating FrequencyIntel Advanced Vector Extensions Intel AVX Intel Intelligent Power TechnologyEnhanced Intel SpeedStep Technology Intel Dynamic Power Technology Intel DPT Technologies Acpi States Supported System StatesSystem States Package C-State Support Sheet 1System Memory Power States Sheet 1 Integrated Memory Controller StatesPackage C-State Support Sheet 2 Core C-State Support6 G, S, and C State Combinations 4 DMI2/PCI Express Link StatesIntel QuickPath Interconnect States Enhanced Intel SpeedStep Technology Processor Core/Package Power ManagementLow-Power Idle States Requesting Low-Power Idle States Idle Power Management Breakdown of the Processor CoresCore C-states Core C0 StateCore C1/C1E State PLVLx to Mwait ConversionCore C3 State Core C6 StateCore C7 State State Auto-DemotionPackage C-States Coordination of Core Power States at the Package Level Package C0Package C1/C1E Package C-State CorePackage C6 State Package C2 StatePackage C3 State System Memory Power Management Package C-State Power Specifications10. Package C-State Power Specifications TDP SKUs C1E W C3 W C6 W Core / 6-CoreCKE Power-Down Self RefreshSelf Refresh Entry Self Refresh ExitDLL and PLL Shutdown DMI2/PCI Express* Power ManagementDram I/O Power Management 100 Package Thermal Specifications Thermal SpecificationsTcase and DTS Based Thermal Specifications Temperaturetarget MSR Processor SKU Summary Table 3.1 8-Core 150W Thermal SpecificationsProcessor Thermal Profiles Thermal Management Specifications Power W Maximum T Case C Maximum Dtsc Core 150W Thermal Profile, Workstation Platform SKU Only3, 4 3.2 8-Core 135W Thermal SpecificationsTcase 8-Core 135W Thermal Specifications 2U Power W Maximum Tcase C Maximum DTS C Core 135W Thermal Profile U Sheet 1Core 135W Thermal Profile U Sheet 2 3.3 8/6-Core 130W Thermal SpecificationsPower W Maximum T Case C Maximum DTS C Tcase 8/6-Core 130W Thermal Profile 1U Power W Maximum Tcase C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 13.4 6-Core 130W 1S WS Thermal Specifications Tcase 6-Core 130W 1S WS Thermal SpecificationsPower W Maximum T Case C Maximum DTS C Core 6-Core 130W Thermal Profile U Sheet 2DTS 6-Core 130W 1S WS Thermal Profile Core 130W 1S WS Thermal Profile Table Sheet 1Core 130W 1S WS Thermal Profile Table Sheet 2 3.5 8-Core 115W Thermal Specifications10. Tcase 8-Core 115W Thermal Specifications 1U 10. Tcase 8-Core 115W Thermal Profile 1U 3.6 8/6-Core 95W Thermal Specifications 11 -Core 115W Thermal Profile U12. Tcase 8/6-Core 95W Thermal Profile 1U 14. DTS 6-Core 95W Thermal Profile 1U 13 /6-Core 95W Thermal Profile U Sheet 113 /6-Core 95W Thermal Profile U Sheet 2 3.7 8-Core 70W Thermal Specifications14. Tcase 8-Core 70W Thermal Specifications 1U 16. DTS 8-Core 70W Thermal Profile 1U 15 -Core 70W Thermal Profile U3.8 6-Core 60W Thermal Specifications 16. Tcase 6-Core 60W Thermal Specifications 1U18. DTS 6-Core 60W Thermal Profile 1U 17 -Core 60W Thermal Profile U3.9 4-Core 130W Thermal Specifications 18. Tcase 4-Core 130W Thermal Specifications 2U20. DTS 4-Core 130W Thermal Profile 2U 19 -Core 130W Thermal Profile U Sheet 13.10 4-Core 130W 1S WS Thermal Specifications 19 -Core 130W Thermal Profile U Sheet 221. Tcase 4-Core 130W 1S WS Thermal Profile 21 -Core 130W 1S WS Thermal Profile Table 3.11 4-Core 95W Thermal Specifications22. Tcase 4-Core 95W Thermal Specifications 1U 23. Tcase 4-Core 95W Thermal Profile 1U 23 -Core 95W Thermal Profile U 3.12 4/2-Core 80W Thermal Specifications24. Tcase 4/2-Core 80W Thermal Specifications 1U 25. Tcase 4/2-Core 80W Thermal Profile 1U Maximum Tcase Maximum DTS C Power W Core 25 /2-Core 80W Thermal Profile U Sheet 14.1 8-Core LV95W Thermal Specifications Maximum T Case Maximum DTS C Power W CoreEmbedded Server Processor Thermal Profiles 25 /2-Core 80W Thermal Profile U Sheet 228. Tcase 8-Core LV95W Thermal Profile, Embedded Server SKU 29. DTS 8-Core LV95W Thermal Profile, Embedded Server SKU 4.2 8-Core LV70W Thermal Specifications 30. Tcase 8-Core LV70W Thermal Profile, Embedded Server SKU31. DTS 8-Core LV70W Thermal Profile, Embedded Server SKU 32. Case Temperature Tcase Measurement Location Thermal MetrologyAdaptive Thermal Monitor Processor Core Thermal FeaturesProcessor Temperature Frequency/SVID Control 33. Frequency and Voltage OrderingClock Modulation On-Demand ModeProchotn Signal Dram Throttling Options Thermtripn SignalIntegrated Memory Controller IMC Thermal Features Integrated Dual SMBus Master Controllers for SMI MEMHOTC01N and MEMHOTC23N SignalHybrid Closed Loop Thermal Throttling CLTTHybrid Memory Channel DDR0, DDR1, DDR2, DDR3 System Memory Interface SignalsSignal Name Description PCI Express* Based Interface Signals PCI Express* Port 1 SignalsPCI Express* Port 2 Signals Sheet 1 Memory Channel MiscellaneousPCI Express* Miscellaneous Signals Sheet 1 PCI Express* Port 2 Signals Sheet 2PCI Express* Port 3 Signals DMI2/PCI Express* Port 0 Signals Intel QuickPath Interconnect SignalsJtag and TAP Signals Peci SignalSystem Reference Clock Signals Serial VID Interface Svid Signals Processor Asynchronous Sideband and Miscellaneous Signals13. Svid Signals 14. Processor Asynchronous Sideband Signals Sheet 114. Processor Asynchronous Sideband Signals Sheet 2 Processor Power and Ground Supplies 14. Processor Asynchronous Sideband Signals Sheet 315. Miscellaneous Signals 16. Power and Ground Signals Sheet 116. Power and Ground Signals Sheet 2 152 Processor Signaling System Memory Interface Signal GroupsPCI Express* Signals 3 DMI2/PCI Express* SignalsInput Device Hysteresis Platform Environmental Control Interface PeciSystem Reference Clocks BCLK0/1DP, BCLK0/ 1DN Jtag and Test Access Port TAP Signals Processor Sideband SignalsPower, Ground and Sense Signals PLL Power SupplyPower and Ground Lands Power Number Comments Ground LandsDecoupling Guidelines Voltage Identification VIDSvid Commands SetVID Fast CommandSetVID Slow Command SetVID-Decay CommandSvid Power State Functions SetPS VR Power-State TransitionsSvid Voltage Rail Addressing Svid Address UsagePWM Address HEX Processor 159Signal Group Summary Reserved or Unused SignalsSignal Description Buffer Types Sheet 1 Signal DescriptionSignal Description Buffer Types Sheet 2 Signal Groups Sheet 1Signal Groups Sheet 2 Signal Groups Sheet 3 Serial VID Interface Svid SignalsProcessor Asynchronous Sideband Signals Miscellaneous SignalsPower-On Configuration POC Options Signals with On-Die TerminationPower-On Configuration Option Lands Signal Name Pull Up /Pull Rail Value Units DownFault Resilient Booting FRB Fault Resilient Booting Output Tri-State SignalsOutput Tri-State Signal Groups Signals Mixing ProcessorsSymbol Parameter Min Max Unit Flexible Motherboard Guidelines FMBAbsolute Maximum and Minimum Ratings Processor Absolute Minimum and Maximum RatingsStorage Conditions Specifications 10. Storage Condition RatingsDC Specifications Voltage and Current Specifications 11. Voltage SpecificationSymbol Parameter Voltage Min Typ Max Unit Plane VCC VID12. Processor Current Specifications Parameter Symbol Processor TDP / Core CountMax a Definition Core/6-core13 /6 Core Processor VCC Static and Transient Tolerance CC aICC a VID 3,4,5,6 100 105 110 115 120 125 130 135 140 145 150 174 VCC Overshoot Specifications 15. VCC Overshoot Specifications Sheet 1Symbol Parameter Min Max Units Die Voltage Validation16. DDR3 and DDR3L Signal DC Specifications Sheet 1 Signal DC Specifications15. VCC Overshoot Specifications Sheet 2 16. DDR3 and DDR3L Signal DC Specifications Sheet 2 Reference Clock SignalCommand Signals Control Signals17. Peci DC Specifications 18. System Reference Clock BCLK0/1 DC Specifications19. SMBus DC Specifications Sheet 1 Symbol Definition and Conditions Min Max Units19. SMBus DC Specifications Sheet 2 20. Jtag and TAP Signals DC Specifications21. Serial VID Interface Svid DC Specifications Sheet 1 Symbol Parameter Min Typ Max Units21. Serial VID Interface Svid DC Specifications Sheet 2 22. Processor Asynchronous Sideband DC SpecificationsCMOS1.05v Signals Open Drain Cmos Odcmos SignalsPCI Express* DC Specifications 3.2 DMI2/PCI Express* DC SpecificationsIntel QuickPath Interconnect DC Specifications Reset and Miscellaneous Signal DC SpecificationsStable VRB-DifferentialVcross MAX = 550mV Vcross MIN = 250mV2 I/O Signal Quality Specifications Signal Quality1 DDR3 Signal Quality Specifications Intel QuickPath Interconnect Signal Quality Specifications Input Reference Clock Signal Quality Specifications24. Processor I/O Overshoot/Undershoot Specifications Overshoot/Undershoot ToleranceActivity Factor Reading Overshoot/Undershoot Specification TablesOvershoot/Undershoot Pulse Duration 11. Maximum Acceptable Overshoot/Undershoot Waveform Listing by Land Name Land Name Sheet 1Land Name Sheet 2 Land Name Land No Buffer Type DirectionLand Name Sheet 3 Land Name Sheet 4Land Name Sheet 5 Land Name Sheet 6Land Name Sheet 7 Land Name Sheet 8Land Name Sheet 9 Land Name Sheet 10Land Name Sheet 11 Land Name Sheet 12Land Name Sheet 13 Land Name Sheet 14Land Name Sheet 15 Land Name Sheet 16Land Name Sheet 17 Land Name Sheet 18Land Name Sheet 19 Land Name Sheet 20Land Name Sheet 21 Land Name Sheet 22Land Name Sheet 23 Land Name Sheet 24Land Name Sheet 25 Land Name Sheet 26Land Name Sheet 27 Land Name Sheet 28Land Name Sheet 29 Land Name Sheet 30Land Name Sheet 31 Land Name Sheet 32Land Name Sheet 33 Land Name Sheet 34VCCD01 VCCD23Land Name Sheet 35 Land Name Sheet 36Land Name Sheet 37 Land Name Sheet 38Land Name Sheet 39 Land Name Sheet 40Land Name Sheet 41 Land Name Sheet 42Land Name Sheet 43 Land Name Sheet 44Land Name Sheet 45 Land Name Sheet 46Land Name Sheet 47 Land Name Sheet 48Vtta VttdLand Name Sheet 49 Listing by Land Number Land Number Sheet 1Land Number Sheet 2 Land No Land Name Buffer Type DirectionLand Number Sheet 3 Land Number Sheet 4Land Number Sheet 5 Land Number Sheet 6Land Number Sheet 7 Land Number Sheet 8Land Number Sheet 9 Land Number Sheet 10Land Number Sheet 11 Land Number Sheet 12Land Number Sheet 13 Land Number Sheet 14Land Number Sheet 15 Land Number Sheet 16Land Number Sheet 17 Land Number Sheet 18Land Number Sheet 19 Land Number Sheet 20Land Number Sheet 21 Land Number Sheet 22Land Number Sheet 23 Land Number Sheet 24Land Number Sheet 25 Land Number Sheet 26Land Number Sheet 27 Land Number Sheet 28Land Number Sheet 29 Land Number Sheet 30Land Number Sheet 31 Land Number Sheet 32Land Number Sheet 33 Land Number Sheet 34Land Number Sheet 35 Land Number Sheet 36Land Number Sheet 37 Land Number Sheet 38Land Number Sheet 39 Land Number Sheet 40Land Number Sheet 41 Land Number Sheet 42Land Number Sheet 43 Land Number Sheet 44Land Number Sheet 45 Land Number Sheet 46Land Number Sheet 47 Land Number Sheet 48236 Processor Package Assembly Sketch Package Mechanical Drawing238 Processor Package Drawing Sheet 1 Processor Package Drawing Sheet 2 Package Loading Specifications Package Insertion SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesProcessor Mass Specification Processor MaterialsProcessor Markings Processor MaterialsBoxed Processor Specifications Available Boxed Thermal Solution Configurations244 Mechanical Specifications STS200P and STS200PNRW 25.5 mm Tall Passive Heat SinksMotherboard Keepout Zones 1 246Boxed Processor Specifications Motherboard Keepout Zones 2Boxed Processor Motherboard Keepout Zones 3 248Motherboard Keepout Zones 4 TOP Surface of MotherboardBoxed Processor Heat Sink Volumetric 1 250Heat Sink Volumetric 2 SpecificationsProcessor Boxed Processor10.4-Pin Fan Cable Connector For Active Heat Sink 11 -Pin Base Baseboard Fan Header For Active Heat Sink Fan Power Supply STS200C 21,000 25,000 28,000Boxed Processor Cooling Requirements Boxed Processor Contents Boxed Processor 258