Boxed Processor Specifications

Figure 10-1. STS200C Passive/Active Combination Heat Sink (with Removable Fan)

Figure 10-2. STS200C Passive/Active Combination Heat Sink (with Fan Removed)

The STS200C utilizes a fan capable of 4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active thermal solution helps customers meet acoustic targets in pedestal platforms through the baseboard’s ability to directly control the RPM of the processor heat sink fan. See Section 10.3 for more details on fan speed control. Also see Section 2.5, “Platform Environment Control Interface (PECI)” for more on the PWM and PECI interface along with Digital Thermal Sensors (DTS).

10.1.3Intel Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions)

The STS200P and STS200PNRW are available for use with boxed processors that have TDP’s of 130W and lower. These 25.5 mm Tall passive solutions are designed to be used in SSI Blades, 1U, and 2U chassis where ducting is present. The use of a 25.5 mm Tall heatsink in a 2U chassis is recommended to achieve a lower heatsink TLA and more flexibility in system design optimization. Figure 10-3is a representation of the heat

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Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

 

Datasheet Volume One

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Intel CM8062101038606, E5-4600, E5-2600, E5-1600 manual 244