Thermal Design Considerations

10.3 Thermal Design Considerations

Follow these guidelines for printed circuit board (PCB) component placement:

Orient the 21264/EV67 on the PCB with the heat sink fins aligned with the airflow direction.

Avoid preheating ambient air. Place the 21264/EV67 on the PCB so that inlet air is not preheated by any other PCB components.

Do not place other high power devices in the vicinity of the 21264/EV67.

Do not restrict the airflow across the 21264/EV67 heat sink. Placement of other devices must allow for maximum system airflow in order to maximize the performance of the heat sink.

Alpha 21264/EV67 Hardware Reference Manual

Thermal Management 10–7

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Compaq 21264, EV67 specifications Thermal Design Considerations