Toshiba M10 manual Assembly of outside Tape and Cover shield

4 Replacement Procedures 4.30 TFT FL (Model 15.0 XGA LG. Philips LP150X06 A2)

9.Assembly of Tape shield and Tape Adhesive used for Top case fixing. Pressure or stress should not be given on Top case during this process

10.Assembly of Cover shield (C). Pressure or stress should not be given on control PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC.

11.Assembly of Cover shield (G). Pressure or stress should not be given on Gate TCP.

12.Assembly of Tape adhesive used for B/L Wire fixing. Pressure or stress should not be given on B/L Wire.

Figure 4-89 Assembly of outside Tape and Cover shield

4-118 Satellite Pro M10 Series Maintenance Manual (960-431)