xvi SA-1100 Developer’s Manual
16.4 Instruction Register.......................................................................................... 16-2
16.5 Public Instructions ...........................................................................................16-2
16.5.1 EXTEST (00000) ................................................................................ 16-3
16.5.2 SAMPLE/PRELOAD (00001) ............................................................. 16-3
16.5.3 CLAMP (00100)........................................................ .......................... 16-3
16.5.4 HIGHZ (00101)................................ ................................................... 16-4
16.5.5 IDCODE (00110)... ............................................................................. 16-4
16.5.6 BYPASS (11111)............................................................. ................... 16-4
16.6 Test Data Registers............................................................... .......................... 16-5
16.6.1 Bypass Register ................................................................................. 16-5
16.6.2 SA-1100 Device Identification (ID) Code Register.............................. 16-6
16.6.3 SA-1100 Boundary-Scan (BS) Register ............................................. 16-6
16.7 Boundary-Scan Interface Signals................. ................................................... 16-7
A Register Summary ......................................................................................................... A-1
B3.6864–MHz Oscillator Specifications................................................................ ............ B-1
B.1 Specifications .................................................................................................... B-1
B.1.1 System Specifications .......................................................................... B-1
B.1.1.1.Parasitic Capacitanc e Off-chip
Between PXTAL and PEXTAL................................................. B-2
B.1.1.2.Parasitic Capacitanc e Off-chip
Between PXTAL or PEXTAL and VSS ....................................B-2
B.1.1.3.Parasitic Resistanc e Between PXTAL and PEXTAL............. ..B-2
B.1.1.4.Parasitic Resistanc e Between PXTAL or PEXTAL and VSS... B-2
B.1.2 Quartz Crystal Specification ................................................................. B-3
C 32.768–kHz Oscillator Specifications.................................................... .........................C-1
C.1 Specifications........ ............................................................................................ C-1
C.1.1 System Specifications ..........................................................................C -1
C.1.1.1.Temperature Range............................................ .....................C-1
C.1.1.2.Current Consumption.......................................... .....................C-1
C.1.1.3.Startup Time ............................................................................ C-1
C.1.1.4.Frequency Shift Due to Temperature Effect on the Circ uit......C-2
C.1.1.5.Parasitic Capacitance Off-chip
Between TXTAL and TEXTAL.................................. ...............C-2
C.1.1.6.Parasitic Capacitance Off-chip
Between TXTAL or TEXTAL and VSS.....................................C-2
C.1.1.7.Parasitic Resistance Between TXTAL an d TEXTAL ...............C-2
C.1.1.8.Parasitic Resistance Between TXTAL or TE XTAL and VSS... C-2
C.1.2 Quartz Crystal Specification..... ............................................................C-3
D Internal Test............................................. ...................................................................... D-1
D.1 Test Unit Control Register (TUCR).................................................................... D-1