10

Thermal Management

This chapter describes the 21264/EV68A thermal management and thermal design considerations, and is organized as follows:

Operating temperature

Heat sink specifications

Thermal design considerations

10.1Operating Temperature

The 21264/EV68A is specified to operate when the temperature at the center of the heat sink (Tc) is as shown in Table 10–1.Temperature T c should be measured at the center of the heat sink, between the two package studs. The GRAFOIL pad is the interface mate- rial between the package and the heat sink.

Table 10–1 Operating Temperature at Heat Sink Center (Tc)

Tc

Frequency

80.8° C

750 MHz

78.6° C

833 MHz

77.6° C

875 MHz

76.0° C

940 MHz

 

 

Note:

Compaq recommends using the heat sink because it reduces overheating

 

that causes thermal failure.

21264/EV68A Hardware Reference Manual

Thermal Management 10–1

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Compaq EV68A specifications Thermal Management, Operating Temperature, That causes thermal failure