9 PACKAGE

9 Package

9.1 Plastic Package

QFP15-128pin

 

± 0.1

max

1.4

 

1.7

 

0.1

(Unit: mm)

 

 

 

16± 0.4

 

 

 

 

 

 

 

 

14± 0.1

 

 

 

 

 

 

 

96

65

 

 

 

 

 

 

 

 

 

 

 

 

 

97

 

 

 

 

 

 

64

 

 

 

 

 

 

 

 

 

 

 

 

 

± 0.1

± 0.4

14

16

INDEX

 

128

33

1

32

0.4

+0.1

0.16–0.05

+0.05

0.125–0.025

0°

10°

0.5± 0.2

1

Limit of power consumption

The chip temperature of an LSI rises according to power consumption. The chip temperature can be calculated from environment temperature (Ta), thermal package resistance (θ ) and power consumption (PD).

Chip temperature (Tj) = Ta + (PD ⋅ θ ) (° C)

As a guide, normally keep the chip temperature (Tj) lower than 85° C.

The thermal resistance of the QFP15-128pin package is as follows:

Thermal resistance (° C/W) = 110 to 120° C (90 to 100° C for Cu lead frame)

This thermal resistance is a value under the condition that the measured device is hanging in the air and has no air-cooling. Thermal resistance greatly varies according to the mounting condition on the board and air-cooling condition.

S1C33210 PRODUCT PART

EPSON

A-87