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1 Hardware Overview | 1.1 Features |
The system unit is composed of the following major components:
Processor
•Intel Mobile
–Processor core speed: 1.73GHz/1.86GHz/2.0AGHz/2.13GHz/2.26GHz
–Processor bus speed: 533MHz
–Integrated L1 cache memory: 32KB instruction cache and 32KB
–Integrated L2 cache memory: 2MB
–Integrated NDP
Memory
Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.
Memory
•DDR2-SDRAM
•DDR400 or DDR533 memory
•1.8 volt operation
•FBGA
Memory Module
•240 pin, SO Dual
•
•256MB/512MB/1GB
–256 MB 256Mb⋅8
–512 MB 512Mb⋅8
–1GB 512Mb⋅16
Firmware Hub (FWH)
•One STMicro M50FW080N is used.
•8Mbits of flash memory are used.
PCI chipset
This gate array incorporates the following elements and functions.
•North Bridge (Intel GMCH, AlvisoPM)
–Dothan Processor System Bus Support
–System memory interface
–DRAM Controller: DDR333,
–X16 PCI Express Graphics Interface
–DMI (Direct Media Interface)
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[CONFIDENTIAL] | TECRA S3 Maintenance Manual |