1 Hardware Overview

1.1 Features

The system unit is composed of the following major components:

‰Processor

Intel Mobile Pentium-M Processor

Processor core speed: 1.73GHz/1.86GHz/2.0AGHz/2.13GHz/2.26GHz

Processor bus speed: 533MHz

Integrated L1 cache memory: 32KB instruction cache and 32KB write-back data cache

Integrated L2 cache memory: 2MB

Integrated NDP

‰Memory

Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.

Memory

DDR2-SDRAM

DDR400 or DDR533 memory

1.8 volt operation

FBGA

Memory Module

240 pin, SO Dual In-line Memory Module (SO-DIMM)

PC2-3200 or PC2-4200

256MB/512MB/1GB

256 MB 256Mb⋅8

512 MB 512Mb⋅8

1GB 512Mb⋅16

‰Firmware Hub (FWH)

One STMicro M50FW080N is used.

8Mbits of flash memory are used.

‰PCI chipset

This gate array incorporates the following elements and functions.

North Bridge (Intel GMCH, AlvisoPM)

Dothan Processor System Bus Support

System memory interface

DRAM Controller: DDR333, DDR2-400/DDR2-533 Support, 2GB max

X16 PCI Express Graphics Interface

DMI (Direct Media Interface)

1257-ball, 40.0⋅40.0 mm, FC-BGA package

1-8

[CONFIDENTIAL]

TECRA S3 Maintenance Manual (960-532)

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Toshiba S4 manual DDR2-SDRAM