4.30 Fluorescent Lamp

4 Replacement Procedure

Assembly of outside Tape and Cover shield

1. Assembly of Cover shield (S).

CAUTION: Pressure or stress should not be given on Source PCB.

Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC.

2. Assembly of Cover shield (G).

CAUTION: Pressure or stress should not be given on Gate COF.

3. Assembly of Tape Adhesive used for Top case fixing.

CAUTION: Pressure or stress should not be given on Top case during this process.

4. Assembly of Tape Adhesive used for B/L Wire fixing.

CAUTION: Pressure or stress should not be given on B/L Wire.

Figure 4-99 Replacing LG Philips fluorescent lamp (SXGA+) (8)

TECRA S3 Maintenance Manual (960-532)

[CONFIDENTIAL]

4-121

Page 363
Image 363
Toshiba S4 manual Replacing LG Philips fluorescent lamp SXGA+