Intel manual 9.0Mechanical Specifications, 9.1Overview, 9.2Package Specifics for the IXF1104

Models: IXF1104

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9.0Mechanical Specifications

IXF1104 4-Port Gigabit Ethernet Media Access Controller

9.0Mechanical Specifications

The IXF1104 is packaged in a 576-ball BGA package with 6 balls removed diagonally from each corner, for a total of 552 balls used measuring 25 mm x 25 mm. The pitch of the balls on the package is 1 mm.

9.1Overview

CBGA packages are suited for applications requiring high I/O counts and high electrical performance. They are recommended for high-power applications with high noise immunity requirements.

9.1.1Features

Flip chip die attach; surface mount second-level interconnect

High electrical performance

High I/O counts

Area array I/O options

Multiple power-zone offering supports core and four additional voltages

JEDEC-compliant package

9.2Package Specifics for the IXF1104

The IXF1104 uses the following package:

576-ball BGA package with 6 balls removed diagonally from each corner, for a total of 552 balls used

Ball pitch of 1.0 mm

Overall package dimensions of 25 mm x 25 mm

Datasheet

223

Document Number: 278757

Revision Number: 007

Revision Date: March 25, 2004

Page 223
Image 223
Intel manual 9.0Mechanical Specifications, 9.1Overview, 9.2Package Specifics for the IXF1104, 9.1.1Features, Datasheet