IXF1104
9.0Mechanical Specifications
The IXF1104 is packaged in a
9.1Overview
CBGA packages are suited for applications requiring high I/O counts and high electrical performance. They are recommended for
9.1.1Features
•Flip chip die attach; surface mount
•High electrical performance
•High I/O counts
•Area array I/O options
•Multiple
•
9.2Package Specifics for the IXF1104
The IXF1104 uses the following package:
•
•Ball pitch of 1.0 mm
•Overall package dimensions of 25 mm x 25 mm
Datasheet | 223 |
Document Number: 278757
Revision Number: 007
Revision Date: March 25, 2004