IXF1104
Figure 56. CBGA Package Side View Diagram
45L4867 (552) Solder ball
C4 Encapsulant
Fillet
Chip
(6X) (0.77 | Max) |
(0.69 | Min) |
(0.857 Max)
(0.779 Min)
(3.327 Max)
(2.809 Min)
(4.237 Max)
(3.619 Min)
0.81 ± 0.1
(2.47 Max)
(2.03 Min)
(6X) (3.24 Max)
(2.72 Min)
(6X) (4.16 Max)
(3.43 Min)
0.15 C
Seating Plane
Note: All dimensions are in mm.
Datasheet | 225 |
Document Number: 278757
Revision Number: 007
Revision Date: March 25, 2004