IXF1104
9.3Package Information
Figure 55. CBGA Package Diagram
Chip |
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47P6802 |
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Substrate |
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3.902 | 7.804 | (25 ± 0.2) |
3.938 |
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7.877 |
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(25 ± 0.2) |
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Note: All dimensions are in mm.
(Reference) | MAX)(0.825 | MIN)(0.325 |
| (575X) (ø0.8 ± 0.05) | |
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| (0.825 MAX) | ø0.20 | L D A S B S |
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| (I/O Pads) | ||
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| (0.325 MIN) | ||
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| (Reference) | ||
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0.2)±(25 |
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| (23) |
| = Ball |
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| = No ball |
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| (23x) TYP |
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| (23x) TYP |
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Chip Carrier |
| (23) |
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A01 Corner |
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| (25 ± 0.2) |
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Note: All dimensions are in mm.
224 | Datasheet |
Document Number: 278757
Revision Number: 007
Revision Date: March 25, 2004