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Epson Research and Development

 

Vancouver Design Center

 

 

6 D.C. Characteristics

Table 6-1: Absolute Maximum Ratings

Symbol

Parameter

Rating

Units

 

 

 

 

Core VDD

Supply Voltage

VSS - 0.3 to 4.0

V

IO VDD

Supply Voltage

Core VDD to 7.0

V

VIN

Input Voltage

VSS - 0.3 to IO VDD + 0.5

V

VOUT

Output Voltage

VSS - 0.3 to IO VDD + 0.5

V

TSTG

Storage Temperature

-65 to 150

° C

TSOL

Solder Temperature/Time

260 for 10 sec. max at lead

° C

Table 6-2: Recommended Operating Conditions for Core VDD = 3.3V ± 10%

Symbol

Parameter

 

Condition

Min

Typ

Max

Units

 

 

 

 

 

 

 

 

Core VDD

Supply Voltage

VSS = 0

V

2.7

3.0/3.3

3.6

V

IO VDD

Supply Voltage

VSS = 0

V, IO VDD Core VDD

2.7

3.0/3.3/5.0

5.5

V

VIN

Input Voltage

 

 

VSS

 

IO VDD

V

TOPR

Operating Temperature

 

 

-40

25

85

° C

Table 6-3: Input Specifications

Symbol

Parameter

Condition

Min

Typ

Max

Units

 

 

 

 

 

 

 

 

VIL

Low Level Input Voltage

IO VDD =

3.0

 

 

0.8

 

CMOS inputs

 

3.3

 

 

0.8

V

 

 

 

5.0

 

 

1.0

 

 

High Level Input Voltage

IO VDD =

3.0

1.9

 

 

 

VIH

CMOS inputs

 

3.3

2.0

 

 

V

 

 

 

5.0

3.5

 

 

 

 

Positive-going Threshold

IO VDD =

3.0

1.0

 

2.3

 

VT+

CMOS Schmitt inputs

 

3.3

1.1

 

2.4

V

 

 

 

5.0

2.0

 

4.0

 

VT-

Negative-going Threshold

IO VDD =

3.0

0.5

 

1.7

 

CMOS Schmitt inputs

 

3.3

0.6

 

1.8

V

 

 

 

5.0

0.8

 

3.1

 

 

 

VDD = Max

 

 

 

 

A

IIZ

Input Leakage Current

VIH = VDD

 

-1

 

1

 

 

VIL = VSS

 

 

 

 

 

CIN

Input Pin Capacitance

 

 

 

 

10

pF

S1D13705

Hardware Functional Specification

X27A-A-001-10

Issue Date: 02/02/01

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Image 30
Epson S1D13705 C. Characteristics, Absolute Maximum Ratings, Recommended Operating Conditions for Core VDD = 3.3V ± 10%