Page 24 Epson Research and Development
Vancouver Design Center
S1D13705 Hardware Functional Specification
X27A-A-001-10 Issue Date: 02/02/01
6 D.C. Characteristics

Table 6-1: Absolute Maximum Ratings

Symbol Parameter Rating Units
Core VDD Supply Voltage VSS - 0.3 to 4.0 V
IO VDD Supply Voltage Core VDD to 7.0 V
VIN Input Voltage VSS - 0.3 to IO VDD + 0.5 V
VOUT Output Voltage VSS - 0.3 to IO VDD + 0.5 V
TSTG Storage Temperature -65 to 150 ° C
TSOL Solder Temperature/Time 260 for 10 sec. max at lead ° C

Table 6-2: Recommended Operating Conditions for Core VDD = 3.3V ± 10%

Symbol Parameter Condition Min Typ Max Units
Core VDD Supply Voltage VSS = 0 V 2.7 3.0/3.3 3.6 V
IO VDD Supply Voltage VSS = 0 V, IO VDD ≥ Core VDD 2.7 3.0/3.3/5.0 5.5 V
VIN Input Voltage VSS IO VDD V
TOPR Operating Temperature -40 25 85 ° C

Table 6-3: Input Specifications

Symbol Parameter Condition Min Typ Max Units
VIL Low Level Input Voltage
CMOS inputs
IO VDD = 3.0
3.3
5.0
0.8
0.8
1.0 V
VIH High Level Input Voltage
CMOS inputs
IO VDD = 3.0
3.3
5.0
1.9
2.0
3.5 V
VT+ Positive-going Threshold
CMOS Schmitt inputs
IO VDD = 3.0
3.3
5.0
1.0
1.1
2.0
2.3
2.4
4.0 V
VT- Negative-going Threshold
CMOS Schmitt inputs
IO VDD = 3.0
3.3
5.0
0.5
0.6
0.8
1.7
1.8
3.1 V
IIZ Input Leakage Current VDD = Max
VIH = VDD
VIL = VSS
-1 1 µA
CIN Input Pin Capacitance 10 pF