Removal and Replacement Procedures System Board with Major Components
12.1.2 Configuration 2
This board is identified by the presence of a fansink over the primary processor. The system board part number is
12.2 Heatsink/Processor
The processor(s) in these systems may be upgraded by replacing it with a faster component. The hp workstation xw6000 systems may also be upgraded by adding a second processor to the system board.
12.2.1 Preparing the System for Processor Removal
Removal of a processor requires first separating the heatsink from the processor, which are bonded together with a compound. To break the compound bond between the heatsink and the processor the heatsink processor assembly must be cooled or heated to the optimum temperature as described in the following subsections:
■Heatsink
■Heatsink
ÅWARNING: To reduce the risk of personal injury from hot surfaces, allow the internal system components to cool before touching them.
ÄCAUTION: Installing the processor incorrectly may cause damage to the processor and/or system board. Processor removal and replacement should be performed by qualified personnel. Read all instructions carefully before beginning the procedure.
ÄCAUTION: Electrostatic discharge (ESD) can damage electronic components. Before beginning these procedures discharge your body by touching a ground metal object. Use of a grounding strap is recommended when handling system boards and/or electronic components. Review static discharge information and procedures in chapter 6.
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