
Ballout and Package Information
R
7.1Package Mechanical Information
This section provides the MCH package mechanical dimensions. The package is a 593 ball 
Figure 8. Intel® MCH FC-BGA  Package Dimensions (Top and Side View)
  | Top View  | 
  | 
  | 37.50  | 
  | 
  | 33.90  | 
  | 
  | 
  | 16.95  | 
16.95  | 
  | 
  | 
  | 
  | 37.50  | 
33.90  | 
  | 
  | 
9.67  | 
  | 0.61  | 
  | 36.28  | 
  | 
  | Side View | 
  | 
Substrate  | Die  | See Detail A  | 
0.600 ±0.100  | 
  | |
  | 1.100 ±0.100  | |
  | Detail A  | A  | 
  | 0.152  | |
  | 0.74 ±0.025  | Underfill  | 
  | Epoxy  | |
  | 
  | |
  | 0.10 ±0.025  | Die Solder  | 
  | Bum ps  | |
Units = Millim eters  | 
  | |
  | 
  | |
  | 
  | 
134 | Intel® 82845 MCH for SDR Datasheet |