
Ballout and Package Information
R
7.1Package Mechanical Information
This section provides the MCH package mechanical dimensions. The package is a 593 ball
Figure 8. Intel® MCH FC-BGA Package Dimensions (Top and Side View)
| Top View |
|
| 37.50 |
|
| 33.90 |
|
|
| 16.95 |
16.95 |
|
|
|
| 37.50 |
33.90 |
|
|
9.67 |
| 0.61 |
| 36.28 |
|
| Side View |
|
Substrate | Die | See Detail A |
0.600 ±0.100 |
| |
| 1.100 ±0.100 | |
| Detail A | A |
| 0.152 | |
| 0.74 ±0.025 | Underfill |
| Epoxy | |
|
| |
| 0.10 ±0.025 | Die Solder |
| Bum ps | |
Units = Millim eters |
| |
|
| |
|
|
134 | Intel® 82845 MCH for SDR Datasheet |