Ballout and Package Information

R

7.1Package Mechanical Information

This section provides the MCH package mechanical dimensions. The package is a 593 ball FC-BGA.

Figure 8. Intel® MCH FC-BGA Package Dimensions (Top and Side View)

 

Top View

 

 

37.50

 

 

33.90

 

 

 

16.95

16.95

 

 

 

 

37.50

33.90

 

 

9.67

 

0.61

 

36.28

 

 

Side View

 

Substrate

Die

See Detail A

0.600 ±0.100

 

 

1.100 ±0.100

 

Detail A

A

 

0.152

 

0.74 ±0.025

Underfill

 

Epoxy

 

 

 

0.10 ±0.025

Die Solder

 

Bum ps

Units = Millim eters

 

 

 

 

 

pkg_olga_593_top-side

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Intel® 82845 MCH for SDR Datasheet

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Intel 845 manual Package Mechanical Information, Intel MCH FC-BGA Package Dimensions Top and Side View