Intel 845 3.5.36 ERRCMDError Command Register (Device 0)

Register Description

R

76 Intel® 82845 MCH for SDR Datasheet

Bit Description

0 Single-bit DRAM ECC Error Flag (DSERR).

0 = Software must write a 1 to clear this bit and unlock the error logging mechanism.

1 = A memory read data transfer had a single-bit correctable error and the corrected data was

sent for the access. When this bit is set, the addres s , channel number, and device number

that caused the error are logged in the EAP Register. When this bit is set, the EAP, CN, DN,

and ES fields are locked to further single bit error updates until the processor cl ears this bit

by writing a 1.

3.5.36 ERRCMD—Error Command Register (Device 0)

Address Offset: CA–CBh

Default Value: 0000h

Access: R/W

Size: 16 bits

This register enables various errors to generate a SERR message via the hub interface. Since the

MCH does not have an SERR# signal, SERR messages are passed from the MCH to the ICH2

over the hub interface. When a bit in this register is set, a SERR message will be generated on the

hub interface when the corresponding flag is set in the ERRSTS register. The actual generation of

the SERR message is globally enabled for Device 0 via the PCICMD register.

Note: An error can generate one and only one error message via the hub interface. It is software’s

responsibility to make sure that when an SERR error message is enabled for an error condition,

SMI and SCI error messages are disabled for that same error condition.

Bit Description

15:10 Reserved.

9 SE RR on Non-DRAM Lock (LCKERR).

0 = Disable.

1 = Enable. The MCH will generate a hub interface SERR special cycle when a processor lock

cycle is detected that does not hit system memory.

8:7 Reserved.

6 SE RR on Target Abort on Hub Interface Exception (TAHLA_SERR).

0 = Disable.

1 = Enable. Generation of the hub interface SERR message is enabled when a MCH-originated

hub interface cycle is completed with “Target Abort” completion packet or s pec ial cycle

status.

5 SE RR on Detecting Hub Interface Unimplemented Special Cycle (HIAUSCERR). SERR

messaging for Device 0 is globally enabled in the PCICMD register.

0 = Disable. MCH does not generate an SERR message for this event.

1 = Enable. MCH generates a SERR message over the hub interface when an unimplemented

Special Cycle is received on the hub interface.

Contents

Main Intel 845 Chipset: 82845 Memory Controller Hub (MCH) for SDR Page Contents Page Page Page Figures Tables Revision History Intel 82845 MCH Features 10 Intel 82845 MCH for SDR Datasheet System Block Diagram 1 Introduction 1.1 Terminology and Notations Page 1.2 Reference Documents 1.3 Intel 845 Chipset System Architecture Intel 82801BA I/O Controller Hub 2 (ICH2) 1.4 Intel 82845 MCH Overview 1.4.1 System Bus Interface 1.4.2 System Bus Error Checking 1.4.3 System Memory Interface 1.4.4 AGP Interface 1.4.5 Hub Interface 1.4.6 Intel MCH Clocking 1.4.7 System Interrupts 1.4.8 Powerdown Flow 2 Signal Description Signal Description 20 Intel 82845 MCH for SDR Datasheet Figure 1. Intel MCH Simplified Block Diagram 2.1 System Bus Signals Page 2.2 SDR SDRAM Interface Signals 2.3 Hub Interface Signals 2.4 AGP Interface Signals 2.4.1 AGP Addressing Signals 2.4.2 AGP Flow Control Signal s 2.4.3 AGP Status Signals Signal Description 26 Intel 82845 MCH for SDR Datasheet 2.4.4 AGP Strobes Signals 2.4.5 AGP/PCI Signals Page 2.5 Clocks, Reset, and Miscellaneous Signals 2.6 Voltage Reference and Power Signals Signal Description 30 Intel 82845 MCH for SDR Datasheet 2.7 Reset States During Reset 3 Register Description 3.1 Register Terminology 3.2 PCI Bus Configuration Space Access 3.2.1 Standard PCI Bus Configuration Mechanism 3.2.2 Routing Configuration Accesses PCI Bus 0 Configuration Mechanism Primary PCI and Downstream Configuration Mechanism AGP Configuration Mechanism 3.3 I/O Mapped Registers 3.3.1 CONF_ADDRConfiguration Address Register Page 3.3.2 CONF_DATAConfiguration Data Register 3.4 Memory-Mapped Register Space 3.4.1 DRAMWIDTHDRAM Width Register 3.4.2 DQCMDSTRStrength Control Register (SDQ and CMD Signal Groups) 3.4.3 CKESTRStrength Control Register (SCKE Signal Group) 3.4.4 CSBSTRStrength Control Register (SCS# Si gnal Group) 3.4.5 CKSTRStrength Control Register (Cl ock Si gnal Group) 3.4.6 RCVENSTRStrength Control Register (RCVENOUT Signal Group) Register Description Intel 82845 MCH for SDR Datasheet 43 3.5 Host-Hub Interface Bridge Device Registers (Device 0) Page 3.5.1 VIDVendor Identificati on Regi ster (Device 0) 3.5.2 DIDDevice Identification Register (Device 0) 3.5.3 PCICMDPCI Command Register (Device 0) 3.5.4 PCISTSPCI Status Register (Device 0) 3.5.5 RIDRevision Identification Register (Device 0) 3.5.6 SUBCSub-Class Code Register (Device 0) 3.5.7 BCCBase Class Code Register (Device 0) 3.5.8 MLTMaster Latency Timer Register (Device 0) 3.5.9 HDRHeader Type Register (Device 0) 3.5.10 APBASEAperture Base Configuration Register (Device 0) 3.5.11 SVIDSubsystem Vendor Identification (Device 0) 3.5.12 SIDSubsystem Identification (Device 0) 3.5.13 CAPPTRCapabilities Pointer (Device 0) 3.5.14 AGPMAGP Miscellaneous Configurati on Regi ster (Device 0) 3.5.15 DRB[0:7]DRAM Row Boundary Registers (Device 0) 3.5.16 DRADRAM Row Attribute Registers (Device 0) Page 3.5.17 DRTDRAM Timing Register (Device 0) 3.5.18 DRCDRAM Controller Mode Register (Device 0) Page 3.5.19 DERRSYNDRAM Error Syndrome Register (Device 0) 3.5.20 EAPError Address Pointer Register (Device 0) 3.5.21 PAM[0:6]Programmable Attribute Map Registers (Device 0) Page DOS Application Area (00000h9FFFh) Video Buffer Area (A0000hBFFFFh) Expansion Area (C0000hDFFFFh) Extended System BIOS Area (E0000hEFFFFh) System BIOS Area (F0000hFFFFFh) 3.5.22 FDHCFixed DRAM Hole Contr ol Regi ster (Device 0) 3.5.23 SMRAMSystem Management RAM Control Register (Device 0) 3.5.24 ESMRAMCExtended System Mgmt RAM Control Register (Device 0) 3.5.25 ACAPIDAGP Capability Identifier Register (Device 0) 3.5.26 AGPSTATAGP Status Register (Device 0) 3.5.27 AGPCMDAGP Command Register (Device 0) 3.5.28 AGPCTRLAGP Control Register (Device 0) 3.5.29 APSIZEAperture Size (Device 0) 3.5.30 ATTBASEAperture Translation Table Base Register (Device 0) 3.5.31 AMTTAGP Interface Multi-Transaction Timer Register (Device 0) 3.5.32 LPTTAGP Low Priority Transaction Timer Register (Device 0) 3.5.33 TOMTop of Low Memory Register (Device 0) 3.5.34 MCHCFGMCH Configuration Register (Device 0) 3.5.35 ERRSTSError Status Register (Device 0) 3.5.36 ERRCMDError Command Register (Device 0) Page 3.5.37 SMICMDSMI Command Register (Device 0) 3.5.38 SCICMDSCI Command Register (Device 0) 3.5.39 SKPDScratchpad Data Register (Device 0) 3.5.40 CAPIDProduct Specific Capability Identifier Register (Device 0) 3.6 Bridge Registers (Device 1) 3.6.1 VID1Vendor Identificati on Regi ster (Device 1) 3.6.2 DID1Device Identification Register (Device 1) 3.6.3 PCICMD1PCI-PCI Command Register (Device 1) 3.6.4 PCISTS1PCI-PCI Status Register (Device 1) 3.6.5 RID1Revision Identification Register (Device 1) 3.6.6 SUBC1Sub-Class Code Register (Device 1) 3.6.7 BCC1Base Class Code Register (Device 1) 3.6.8 MLT1Master Latency Timer Register (Device 1) 3.6.9 HDR1Header Type Register (Device 1) 3.6.10 PBUSN1Primary Bus Number Register (Device 1) 3.6.11 SBUSN1Secondary Bus Number Register (Device 1) 3.6.12 SUBUSN1Subordi nate Bus Number Register (Device 1) 3.6.13 SMLT1Secondary Master Latency Timer Register (Device 1) 3.6.14 IOBASE1I/O Base Address Register (Device 1) 3.6.15 IOLIMIT1I/O Limit Address Register (Device 1) 3.6.16 SSTS1Secondary PCI-PCI Status Register (Device 1) 3.6.17 MBASE1Memory Base Address Register (Device 1) 3.6.18 MLIM IT1Memory Limit Address Register (Device 1) 3.6.19 PMBASE1Prefetchable Memory Base Address Register (Device 1) 3.6.20 PMLIMIT1Prefetchable Memory Limit Address Register (Device 1) 3.6.21 BCTRL1PCI-PCI Bridge Control Register (Device 1) 3.6.22 ERRCMD1Error Command Register (Device 1) 3.6.23 DWTCDRAM Write Ther mal Management Control Register (Device 1) 3.6.24 DRTCDRAM Read Thermal Management Control Register (Device 1) Page 4 System Address Map 4.1 Memory Address Ranges System Address Map 98 Intel 82845 MCH for SDR Datasheet Figure 4. DOS Compatible Area Address Map 4.1.1 VGA and MDA Memory Space 4.1.2 PAM Memory Spaces 4.1.3 ISA Hole Memory Space 4.1.4 TSEG SMM Memory Space 4.1.5 IOAPIC Memory Space 4.1.6 System Bus Interrupt APIC Memory Space 4.1.7 High SMM Memory Space 4.1.8 AGP Aperture Space (Device 0 BAR) 4.2 AGP Memory Address Ranges 4.2.1 AGP DRAM Graphics Aperture 4.3 System Management Mode (SMM) Memory Range 4.3.1 SMM Space Definition 4.3.2 SMM Space Restrictions 4.4 I/O Address Space 4.5 Intel MCH Decode Rules and Cross-Bridge Address Mapping 4.5.1 Hub Interface Decode Rules 4.5.2 AGP Interface Decode Rules Cycles Initiated Using AGP FRAME# Protocol Cycles Initiated Using AGP PIPE# or SB Protocol AGP Accesses to MCH that Cross Device Boundaries 5 Functional Description 5.1 System Bus 5.1.1 Dynamic Bus Inversion 5.1.2 System Bus Interrupt Delivery 5.1.3 Upstream Interrupt Messages 5.2 System Memory Interface 5.2.1 Single Data Rate (SDR) SDRAM Interface Overview 5.2.2 Memory Organization and Configur ation 5.2.2.1 Configuration Mechanism For DIMMs Memory Detection and Initialization SMBus Configuration and Access of the Serial Presence Detect Ports Memory Register Programming 5.2.3 Memory Address Translation and Decoding 5.2.4 DRAM Performance Description 5.2.4.1 Data Integrity (ECC) 5.3 AGP Interface Overview 5.3.1 AGP Target Operations Page 5.3.2 AGP Transaction Ordering 5.3.3 AGP Signal Levels 5.3.4 4x AGP Protocol 5.3.5 Fast Writes 5.3.6 AGP FRAME# Transactions on AGP MCH Initiator and Target Operations Page MCH Retry/Disconnect Conditions Delayed Transaction 5.4 Power and Thermal Management 5.4.1 Processor Power State Control 5.4.2 Sleep State Control 5.5 Intel MCH Clocking 5.6 Intel MCH System Reset and Power Sequencing 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Power Characteristics 6.3 Signal Groups Page Electrical Characteristics 122 Intel 82845 MCH for SDR Datasheet 6.4 DC Characteristics Table 21. DC Characteristics Electrical Characteristics Intel 82845 MCH for SDR Datasheet 123 Page 7 Ballout and Package Information Ballout and Package Information 126 Intel 82845 MCH for SDR Datasheet Figure 6. Intel 82845 MCH Ballout Diagram (Top ViewLeft Side) Ballout and Package Information Intel 82845 MCH for SDR Datasheet 127 Figure 7. Intel 82845 MCH Ballout Diagram (Top ViewRight Side) Ballout and Package Information 128 Intel 82845 MCH for SDR Datasheet Table 22. Intel 82845 MCH Ballout Listed Alphabetically by Signal Name Page Page Page Page Page 7.1 Package Mechanical Information Ballout and Package Information Intel 82845 MCH for SDR Datasheet 135 Figure 9. Intel MCH FC-BGA Package Dimensions (Bottom View) Page 8 Testability 8.1 XOR Test Mode Initialization 8.2 XOR Chains Page Testability 140 Intel 82845 MCH for SDR Datasheet Table 24. XOR Chain 1 Testability Intel 82845 MCH for SDR Datasheet 141 Table 25. XOR Chain 2 Testability 142 Intel 82845 MCH for SDR Datasheet Table 26. XOR Chain 3 Testability Intel 82845 MCH for SDR Datasheet 143 Table 27. XOR Chain 4 Testability 144 Intel 82845 MCH for SDR Datasheet Table 28. XOR Chain 5 Page Testability 146 Intel 82845 MCH for SDR Datasheet Table 29. XOR Chain 6 Testability Intel 82845 MCH for SDR Datasheet 147 Table 30. XOR Chain 7