UM10237_2 © NXP B.V. 2008. All rights reserved.
User manual Rev. 02 — 19 December 2008 8 of 792
NXP Semiconductors UM10237
Chapter 1: LPC24XX Introductory information

5.5 LPC2478 ordering options

6. Architectural overview

The LPC2400 microcontroller consists of an ARM7TDMI-S CPU with emulation support,

the ARM7 local bus for closely coupled, high speed access to the majority of on-chip

memory, the AMBA AHB interfacing to high speed on-chip peripherals and external

memory, and the AMBA APB for connection to other on-chip peripheral functions. The

microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte

order.

The LPC2400 implements two AHB buses in order to allow the Ethernet block to operate

without interference caused by other system activity. The primary AHB, referred to as

AHB1, includes the VIC, GPDMA controller, and EMC.

Table 10. LPC2470 ordering options
Type n umbe r Flash
(kB) SRAM (kB) External
bus Ethernet USB
OTG/
OHC/
Device
+ 4 kB
FIFO
CAN channels
SD/
MMC GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2470FBD208 N/A 64 16 16 2 98 Full
32-bit MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C
LPC2470FET208 N/A 64 16 16 2 98 F ull
32-bit MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C
Table 11. LPC2478 ordering information
Type n umbe r Package
Name Description Versi on
LPC2478FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC2478FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
0.7 mm SOT950-1
Table 12. LPC2478 ordering options
Type n umbe r Flash
(kB) SRAM (kB) External
bus Ethernet USB
OTG/
OHC/
Device
+ 4 kB
FIFO
CAN channels
SD/
MMC GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2478FBD208 512 64 16 16 2 98 Full
32-bit MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C
LPC2478FET208 512 64 16 16 2 98 Full
32-bit MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C