UM10237_2 © NXP B.V. 2008. All rights reserved.
User manual Rev. 02 — 19 December 2008 7 of 792
NXP Semiconductors UM10237
Chapter 1: LPC24XX Introductory information
5.3 LPC2468 ordering options
5.4 LPC2470 ordering options
Table 6. LPC2420/60 ordering options
Type n umbe r Flash
(kB) SRAM (kB) External
bus Ethernet USB
OTG/
OHCI/
DEV
+4kB
FIFO
CAN channels
SD/
MMC GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2420FBD208 N/A 64 - 16 2 82 Full 32-bit - yes - yes yes 8 1 40°C to
+85 °C
LPC2460FBD208 N/A 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 °C to
+85 °C
LPC2460FET208 N/A 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 °C to
+85 °C
Table 7. LPC2468 ordering information
Type n umbe r Package
Name Description Versi on
LPC2468FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT4 59 -1
LPC2468FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
Table 8. LPC2468 ordering options
Type n umbe r Flash
(kB) SRAM (kB) External
bus Ethernet USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
CAN channels
SD/
MMC GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2468FBD208 512 64 16 16 2 98 Full 32-bit MII/
RMII yes 2 yes yes 8 1 40°C to
+85 °C
LPC2468FET208 512 64 16 16 2 98 Full 32-bit MII/
RMII yes 2 yes yes 8 1 40°C to
+85 °C
Table 9. LPC2470 ordering information
Type n umbe r Package
Name Description Versi on
LPC2470FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
0.7 mm SOT950-1