
MPCBL0010
Table 5. | Environmental Specifications (Sheet 2 of 2) | ||
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| Operating | 4000 m (13123 ft.) |
| Altitude | Note: May require additional cooling above 1800 m (5905 ft.) | |
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| Storage | 15000 m (49212 ft.) |
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| Sine sweep: |
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| • 5 to 100 Hz: 1G @ 0.25 Octave/minute |
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| • 100 to 500 Hz: 1G @ 1 Octave/minute |
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| Operating | Random profile: |
| Unpackaged Vibration |
| • 5 Hz @ 0.01 g2 /Hz to 20 Hz @ 0.02 g2 /Hz (slope up) |
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| • 20 Hz to 500 Hz @ 0.02 g2 /Hz (flat) |
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| • 3.13 g RMS, 10 minutes per axis for all 3 axes |
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| Storage | 5 to 50 Hz: 0.5G @ 0.1 Octave/minute |
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| 50 to 500 Hz: 3G @ 0.25 Octave/minute. | |
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| Shock | Operating | 30G/11 ms half sine |
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| Storage | 50G, 170 inches/second trapezoidal | |
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4.3Reliability Specifications
4.3.1Mean Time Between Failure (MTBF) Specifications
Calculation Type: | MTBF/FIT Rate |
Standard: | Telcordia* Standard |
Methods: | Method I, Case I, Quality Level II |
The calculation results were generated using the references and assumptions listed. This report and its associated calculations supersede all other released MTBF and Failure in Time (FIT) calculations of earlier report dates. The reported failure rates do not represent catastrophic failure. Catastrophic failure rates will vary based on application environment and features critical to the intended function.
Table 6. Reliability Estimate Data
Reliability Measure | Value |
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Failure Rate (FIT) | 8967 failures in 109 hours |
MTBF | 111,513 hours |
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4.3.1.1Environmental Assumptions
•Failure rates are based on a 40° C ambient temperature.
•Applied component stress levels are 50 percent (voltage, current, and/or power).
•Ground, fixed, controlled environment with an environmental adjustment factor equal to 1.0.
4.3.1.2General Assumptions
•Component failure rates are constant.
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•Printed circuit board is considered to have a 0 FIT rate.
Intel NetStructure® MPCBL0010 Single Board Computer |
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Technical Product Specification | October 2006 |
38 | Order Number: 304120 |