Intel Microcontroller, 80C196NU, 8XC196NP manual External Crystal Connections

Models: Microcontroller 80C196NU 8XC196NP

1 471
Download 471 pages 22.3 Kb
Page 233
Image 233

8XC196NP, 80C196NU USER’S MANUAL

Figure 11-4 shows the connections between the external crystal and the device. When designing an external oscillator circuit, consider the effects of parasitic board capacitance, extended oper- ating temperatures, and crystal specifications. Consult the manufacturer’s datasheet for perfor- mance specifications and required capacitor values. With high-quality components, 20 pF load capacitors (CL) are usually adequate for frequencies above 1 MHz.

Noise spikes on the XTAL1 or XTAL2 pin can cause a miscount in the internal clock-generating circuitry. Capacitive coupling between the crystal oscillator and traces carrying fast-rising digital signals can introduce noise spikes. To reduce this coupling, mount the crystal oscillator and ca- pacitors near the device and use short, direct traces to connect to XTAL1, XTAL2, and VSS. To further reduce the effects of noise, use grounded guard rings around the oscillator circuitry and ground the metallic crystal case.

C1

XTAL1

8XC196

Device

XTAL2

C2

Quartz Crystal

Note:

Mount the crystal and capacitors close to the device using short, direct traces to XTAL1, XTAL2, and Vss. When using a crystal, C1=C220 pF. When using a ceramic resonator, consult the manufacturer for recommended oscillator circuitry.

A0273-02

Figure 11-4. External Crystal Connections

In cost-sensitive applications, you may choose to use a ceramic resonator instead of a crystal os- cillator. Ceramic resonators may require slightly different load capacitor values and circuit con- figurations. Consult the manufacturer’s datasheet for the requirements.

11-6

Page 233
Image 233
Intel Microcontroller, 80C196NU, 8XC196NP manual External Crystal Connections