High Performance Two Port 10/100 Managed Ethernet Switch with 32-Bit Non-PCI CPU Interface

Datasheet

 

 

Table 16.2 LAN9312 128-XVTQFP Dimensions

 

 

 

 

 

 

MIN

NOMINAL

MAX

REMARKS

 

 

 

 

 

A

-

-

1.20

Overall Package Height

 

 

 

 

 

A1

0.05

-

0.15

Standoff

 

 

 

 

 

A2

0.95

1.00

1.05

Body Thickness

 

 

 

 

 

D/E

15.80

16.00

16.20

X/Y Span

 

 

 

 

 

D1/E1

13.80

14.00

14.20

X/Y Plastic Body Size

 

 

 

 

 

D2/E2

6.35

6.50

6.65

X/Y Exposed Pad Size

 

 

 

 

 

L

0.45

0.60

0.75

Lead Foot Length

 

 

 

 

 

b

0.13

0.18

0.23

Lead Width

 

 

 

 

 

c

0.09

-

0.20

Lead Foot Thickness

 

 

 

 

 

e

 

0.40 BSC

 

Lead Pitch

 

 

 

 

 

ddd

0.00

-

0.07

True Position Spread

 

 

 

 

 

ccc

-

-

0.08

Coplanarity

 

 

 

 

 

Notes:

1.All dimensions are in millimeters unless otherwise noted.

2.Dimensions b & c apply to the flat section of the lead foot between 0.10 and 0.25mm from the lead tip. The base metal is exposed at the lead tip.

3.Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch.

4.Dimensions D2 and E2 represent the size of the exposed pad. The exposed pad shall be coplanar with the bottom of the package within 0.05mm.

5.The pin 1 identifier may vary, but is always located within the zone indicated

.

Figure 16.4 LAN9312 128-XVTQFP Recommended PCB Land Pattern

SMSC LAN9312

457

Revision 1.4 (08-19-08)

 

DATASHEET