9 PACKAGE
9 Package
9.1 Plastic Package
| ±0.1 |
max | 1.4 |
| |
1.7 |
|
0.1 |
(Unit: mm)
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| 22±0.4 |
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| 20±0.1 |
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| |
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| 108 | 73 |
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109 |
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| 72 |
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±0.1 | ±0.4 |
20 | 22 |
INDEX |
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|
144 |
| 37 |
1 |
| 36 |
0.5 | 0.2 | +0.1 |
+0.05
0°
10°
0.5±0.2
1
Limit of power consumption
The chip temperature of an LSI rises according to power consumption. The chip temperature can be calculated from environment temperature (Ta), thermal package resistance (θ) and power consumption (PD).
Chip temperature (Tj) = Ta + (PD ⋅ θ) (°C)
As a guide, normally keep the chip temperature (Tj) lower than 85°C.
The thermal resistance of the
Thermal resistance (°C/W) = 110 to 120°C (90 to 100°C for Cu lead frame)
This thermal resistance is a value under the condition that the measured device is hanging in the air and has no
S1C33L03 PRODUCT PART | EPSON |