PHYSICAL DESIGN AND DEBUGGING

(Parasitic

Parasitic

C T Capacitance)

Capacitance J C

 

I

 

Chassis Ground

231732i11-22

Figure 11-22. Typical Layout

(which reduces its effective impedance), this noise can be minimized. This technique also provides a secondary advantage in that it forms a shield which reduces the emissions of other circuit traces, particularly in multi-layer circuit boards.

The impedances Z2through Z4 depend upon thickness of copper pc-board foil, the circuit switching speeds, and the effective lengths of the traces. The current flowing through these common impedance paths radiates more noise as its value increases. The amount of voltage generated by these switching currents and multiplied by the imped- ance is difficult to predict.

An effective way of reducing EMI is to decouple the power supply by adding bypass capacitors between Vee and ground. This technique is similar to the general technique discussed earlier (the goal of the previous technique was to maintain correct logic levels).

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Image 238
Intel 386 manual Typical Layout