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MELSEC-Q
4 INSTALLATION, WIRING AND MAINTENANCE OF THE PRODUCT
[2] Other precautions(1) Main body
•The main body case is made of plastic. Take c are not to drop or apply
strong impacts onto the case.
•Do not remove the QD75 PCB from the case. Fail ure to observe this
could lead to faults.
(2) Cable
•Do not press on the cable with a sharp object.
•Do not twist the cable with force.
•Do not forcibly pull on the cable.
•Do not step on the cable.
•Do not place objects on the cable.
•Do not damage the cable sheath.
(3) Installation environment
Do not install the module in the following t ype of environment.
•Where the ambient temperature exceeds the 0 to 55°C range.
•Where the ambient humidity exceeds the 5 to 9 5%RH range.
•Where there is sudden temperature changes, or where dew condenses.
•Where there is corrosive gas or flammable g as.
•Where there are high levels of dust, conduct ive powder, such as iron
chips, oil mist, salt or organic solvents.
•Where the module will be subject to direct sunli ght.
•Where there are strong electric fields or magn etic fields.
•Where vibration or impact could be directl y applied onto the main body.